Electronically insulating thermal connector having a low thermal resistivity
A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a first end of the body. At least one second terminal formed over a second end of the body. The second end of the body can be opposite the first end of the body in an X-direction. The heat sink component can have a length in the X-direction and a width in a Y-direction that is parallel with the top surface and perpendicular to the X-direction. A ratio of the width to the length can be greater than about 1.
1 . A heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive;
a plurality of first terminals formed over a first end of the body, the plurality of first terminals electrically distinct from each other and spaced apart from each other in a Y-direction, each first terminal of the plurality of first terminals formed over at least two surfaces of the body; and
a plurality of second terminals formed over a second end of the body, the plurality of second terminals electrically distinct from each other and spaced apart from each other in the Y-direction, the second end of the body being opposite the first end of the body in an X-direction, each second terminal of the plurality of second terminals formed over at least two surfaces of the body,
wherein one or more conductive traces are connected between a pair of first terminals of the plurality of first terminals and one or more conductive traces connected between at least one first terminal of the plurality of first terminals and at least one second terminal of the plurality of second terminals,
wherein the plurality of second terminals includes a heat sink terminal, the heat sink terminal free of electrical connections,
wherein the heat sink component has a length in the X-direction and a width in the Y-direction that is parallel with a top surface of the body and perpendicular to the X-direction, and
wherein a ratio of the width to the length is greater than about 1.
2 . The heat sink component of claim 1 , wherein the plurality of first terminals are each formed over the top surface and a first end surface of the first end of the body.
3 . The heat sink component of claim 1 , wherein the plurality of second terminals are each formed over the top surface and a second end surface of the second end of the body.
4 . The heat sink component of claim 1 , further comprising at least one thin film component connected with at least one first terminal of the plurality of first terminals.
5 . The heat sink component of claim 4 , wherein the at least one thin film component is connected between the at least one first terminal of the plurality of first terminals and at least one second terminal of the plurality of second terminals.
6 . The heat sink component of claim 4 , wherein the at least one thin film component is connected between respective terminals of the plurality of first terminals.
7 . The heat sink component of claim 4 , wherein the at least one thin film component comprises one or more of a resistor, varistor, capacitor, or inductor.
8 . The heat sink component of claim 1 , wherein the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.
9 . The heat sink component of claim 1 , wherein the heat sink component comprises aluminum nitride or beryllium oxide.
10 . A component assembly comprising:
a circuit board;
a heat sink component mounted to the circuit board, the heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive;
a plurality of first terminals formed over a first end of the body, the plurality of first terminals electrically distinct from each other, the plurality of first terminals each formed over the top surface and a first end surface of the first end of the body; and
a plurality of second terminals formed over a second end of the body, the plurality of second terminals electrically distinct from each other and spaced apart from each other in the Y-direction, the second end of the body being opposite the first end of the body in an X-direction,
wherein one or more conductive traces are connected between a pair of first terminals of the plurality of first terminals and one or more conductive traces connected between at least one first terminal of the plurality of first terminals and at least one second terminal of the plurality of second terminals,
wherein the plurality of second terminals includes a heat sink terminal, the heat sink terminal free of electrical connections on the body of the heat sink component,
wherein the heat sink component has a length in the X-direction and a width in a Y-direction that is parallel with a top surface of the body and perpendicular to the X-direction, and
wherein a ratio of the width to the length is greater than about 1;
a plurality of discrete electrical components mounted to the circuit board separate from the heat sink component and respectively individually connected with a respective first terminal of the plurality of first terminals; and
a circuit board heat sink terminal connected with the heat sink terminal of the plurality of second terminals.
11 . The component assembly of claim 10 , wherein the heat sink component further comprises at least one thin film component connected with a first terminal of the plurality of first terminals.
12 . The component assembly of claim 11 , wherein the at least one thin film component is connected between at least one first terminal of the plurality of first terminals and at least one second terminal of the plurality of second terminals.
13 . The component assembly of claim 11 , wherein the at least one thin film component is connected between respective terminals of the plurality of first terminals.
14 . The component assembly of claim 11 , wherein the at least one thin film component comprises one or more of a resistor, varistor, capacitor, or inductor.
15 . The component assembly of claim 10 , wherein the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.
16 . The component assembly of claim 10 , wherein the heat sink component comprises aluminum nitride.
17 . The component assembly of claim 10 , wherein the heat sink component comprises beryllium oxide.
18 . A component assembly comprising:
a circuit board;
a heat sink component mounted to the circuit board, the heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive;
a first terminal, a second terminal, and a third terminal formed on the body;
a conductive trace electrically connecting the first terminal with the third terminal; and
at least one thin film component connected between the first terminal and the third terminal,
wherein the second terminal is free of electrical connections on the body of the heat sink component,
wherein the body conducts heat away from at least one of the first terminal, the second terminal, or the third terminal;
a plurality of discrete electrical components mounted to the circuit board separate from the heat sink component, a first discrete electrical component of the plurality of discrete electrical components connected with the first terminal and a second discrete electrical component of the plurality of discrete electrical components connected with the third terminal; and
a discrete heat sink terminal mounted to the circuit board separate from and adjacent to the heat sink component, the discrete heat sink terminal connected with the second terminal.
19 . The component assembly of claim 18 , wherein the at least one thin film component comprises one or more of a resistor, varistor, capacitor, or inductor.
20 . The component assembly of claim 18 , wherein the body of the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.
21 . The component assembly of claim 18 , wherein the body of the heat sink component comprises aluminum nitride.
22 . The component assembly of claim 18 , wherein the body of the heat sink component comprises beryllium oxide.
23 . The component assembly of claim 18 , further comprising a fourth terminal formed on the body of the heat sink component, wherein the fourth terminal is free of connections with the first terminal, second terminal, or third terminal.
24 . The component assembly of claim 18 , further comprising a fourth terminal formed on the body of the heat sink component, wherein the fourth terminal is free of connections with the at least one thin film component.
25 . The component assembly of claim 18 , wherein the heat sink component has a length in the X-direction and a width in a Y-direction that is parallel with a top surface of the body and perpendicular to the X-direction, wherein a ratio of the width to the length is greater than about 1, and wherein at least two of the first terminal, the second terminal, and the third terminal are spaced apart from one another along the width of the heat sink component.
26 . The heat sink component of claim 1 , wherein the heat sink component further comprises:
a conductive layer formed over a bottom surface of the body, the conductive layer spaced apart from both the first end and the second end of the body, the conductive layer extending along the width of the heat sink component from a first side of the body to a second side of the body, the first side and the second side extending between the first end and the second end of the body,
wherein the bottom surface is opposite the top surface of the body along a Z-direction that is perpendicular to both the X-direction and the Y-direction.
27 . The heat sink component of claim 26 , wherein the conductive layer is configured as a stripline that extends from the first side to the second side of the body.
28 . The heat sink component of claim 1 , wherein the heat sink terminal is disposed midway along the second end of the body between a pair of second terminals.
29 . The component assembly of claim 10 , wherein the circuit board heat sink terminal is a discrete component mounted to the circuit board adjacent to the heat sink component.