Semiconductor device with an oxide semiconductor having a plurality of openings
According to one embodiment, a semiconductor device includes a substrate, a first insulating layer disposed on the substrate, an oxide semiconductor disposed on the first insulating layer and formed in an island shape, a second insulating layer covering the oxide semiconductor, a gate electrode disposed on the second insulating layer, and a source electrode and a drain electrode in contact with the oxide semiconductor. The oxide semiconductor includes a plurality of first openings located between the gate electrode and the source electrode, and a plurality of second openings located between the gate electrode and the drain electrode, in planar view.
1 . A semiconductor device comprising:
a substrate;
a first insulating layer disposed on the substrate;
an oxide semiconductor disposed on the first insulating layer and formed in an island shape;
a second insulating layer covering the oxide semiconductor;
a gate electrode disposed on the second insulating layer; and
a source electrode and a drain electrode in contact with the oxide semiconductor, wherein
the oxide semiconductor includes
a channel area overlapping the gate electrode,
a first area which is connected to the channel area, is in contact with the source electrode, and includes a plurality of first openings located between the gate electrode and the source electrode, and
a second area which is connected to the channel area, is in contact with the drain electrode, and includes a plurality of second openings located between the gate electrode and the drain electrode,
each of the first openings is surrounded by the oxide semiconductor,
each of the second openings is surrounded by the oxide semiconductor, and
the second insulating layer overlaps the channel area, the first area and the second area, and is in contact with the first insulating layer in the plurality of first openings and the plurality of second openings.
2 . The semiconductor device of claim 1 , wherein
the plurality of first openings and the plurality of second openings do not overlap the gate electrode in planar view.
3 . The semiconductor device of claim 2 , wherein
the plurality of first openings and the plurality of second openings are arranged in a first direction and are disposed symmetrically with the gate electrode sandwiched therebetween.
4 . A semiconductor device comprising:
a substrate;
a first insulating layer disposed on the substrate;
an oxide semiconductor disposed on the first insulating layer and formed in an island shape;
a second insulating layer covering the oxide semiconductor;
a gate electrode disposed on the second insulating layer; and
a source electrode and a drain electrode in contact with the oxide semiconductor, wherein
the oxide semiconductor includes
a channel area overlapping the gate electrode,
a first area which is connected to the channel area and is in contact with the source electrode, and
a second area which is connected to the channel area and is in contact with the drain electrode,
at least one of the first area and the second area includes a plurality of openings,
each of the openings is surrounded by the oxide semiconductor,
the second insulating layer overlaps the channel area, the first area and the second area, and is in contact with the first insulating layer in the plurality of openings, and
a distance to a position farthest from each of the plurality of openings is less than 10 μm in the channel area.
5 . The semiconductor device of claim 4 , wherein
the distance is 5 μm or less.
6 . The semiconductor device of claim 4 , wherein
the oxide semiconductor includes a first edge intersecting the gate electrode, and a second edge intersecting the gate electrode on a side opposite to the first edge, and
a width from the first edge to the second edge in the channel area is 10 μm or more.