IP Library Granted Patent US 11,870,318
Granted Patent B2
US 11,870,318 · App. 17/894,791 · Granted Jan 9, 2024

Homopolar linear synchronous machine

Inventors: Alexander Jedinger (Los Angeles, CA); Arbi Gharakhani Siraki (Los Angeles, CA); Erik Johnson (Los Angeles, CA); Shahriyar Beizaee (Los Angeles, CA); Rachel Ozer (Los Angeles, CA); Ju Hyung Kim (Los Angeles, CA)
Assignee: HYPERLOOP TECHNOLOGIES, INC.
H02K41/03G01R33/3856H02K1/20H02K3/04H02K3/22H02K3/24H02K9/22H02K15/02H02K19/10
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Quick Facts
Patent No.
US 11,870,318
App. No.
17/894,791
Granted
Jan 9, 2024
Kind
B2
Abstract

Homopolar linear synchronous machines are provided herein that include a mover device. The mover device includes a cold plate with ferromagnetic cores extending through slots in the cold plate. Layers of armature coils are located around the ferromagnetic cores on opposite sides of the cold plate. The mover device further includes at least one field coil.

Claims (24)

1. A mover device comprising:

a cold plate comprising: a movement axis; and slots therethrough arranged along the movement axis;

ferromagnetic cores extending through the slots;

first armature coils located around the ferromagnetic cores at a first side of the cold plate;

second armature coils located around the ferromagnetic cores at a second side of the cold plate opposite the first side of the cold plate; and

at least one field coil around one or more of the first armature coils and the second armature coils,

wherein the first armature coils and the second armature coils are arranged in groups respectively, the groups of first armature coils being operable at a relative phase with respect to the second armature coils.

2. The mover device of claim 1 , wherein the first armature coils and the second armature coils are substantially symmetrical with each other, with respect to the cold plate therebetween.

3. The mover device of claim 1 , wherein the first armature coils and the second armature coils are in communication with at least one armature controller configured to control the first armature coils and the second armature coils as a multi-phase electrical device such that the first armature coils, the second armature coils and the ferromagnetic cores are controlled to form at least one magnetic pole pair.

4. The mover device of claim 3 , wherein the at least one armature controller is in communication with a position sensor configured to determine a position used to control a respective position of the at least one magnetic pole pair.

5. The mover device of claim 1 , wherein the at least one field coil is in communication with at least one field coil controller configured to control the at least one field coil to form a loop of magnetic flux about perpendicular to the movement axis of the cold plate.

6. The mover device of claim 1 , further comprising at least one retention device configured to retain the first armature coils and the second armature coils between the ferromagnetic cores.

7. The mover device of claim 6 , wherein the at least one retention device includes one or more of a slot wedge and a ripple spring.

8. The mover device of claim 1 , further comprising a plurality of cold plates, including the cold plate, and a plurality of armature coils, including the first armature coils and the second armature coils, the plurality of cold plates and the plurality of armature coils arranged such that a given cold plate is between a pair of armature coils.

9. The mover device of claim 1 , further comprising one or more spacer blocks between the ferromagnetic cores and between respective armature coils located around the ferromagnetic cores, the one or more spacer blocks configured to conduct heat from one or more of the ferromagnetic cores and the respective armature coils to the cold plate.

10. The mover device of claim 1 , wherein about equal portions of the ferromagnetic cores are located at each of the first side and the second side of the cold plate.

11. The mover device of claim 1 , wherein the cold plate further comprises a non-ferromagnetic material.

12. The mover device of claim 1 , wherein the cold plate further comprises slits configured to one or more of: interrupt conductive paths in the cold plate; and reduce eddy currents in the cold plate.

13. The mover device of claim 1 , wherein the cold plate includes cooling channels.

14. The mover device of claim 1 , further comprising an electrically insulating material encapsulating at least a portion of one or more of the cold plate, the ferromagnetic cores, the first armature coils, the second armature coils and the at least one field coil.

15. The mover device of claim 14 , wherein at least a portion of the electrically insulating material is coated with one or more of a conductive material and a semi-conductive material.

16. The mover device of claim 1 , further comprising a reinforcement member which runs along an edge of the cold plate.

17. The mover device of claim 16 , wherein the edge of the cold plate, along which the reinforcement member runs, includes slits configured to reduce eddy currents.

18. The mover device of claim 1 , further comprising one or more attachment units configured to attach the mover device to a payload.

Assignments (2)
CHANGE OF NAME Recorded Aug 29, 2025
From: HYPERLOOP TECHNOLOGIES, INC.
To: DP WORLD LOGISTICS US HOLDINGS, INC.
Reel/Frame 072757/0363 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2022
From: JEDINGER, ALEXANDER; GHARAKHANI SIRAKI, ARBI; JOHNSON, ERIK; BEIZAEE, SHAHRIYAR; OZER, RACHEL; KIM, JU HYUNG
To: HYPERLOOP TECHNOLOGIES, INC.
Reel/Frame 060891/0207 →