Integrated photonics assemblies
Disclosed herein are integrated photonics assemblies, circuits, systems and methods therefor. The systems can include a first integrated photonics assembly having a first functionality, in which the first assembly includes a plurality of modular photonic integrated subcircuits. Each subcircuit can be pre-fabricated and can be configured to transfer light to and receive light from another subcircuit based on the first functionality. An output port of a first subset of the subcircuits can be configured to be aligned with an input port of a second subset of the subcircuits. At least one subcircuit can be configured to be removed from the first integrated photonics assembly and connected to a second integrated photonics assembly having a second functionality. The first integrated photonics assembly can be different from the second integrated photonics assembly and the first functionality can be different from the second functionality.
1 . A system comprising:
a first assembly comprising a first integrated photonics assembly having a first functionality, the first assembly comprising:
a plurality of subcircuits comprising a plurality of modular photonic integrated subcircuits, wherein:
each subcircuit is pre-fabricated and is configured to transfer light to and receive light from another subcircuit based on the first functionality;
an output port of a first subset of the plurality of subcircuits is configured to be aligned with an input port of a second subset of the plurality of subcircuits;
the input port and the output port are optical ports wherein light is transferred from the output port to the input port with a coupling efficiency greater than 90%; and
at least one subcircuit is configured to be removed from the first integrated photonics assembly and connected to a second integrated photonics assembly having a second functionality, the first integrated photonics assembly different from the second integrated photonics assembly and the first functionality different from the second functionality.
2 . The system of claim 1 , wherein each subcircuit of a subset of the plurality of subcircuits is configured to be optically coupled to at least two other subcircuits of the plurality of subcircuits.
3 . The system of claim 1 , wherein the plurality of subcircuits is arranged in a two-dimensional array such that a first dimension of the two-dimensional array includes at least two subcircuits and a second dimension of the two-dimensional array includes at least two subcircuits.
4 . The system of claim 1 , wherein each subcircuit has a first length in a first dimension of the subcircuit and a second length in a second dimension of the subcircuit.
5 . The system of claim 1 , wherein a first subcircuit is disposed relative to a second subcircuit such that at least one of:
(a) the first subcircuit is disposed immediately adjacent to and co-planar with the second subcircuit; or
(b) the first subcircuit overlaps with the second subcircuit.
6 . The system of claim 1 , further comprising:
an optical fiber configured to carry optical signals between a subcircuit of the plurality of subcircuits and an external device.
7 . The system of claim 1 , wherein at least two subcircuits are configured to transfer and receive light via butt-coupling.
8 . The system of claim 7 , wherein at least one additional subcircuit is configured to transfer and receive light to one of the at least two subcircuits via at least one of:
(i) one or more optical fibers;
(ii) one or more photonic wirebonds;
(iii) a free-space optical train;
(iv) adiabatic coupling; or
(v) out-of-plane coupling.
9 . The system of claim 1 , wherein at least two subcircuits are configured to transfer and receive light via at least one of:
(i) butt-coupling;
(ii) one or more optical fibers;
(iii) one or more photonic wirebonds;
(iv) a free-space optical train;
(v) adiabatic coupling; or
(vi) out-of-plane coupling.
10 . The system of claim 1 , further comprising a plurality of monitoring circuits, wherein:
each monitoring circuit is coupled to a respective one of a subset of the plurality of subcircuits, each monitoring circuit comprises a first light path between an input and an output of the subcircuit, and each monitoring circuit is configured to monitor optical loss in the first light path.
11 . The system of claim 10 , wherein, based on the monitored optical loss, at least one monitoring circuit of the plurality of monitoring circuits is configured to determine at least one of (i) a coupling efficiency or (ii) a degree of alignment between a respective subcircuit and another subcircuit immediately adjacent to the respective subcircuit.
12 . The system of claim 10 , wherein each monitoring circuit comprises a second light path configured to monitor light transferred in an opposite direction from light transferred in the first light path.
13 . The system of claim 10 , further comprising a second plurality of monitoring circuits, wherein:
each second monitoring circuit is coupled to the respective one of the subset of the plurality of subcircuits, each second monitoring circuit comprises a light path between an input and an output of the subcircuit, and each second monitoring circuit is configured to monitor optical loss in the light path.
14 . The system of claim 10 , further comprising:
a fiber optic array configured to transfer light via an optical path to at least one monitoring circuit of the plurality of monitoring circuits.
15 . The system of claim 1 , further comprising a receptacle configured align at least two subcircuits of the plurality of subcircuits.
16 . The system of claim 15 , wherein a surface of the receptacle comprises at least one alignment feature, the at least one alignment feature configured to effectuate alignment between a first subcircuit and a second subcircuit of the at least two subcircuits.
17 . The system of claim 16 , wherein the at least one alignment feature effectuates at least one of (a) a lateral alignment, (b) a vertical alignment, or (c) an angular alignment between a first subcircuit and a second-subcircuit of the at least two subcircuits.
18 . The system of claim 16 , wherein a surface of each of the at least two subcircuits forms a cavity configured to receive the at least one alignment feature of the receptacle.
19 . The system of claim 18 , wherein the cavity is a deep etch, a V-groove, or an oxide open.
20 . A system comprising:
a first assembly comprising a first integrated photonics assembly having a first functionality, the first assembly comprising:
a plurality of subcircuits comprising a plurality of modular photonic integrated subcircuits, wherein:
each subcircuit is pre-fabricated and is configured to transfer light to and receive light from another subcircuit based on the first functionality;
an output port of a first subset of the plurality of subcircuits is configured to be aligned with an input port of a second subset of the plurality of subcircuits;
for the first subset of the plurality of subcircuits, the output port is configured at a particular position along a first edge of the first subset, and for the second subset of the plurality of subcircuits, the input port is configured at a particular position along a second edge of the second subset; and
at least one subcircuit is configured to be removed from the first integrated photonics assembly and connected to a second integrated photonics assembly having a second functionality, the first integrated photonics assembly different from the second integrated photonics assembly and the first functionality different from the second functionality.
21 . The system of claim 20 , wherein each subcircuit of a subset of the plurality of subcircuits is configured to be optically coupled to at least two other subcircuits of the plurality of subcircuits.
22 . The system of claim 20 , wherein the plurality of subcircuits is arranged in two-dimensional array such that a first dimension of the two-dimensional array includes at least two subcircuits and a second dimension of the two-dimensional array includes at least two subcircuits.
23 . The system of claim 20 , wherein each subcircuit has a first length in a first dimension of the subcircuit and a second length in a second dimension of the subcircuit.
24 . A system comprising:
a first assembly comprising a first integrated photonics assembly having a first functionality, the first assembly comprising:
a plurality of subcircuits comprising a plurality of modular photonic integrated subcircuits, wherein:
each subcircuit is pre-fabricated and is configured to transfer light to and receive light from another subcircuit based on the first functionality;
an output port of a first subset of the plurality of subcircuits is configured to be aligned with an input port of a second subset of the plurality of subcircuits;
at least two subcircuits are configured to transfer and receive light via butt-coupling; and
at least one subcircuit is configured to be removed from the first integrated photonics assembly and connected to a second integrated photonics assembly having a second functionality, the first integrated photonics assembly different from the second integrated photonics assembly and the first functionality different from the second functionality.
25 . The system of claim 24 , wherein each subcircuit of a subset of the plurality of subcircuits is configured to be optically coupled to at least two other subcircuits of the plurality of subcircuits.
26 . The system of claim 24 , wherein the plurality of subcircuits is arranged in two-dimensional array such that a first dimension of the two-dimensional array includes at least two subcircuits and a second dimension of the two-dimensional array includes at least two subcircuits.
27 . The system of claim 24 , wherein each subcircuit has a first length in a first dimension of the subcircuit and a second length in a second dimension of the subcircuit.
28 . A system comprising:
a first assembly comprising a first integrated photonics assembly having a first functionality, the first assembly comprising:
a plurality of subcircuits comprising a plurality of modular photonic integrated subcircuits, wherein:
each subcircuit is pre-fabricated and is configured to transfer light to and receive light from another subcircuit based on the first functionality;
an output port of a first subset of the plurality of subcircuits is configured to be aligned with an input port of a second subset of the plurality of subcircuits; and
at least one subcircuit is configured to be removed from the first integrated photonics assembly and connected to a second integrated photonics assembly having a second functionality, the first integrated photonics assembly different from the second integrated photonics assembly and the first functionality different from the second functionality; and
a plurality of monitoring circuits, wherein:
each monitoring circuit is coupled to a respective one of a subset of the plurality of subcircuits;
each monitoring circuit comprises a first light path between an input and an output of the subcircuit; and
each monitoring circuit is configured to monitor optical loss in the first light path.
29 . The system of claim 28 , wherein each subcircuit of a subset of the plurality of subcircuits is configured to be optically coupled to at least two other subcircuits of the plurality of subcircuits.
30 . The system of claim 28 , wherein the plurality of subcircuits is arranged in two-dimensional array such that a first dimension of the two-dimensional array includes at least two subcircuits and a second dimension of the two-dimensional array includes at least two subcircuits.
31 . The system of claim 28 , wherein each subcircuit has a first length in a first dimension of the subcircuit and a second length in a second dimension of the subcircuit.