Coupon wafer and method of preparation thereof
A coupon wafer comprising a device coupon ( 110 ) for use in a micro-transfer printing process used to fabricate an optoelectronic device. The coupon wafer includes a wafer substrate ( 124 ), and the device coupon ( 110 ) is attached to the wafer substrate via a tether ( 122 ) and the tether ( 122 ) is formed from a dielectric material.
1 . A coupon wafer comprising a device coupon for use in a micro-transfer printing process used to fabricate an optoelectronic device,
wherein the coupon wafer includes a wafer substrate, and the device coupon is attached to the wafer substrate via a tether; and
wherein the tether comprises a dielectric material,
wherein the wafer substrate defines a raised platform, below the device coupon, and has a channel adjacent to the raised platform,
wherein the tether comprises:
a first portion extending laterally along a top surface of the device coupon;
a second portion extending from the first portion and vertically along a side surface of the device coupon;
a third portion extending from the second portion and laterally away from a bottom of the device coupon;
a fourth portion extending from the third portion and vertically along a side surface of the raised platform; and
a fifth portion extending from the fourth portion and laterally along a floor of the channel,
wherein the tether is a multi-layered tether comprising at least one of a layer of silicon nitride or a layer of silicon oxide,
wherein the tether has a thickness of at least 20 nm and no more than 500 nm,
wherein the tether includes a plurality of apertures therethrough, and
wherein a gap is defined directly between a top surface of the raised platform and the device coupon, and directly between the top surface of the raised platform and the third portion of the tether.
2 . The coupon wafer of claim 1 , wherein the tether includes: the layer of silicon nitride and a layer of photoresist; the layer of silicon oxide and a layer of photoresist; or the layer of silicon nitride, the layer of silicon oxide, and a layer of photoresist.
3 . The coupon wafer of claim 1 , wherein the device coupon includes an anti-reflective coating, and the tether is at least partially provided by the anti-reflective coating.
4 . A method of preparing the coupon wafer of claim 1 , wherein the method comprises:
depositing the tether across a surface of the device coupon to attach the device coupon to the wafer substrate.
5 . A method of micro-transfer printing, using the coupon wafer of claim 1 , comprising steps of:
adhering the device coupon to a stamp, and lifting it away from the coupon wafer; and
depositing the device coupon on a platform wafer, thereby forming an optoelectronic device.