MFC in pressboards for HV devices
A pressboard for high-voltage devices is disclosed. The pressboard has a density of 0.6-1.3 g/cm 3 according to IEC60641-2, and includes 1-15% microfibrillated cellulose (MFC) based on the total dry weight of the pressboard. The pressboard also includes an insulation element. For example, the pressboard is impregnated with an electrically insulating compound. The insulation element may be used in a high-voltage device, such as a power transformer.
1. An insulation element comprising a pressboard for high-voltage devices, the pressboard
having a density of 0.6-1.3 g/cm 3 ,
comprising 1-15% microfibrillated cellulose (MFC) based on a total dry weight of the pressboard, and
having a thickness of 0.8-10 millimeters (mm),
wherein the MFC is homogenously distributed in the pressboard,
wherein the pressboard is impregnated with an electrically insulating compound, and
wherein a ratio of a permittivity of the pressboard in mineral oil and a permittivity of the mineral oil is within a range of
and/or
a ratio of a permittivity of the pressboard in ester oil and a permittivity of the ester oil is within a range of 1-1.35.
2. The insulating element according to claim 1 , wherein the pressboard comprises 1-10% MFC based on the total dry weight of the pressboard.
3. The insulating element according to claim 1 , wherein the pressboard has the density 0.8-1.2 g/cm 3 .
4. The insulating element according to claim 1 , wherein the pressboard comprises a plurality of pressboard layers.
5. The insulating element according to claim 4 , wherein all of the plurality of pressboard layers comprise MFC.
6. The insulation element according to claim 1 , wherein the electrically insulating compound is or comprises an oil and/or an ester-based liquid.
7. The insulation element according to claim 6 , wherein the oil comprises mineral oil.
8. The insulation element according to claim 1 , wherein the electrically insulating compound comprises a cured resin, such as an epoxy-based resin, a polyester-based resin or a phenolic resin, or a combination thereof.
9. The insulation element according to claim 1 , wherein direct current, DC, and/or alternating current, AC, and/or lightning impulse, LI, and/or switching impulse, SI, electrical breakdown Weibull α-value of the pressboard is 5-50% higher compared with a corresponding insulation element being free of MFC.
10. The insulation element according to claim 9 , wherein the electrical breakdown Weibull α-value of the pressboard is 15-50% higher compared with the corresponding insulation element being free of MFC.
11. The insulation element according to claim 10 , wherein the electrical breakdown Weibull α-value of the pressboard is 30-50% higher compared with the corresponding insulation element being free of MFC.
12. The insulation element according to claim 1 , wherein direct current, DC, and/or alternating current, AC, and/or lightning impulse, LI, and/or switching impulse, SI, electrical breakdown Weibull β-value of the pressboard is above 7.
13. The insulation element according to claim 12 , wherein the electrical breakdown Weibull β-value of the pressboard is above 9.
14. The insulation element according to claim 13 , wherein the electrical breakdown Weibull β-value of the pressboard is above 12.
15. Use of an insulation element according to claim 1 in a high-voltage device.
16. A high-voltage device comprising the insulation element of claim 1 , wherein the high-voltage device comprises a power transformer.
17. The high-voltage device of claim 16 , wherein the power transformer comprises a liquid-filled power transformer.
18. The insulation element according to claim 1 , wherein the electrically insulating compound comprises a liquid or a resin.
19. The insulation element according to claim 18 , wherein the electrically insulating compound comprises a cured resin.