Power module device with an embedded power semiconductor device
In one embodiment, a power module device includes a base plate, an electrically insulating ceramic layer on the base plate, and an electrically insulating first insulating layer on the ceramic layer. The first insulating layer includes a prepreg material. An electrically conductive lead frame is disposed on the first insulating layer and electrically insulated therefrom. A power semiconductor device disposed on the lead frame and embedded between the lead frame and a second insulating layer.
1 . A power module device comprising:
a base plate;
an electrically insulating ceramic layer arranged on the base plate;
an electrically insulating first insulating layer arranged on the ceramic layer opposite from the base plate, wherein the first insulating layer comprises a prepreg material and wherein a layer thickness of the first insulating layer is less than 100 μm;
an electrically conductive lead frame arranged on the first insulating layer, the lead frame being electrically insulated from the base plate by the ceramic layer and the first insulating layer;
a power semiconductor device disposed on the lead frame; and
an electrically insulating second insulating layer arranged on the power semiconductor device and the lead frame so that the power semiconductor device is embedded between the lead frame and the second insulating layer.
2 . The power module device according to claim 1 , wherein the first insulating layer is in direct contact with the lead frame.
3 . The power module device according to claim 1 , wherein the base plate comprises an electrically conductive material.
4 . The power module device according to claim 1 , wherein the second insulating layer comprises a prepreg material.
5 . The power module device according to claim 1 , wherein the layer thickness of the first insulating layer is less than 70 μm.
6 . The power module device according to claim 1 , wherein the ceramic layer has a thermal conductivity above 20 W/(m×K).
7 . The power module device according to claim 1 , wherein a recess is formed in the lead frame on a side opposite to the first insulating layer and wherein at least a portion of the power semiconductor device is arranged in the recess.
8 . The power module device according to claim 1 , wherein a layer thickness of the ceramic layer is 200 μm or less.
9 . The power module device according to claim 1 , wherein a layer thickness of the ceramic layer is in a range from 50 μm and 100 μm.
10 . The power module device according to claim 1 , wherein the power semiconductor device comprises a semiconductor chip having a metallization layer disposed on a bottom side, the metallization layer being electrically connected to the lead frame.
11 . The power module device according to claim 1 , wherein the power semiconductor device comprises at least one of an insulated gate bipolar transistor, a thyristor, a metal-insulator-semiconductor field effect transistor, a metal-oxide-semiconductor field effect transistor, a junction field effect transistor, a diode, or a Schottky diode.
12 . The power module device according to claim 1 , further comprising an adhesion layer between the ceramic layer and the first insulating layer, wherein the adhesion layer comprises a metal layer.
13 . The power module device according to claim 12 , wherein a layer thickness of the adhesion layer is less than 25 μm.
14 . The power module device according to claim 12 , wherein the first insulating layer is in direct contact with the adhesion layer.
15 . The power module device according to claim 1 , wherein the first insulating layer is in direct contact with the ceramic layer.
16 . A method for manufacturing the power module device of claim 1 , the method comprising:
attaching the power semiconductor device to the lead frame;
forming the electrically insulating ceramic layer on the base plate;
forming a layer stack by arranging the first insulating layer over the base plate with the ceramic layer formed thereon, arranging the lead frame with the power semiconductor device attached thereto over the first insulating layer, and arranging a second insulating layer over the lead frame; and
applying heat and pressure to the layer stack.
17 . The method according to claim 16 , wherein attaching the power semiconductor device to the lead frame comprises electrically connecting a metallization layer of a semiconductor chip of the power semiconductor device to the lead frame.
18 . The method according to claim 16 , wherein the ceramic layer is adhered to the first insulating layer with a metal adhesion layer.
19 . A power module device comprising:
a copper base plate;
an electrically insulating ceramic layer arranged on the base plate, wherein a layer thickness of the ceramic layer is 70 μm or less;
an electrically insulating first insulating layer arranged on the ceramic layer, wherein the first insulating layer comprises a prepreg material and wherein a layer thickness of the first insulating layer is less than 100 μm;
an electrically conductive lead frame arranged on the first insulating layer, the lead frame being electrically insulated from the base plate by the ceramic layer and the first insulating layer;
a power semiconductor device disposed on the lead frame; and
an electrically insulating second insulating layer arranged on the power semiconductor device, wherein the second insulating layer comprises a prepreg material.
20 . The power module device according to claim 19 , wherein the ceramic layer has a thermal conductivity above 20 W/(m×K).