IP Library Patent Application 17924943
Patent Application
App. No. 17/924,943

HIGH TEMPERATURE LOW OUTGAS FLUORINATED THERMAL INTERFACE MATERIAL

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Patent No.
US None
App. No.
17/924,943
Abstract

A high temperature low outgas thermal interface material is provided. The thermal interface material includes a plurality of heat conducting particles dispersed within a fluorine containing fluid such as perfluoropolyether. The high temperature low outgas thermal interface material provides thermal conductivity between a heat source and a heat sink at temperatures greater than 200° C.

Claims (32)

1 . A low outgas high temperature thermal interface material comprising:

a heat conductive material dispersed within a perfluoropolyether (PFPE) fluid, wherein the heat conductive material comprises a plurality of heat conductive particles, wherein the surface of the plurality of heat conductive particles is modified with a fluorine containing surface treatment agent, and wherein the thermal interface material comprises between 55% and 90% heat conductive material by weight.

2 . (canceled)

3 . The thermal interface material of claim 1 , wherein the thermal interface material comprises at least 85% heat conductive particles by weight.

4 . The thermal interface material of claim 1 , wherein the thermal interface material comprises between 10% and 45% PFPE fluid by weight

5 . The thermal interface material of claim 1 , wherein the thermal interface material loses less than about 1% of total mass during ASTM D972 or ASTM D2595 protocol testing.

6 . The thermal interface material of claim 1 , wherein the thermal interface material outgasses less than 0.6% of total mass after 72 hours of exposure to a temperature of at least 200° C.

7 . The thermal interface material of claim 1 , wherein the thermal interface material is a liquid.

8 . The thermal interface material of claim 1 , wherein the surface treatment agent comprises a fluorine containing moiety.

9 . The thermal interface material of claim 1 , wherein the surface treatment agent is covalently bound to the surface of the heat conductive particles and wherein the surface treatment agent comprises a PFPE moiety.

10 . The thermal interface material of claim 1 , wherein the surface treatment agent is covalently bound to the heat conductive particle and wherein the surface treatment agent comprises a PFPE moiety and a silane moiety.

11 . The thermal interface material of claim 1 , wherein the PFPE fluid has a molecular weight between 1,500 and 30,000 g/mol.

12 . The thermal interface material of claim 1 , wherein the PFPE fluid has a viscosity of at least 50 cSt and the thermal interface material is a paste.

13 . The thermal interface material of claim 1 , wherein the heat conductive particles are selected from the group consisting of SiC, BeO, Cu 2 O, AlN, BN, Si 3 N4, MgO, ZnO, Al 2 O 3 , SiO 2 , Al 2 TiO 5 , CF, MgF 2 , AlF 3 , CuF 2 , and ZnF 2 .

14 . The thermal interface material of claim 1 , wherein the heat conductive particles are non-magnetic.

15 . The thermal interface material of claim 1 , wherein the heat conductive particles are less than 100 μm in size.

16 . The thermal interface material of claim 1 , wherein the heat conductive particles are non-magnetic and have a thermal conductivity of at least 20 W/mK.

17 . The thermal interface material of claim 1 , wherein the thermal interface material is applied to a solid heat conductive film to form a thermal interface film.

18 . A method of making a thermal interface material comprising the steps of:

obtaining a plurality of non-magnetic heat conductive particles, wherein the heat conductive particles are less than 100 μm in size and are selected from the group consisting of Mg, MgO, Zn, and ZnO;

obtaining a perfluoropolyether fluid, wherein the perfluoropolyether fluid has a molecular weight between about 1,500 and about 30,000 g/mol;

modifying the heat conductive particles by covalently bonding a surface treatment agent to the surface of the heat conductive particles wherein the surface treatment agent comprises a perfluoropolyether moiety; and

dispersing the modified heat conductive particles within the perfluoropolyether fluid to form a thermal interface material wherein the thermal interface material comprises at least 80% heat conductive particles by weight.

19 . A method of making a thermal interface material comprising the steps of:

obtaining a plurality of non-magnetic heat conductive particles;

obtaining a fluorine containing fluid;

obtaining a surface treatment agent comprising a fluorine containing group and a hydrolizable silane group;

blending the surface treatment agent with the fluorine containing fluid;

adding the heat conductive particles to the blended fluorine containing fluid and surface treatment agent;

modifying the heat conductive particles by covalently bonding the surface treatment agent to the surface of the heat conductive particles; and

dispersing the modified heat conductive particles within the fluorine containing fluid to form a thermal interface material.

20 . The method of claim 19 , wherein the fluorine containing fluid is a PFPE fluid.

Assignments (2)
CHANGE OF ADDRESS Recorded Jan 11, 2023
From: DAIKIN INDUSTRIES LTD.
To: DAIKIN INDUSTRIES LTD.
Reel/Frame 062355/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2022
From: TACHIHARA, KIYOMI; HONDA, YOSHIAKI; MITSUHASHI, HISASHI; KIGAWA, KOJI
To: DAIKIN AMERICA, INC.; DAIKIN INDUSTRIES, LTD.
Reel/Frame 061743/0581 →