Package structure and forming method thereof
A package structure is provided. The package structure has a light-emitting region and a non-light-emitting region that is adjacent to the light-emitting region, and includes a substrate, a first light-emitting layer, a second light-emitting layer and a third light-emitting layer. The first light-emitting layer, the second light-emitting layer and the third light-emitting layer are sequentially stacked on the substrate. Each of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer includes a transparent adhesive layer disposed in the light-emitting region, a light-emitting diode (LED) chip disposed on the transparent adhesive layer, a redistribution layer formed on the LED chip and extending from the light-emitting region to the non-light-emitting region, and a planarization layer disposed on the LED chip and the redistribution layer.
1 . A package structure having a light-emitting region and a non-light-emitting region adjacent to the light-emitting region, comprising:
a substrate; and
a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer sequentially stacked above the substrate;
wherein each of the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer comprises:
a transparent adhesive layer disposed in the light-emitting region;
a light-emitting diode (LED) chip disposed on the transparent adhesive layer;
a first redistribution layer and a second redistribution layer formed on the LED chip, wherein the first redistribution layer and the second redistribution layer extend from the light-emitting region to the non-light-emitting region; and
a planarization layer disposed on the LED chip and the first redistribution layer and the second redistribution layer;
wherein, in a top view, the package structure has a rectangle shape with a first side, a second side, a third side, and a fourth side different from each other;
wherein the second redistribution layer of the first light-emitting layer extends toward the first side, the second redistribution layer of the second light-emitting layer extends toward the second side, and the second redistribution layer of the third light-emitting layer extends toward the third side.
2 . The package structure as claimed in claim 1 , wherein the substrate is a backplane or an interposer substrate.
3 . The package structure as claimed in claim 1 , wherein the substrate is a transparent substrate.
4 . The package structure as claimed in claim 1 , wherein the LED chip of each of the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer comprises at least one tethered structure on an outer edge of each LED chip.
5 . The package structure as claimed in claim 1 , wherein projection planes of the LED chips of the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer on the substrate at least partially overlap.
6 . The package structure as claimed in claim 1 , wherein:
the LED chip of the first light-emitting layer emits light with a first wavelength;
the LED chip of the second light-emitting layer emits light with a second wavelength;
the LED chip of the third light-emitting layer emits light with a third wavelength; and
the first wavelength, the second wavelength, and the third wavelength are different from one another.
7 . The package structure as claimed in claim 6 , wherein a side of the substrate on which the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer are disposed defines a light-emitting side, and wherein the first wavelength is greater than the second wavelength and the second wavelength is greater than the third wavelength.
8 . The package structure as claimed in claim 6 , wherein a side of the substrate on which the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer are not disposed defines a light-emitting side, and wherein the third wavelength is greater than the second wavelength and the second wavelength is greater than the first wavelength.
9 . The package structure as claimed in claim 1 , further comprising a first electrode, a second electrode, a third electrode, and a common electrode, wherein the first electrode, the second electrode, the third electrode, and the common electrode are disposed on the substrate within the non-light-emitting region and are in physical contact with the substrate.
10 . The package structure as claimed in claim 9 , wherein:
the LED chip of the first light-emitting layer is electrically connected to the common electrode and the first electrode by the first redistribution layer and the second redistribution layer of the first light-emitting layer respectively;
the LED chip of the second light-emitting layer is electrically connected to the common electrode and the second electrode by the first redistribution layer and the second redistribution layer of the second light-emitting layer respectively; and
the LED chip of the third light-emitting layer is electrically connected to the common electrode and the third electrode by the first redistribution layer and the second redistribution layer of the third light-emitting layer.
11 . The package structure as claimed in claim 9 , wherein:
the first redistribution layer and the second redistribution layer of the second light-emitting layer are electrically connected to the common electrode and the second electrode respectively through a first via and a second via;
the first redistribution layer and the second redistribution layer of the third light-emitting layer are electrically connected to the common electrode and the third electrode through the first via and a third via, respectively;
the first via and the third via are disposed in the non-light-emitting region and extend through the planarization layers of the first light-emitting layer and the second light-emitting layer; and
the second via is disposed in the non-non-light-emitting region and extends through the planarization layer of the first light-emitting layer.
12 . The package structure as claimed in claim 11 , wherein the third via has an aspect ratio between 2:1 and 20:1.
13 . The package structure as claimed in claim 9 , wherein:
the first redistribution layer and the second redistribution layer of the second light-emitting layer are electrically connected to the common electrode and the second electrode through a first via and a second via, respectively;
the first redistribution layer and the second redistribution layer of the third light-emitting layer are electrically connected to the common electrode and the third electrode through a third via and a fourth via, respectively;
the first via and the second via are disposed in the non-light-emitting region and extend through the planarization layer of the first light-emitting layer; and
the third via and the fourth via are disposed in the non-light-emitting region and extend through the planarization layers of the first light-emitting layer and the second light-emitting layer.
14 . A package structure having a light-emitting region and a non-light-emitting region adjacent to the light-emitting region, comprising:
a substrate;
a first light-emitting unit disposed on the substrate;
a first planarization layer disposed on the first light-emitting unit;
a second light-emitting unit and a third light-emitting unit disposed on the first planarization layer and laterally separated from each other; and
a second planarization layer disposed on the second light-emitting unit and the third light-emitting unit, wherein each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit comprises:
a transparent adhesive layer disposed in the light-emitting region;
an LED chip disposed on the transparent adhesive layer; and
a first redistribution layer and a second redistribution layer formed on the LED chip, wherein the first redistribution layer and the second redistribution layer extend from the light-emitting region to the non-light-emitting region;
wherein, in a top view, the package structure has a rectangle shape with a first side, a second side, a third side, and a fourth side different from each other;
wherein the second redistribution layer of the first light-emitting unit extends toward the first side, the second redistribution layer of the second light-emitting unit extends toward the second side, and the second redistribution layer of the third light-emitting unit extends toward the third side.
15 . The package structure as claimed in claim 14 , wherein the substrate is a backplane or an interposer substrate.
16 . The package structure as claimed in claim 14 , wherein the substrate is a transparent substrate.
17 . The package structure as claimed in claim 14 , wherein projection planes of the LED chips of the second light-emitting unit and the third light-emitting unit on the substrate at least partially overlap a projection plane of the LED chip of the first light-emitting unit on the substrate.
18 . The package structure as claimed in claim 14 , wherein:
the LED chip of the first light-emitting unit emits light with a first wavelength;
the LED chip of the second light-emitting unit emits light with a second wavelength;
the LED chip of the third light-emitting unit emits light with a third wavelength; and
the first wavelength is greater than the second wavelength and the third wavelength, and the second wavelength and the third wavelength are different.
19 . The package structure as claimed in claim 14 , further comprising a first electrode, a second electrode, a third electrode, and a common electrode, wherein the first electrode, the second electrode, the third electrode, and the common electrode are disposed on the substrate within the non-light-emitting region and are in physical contact with the substrate.
20 . The package structure as claimed in claim 19 , wherein:
the LED chip of the first light-emitting unit is electrically connected to the common electrode and the first electrode by the first redistribution layer and the second redistribution layer of the first light-emitting unit respectively;
the LED chip of the second light-emitting unit is electrically connected to the common electrode and the second electrode by the first redistribution layer and the second redistribution layer of the second light-emitting unit respectively; and
the LED chip of the third light-emitting unit is electrically connected to the common electrode and the third electrode by the first redistribution layer and the second redistribution layer of the third light-emitting unit respectively.
21 . The package structure as claimed in claim 20 , wherein:
the first redistribution layer and the second redistribution layer of the second light-emitting unit are electrically connected to the common electrode and the second electrode through a first via and a second via, respectively;
the first redistribution layer and the second redistribution layer of the third light-emitting unit are electrically connected to the common electrode and the third electrode through a third via and a fourth via, respectively; and
the first via, the second via, the third via, and the fourth via are disposed in the non-light-emitting region and extend through the first planarization layer.
22 . The package structure as claimed in claim 19 , wherein:
the first redistribution layer and the second redistribution layer of the second light-emitting unit are electrically connected to the common electrode and the second electrode through a first via and a second via, respectively;
the first redistribution layer and the second redistribution layer of the third light-emitting unit are electrically connected to the common electrode and the third electrode through the first via and a third via, respectively; and
the first via, the second via, and the third via are disposed in the non-light-emitting region and extend through the first planarization layer.
23 . The package structure as claimed in claim 1 , wherein the first redistribution layer of the first light-emitting layer extends toward the fourth side of the package structure.
24 . The package structure as claimed in claim 9 , wherein the LED chip of the first light-emitting layer is located between the first electrode and the third electrode.
25 . The package structure as claimed in claim 11 , wherein the first via and the second via are respectively located on two opposite sides of the LED chip of the second light-emitting layer.
26 . The package structure as claimed in claim 14 , wherein, in the non-light-emitting region, the first redistribution layer of the first light-emitting unit is vertically overlapped with the first redistribution layer of the second light-emitting unit.
27 . The package structure as claimed in claim 14 , wherein the first redistribution layer of the first light-emitting unit extends toward the fourth side of the package structure.
28 . The package structure as claimed in claim 14 , wherein the LED chip of the first light-emitting unit is located between the second electrode and the third electrode.
29 . The package structure as claimed in claim 21 , wherein the second via and the fourth via are respectively located on two opposite sides of the LED chip of the first light-emitting unit.
30 . The package structure as claimed in claim 21 , wherein the first via and the third via are located on a same side of the LED chip of the first light-emitting unit.
31 . A package structure having a light-emitting region and a non-light-emitting region adjacent to the light-emitting region, comprising:
a substrate;
a first light-emitting unit disposed on the substrate;
a first planarization layer disposed on the first light-emitting unit; and
a second light-emitting unit, a third light-emitting unit, and a second planarization layer disposed between the first light-emitting unit and the substrate, wherein the second light-emitting unit and the third light-emitting unit are laterally separated from each other; and the second planarization layer covers the second light-emitting unit and the third light-emitting unit;
wherein each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit comprises:
a transparent adhesive layer disposed in the light-emitting region;
an LED chip disposed on the transparent adhesive layer; and
a first redistribution layer and a second redistribution layer formed on the LED chip, wherein the first redistribution layer and the second redistribution layer extend from the light-emitting region to the non-light-emitting region;
wherein, in a top view, the package structure has a rectangle shape with a first side, a second side, a third side, and a fourth side different from each other;
wherein the second redistribution layer of the first light-emitting unit extends toward the first side, the second redistribution layer of the second light-emitting unit extends toward the second side, and the second redistribution layer of the third light-emitting unit extends toward the third side.
32 . The package structure as claimed in claim 31 , wherein the first redistribution layer of the first light-emitting unit extends toward the fourth side of the package structure.
33 . The package structure as claimed in claim 31 , wherein projection planes of the LED chips of the second light-emitting unit and the third light-emitting unit on the substrate at least partially overlap a projection plane of the LED chip of the first light-emitting unit on the substrate.
34 . The package structure as claimed in claim 31 , wherein:
the LED chip of the first light-emitting unit emits light with a first wavelength;
the LED chip of the second light-emitting unit emits light with a second wavelength different from the first wavelength; and
the LED chip of the third light-emitting unit emits light with a third wavelength different from the first wavelength and the second wavelength.
35 . The package structure as claimed in claim 31 , further comprising a first electrode, a second electrode, a third electrode, and a common electrode, wherein the first electrode, the second electrode, the third electrode, and the common electrode are disposed on the substrate within the non-light-emitting region.
36 . The package structure as claimed in claim 35 , wherein:
the LED chip of the first light-emitting unit is electrically connected to the common electrode and the first electrode by the first redistribution layer and the second redistribution layer of the first light-emitting unit respectively;
the LED chip of the second light-emitting unit is electrically connected to the common electrode and the second electrode by the first redistribution layer and the second redistribution layer of the second light-emitting unit respectively; and
the LED chip of the third light-emitting unit is electrically connected to the common electrode and the third electrode by the first redistribution layer and the second redistribution layer of the third light-emitting unit respectively.