Electronic apparatus and cooling module
An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.
1. An electronic apparatus comprising:
a chassis having a first cover member defining one outer face opposed along a thickness of the chassis, and a second cover member defining another outer face;
a heating element in the chassis; and
a cooling module in the chassis to cool the heating element,
the cooling module including:
a blower fan having an air inlet to take in air and an air outlet to discharge air;
a heat sink having a plurality of spaced apart fins, a first gap between a first face and the first cover member, a second gap between a second face and the second cover member, and a side face intersecting the first and second faces, the side face facing the air outlet;
a seal member in the first gap and attached to the first face of the heat sink so as to surround the first face; and
a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.
2. The electronic apparatus according to claim 1 , wherein
the cooling module further includes: a plate-shaped vapor chamber that absorbs heat from the heating element,
the cover sheet includes a heat conductive sheet made of a heat conductive material, and
the heat conductive sheet has
a first portion covering the first face of the heat sink, and
a second portion extending from the first portion and connected to the vapor chamber.
3. The electronic apparatus according to claim 2 , wherein
the heating element and the heat conductive sheet are connected to different areas on one of a surface and a back face of the vapor chamber.
4. The electronic apparatus according to claim 3 , wherein
the cooling module further includes a heat pipe that is partially disposed in the second gap, the heat pipe absorbing heat from the heating element and transporting the heat to the heat sink, and
the heat pipe is connected between the other of the surface and the back face of the vapor chamber and the second face of the heat sink.
5. The electronic apparatus according to claim 1 , wherein
the heat sink has a duct introduction portion that is a chamfer at a corner where the first face and the side face intersect to guide air from the air outlet to the duct.
6. A cooling module configured for mounting in an electronic apparatus, comprising:
a blower fan having an air inlet to take in air and an air outlet to discharge air;
a heat sink having a plurality of spaced apart fins, a first face that is one opposed face in a standing direction of the fins, a second face that is another opposed face, and a side face intersecting the first and second faces, the side face facing the air outlet;
a seal member attached to the first face of the heat sink so as to surround the first face; and
a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.
7. The cooling module according to claim 6 , further comprising:
a plate-shaped vapor chamber, wherein
the cover sheet includes a heat conductive sheet made of a heat conductive material, and
the heat conductive sheet has
a first portion covering the first face of the heat sink, and
a second portion extending from the first portion and connected to the vapor chamber.