Yield enhancement techniques for photonic communications platform
Described herein are techniques for yield enhancement in photonic communications platforms. A photonic communication platform may include a photonic substrate patterned with a plurality of photonic modules including at least first and second photonic modules, wherein the first and second photonic modules are copies of a common template photonic module. Yield enhancement may be accomplished using photonic redundancy and/or electronic redundancy. Photonic redundancy may involve redundant optical lanes provided in parallel to primary optical lanes. Electronic redundancy may involve use of additional electronic circuits or wires running in parallel to electronic circuits or wires. Defective circuits may be disabled to prevent negative impacts on other parts of the electronic system. This can be done by providing power-isolating switches that completely disable and isolate the defective circuits.
1. A photonic system comprising:
a photonic substrate patterned with a plurality of photonic modules including at least first and second photonic modules, wherein the first and second photonic modules are copies of a common template photonic module;
a primary optical lane optically coupling the first photonic module to the second photonic module across a first boundary between the first and second photonic modules;
a redundant optical lane, optically in parallel to the primary optical lane, optically coupling the first photonic module to the second photonic module across the first boundary between the first and second photonic modules;
a first optical switch coupled to respective inputs of the primary optical lane and the redundant optical lane; and
a controller configured to:
receive information indicative of whether the primary optical lane is defective, and
if the information indicates that the primary optical lane is defective, control the first optical switch to select the redundant optical lane and unselect the primary optical lane.
2. The photonic system of claim 1 , further comprising a second optical switch coupled to respective outputs of the primary optical lane and the redundant optical lane.
3. The photonic system of claim 1 , wherein the first optical switch is configured to irreversibly disconnect the primary optical lane or the redundant optical lane.
4. The photonic system of claim 1 , wherein the first and second photonic modules share a common optical waveguide layer pattern.
5. The photonic system of claim 1 , further comprising a first die in communication with the first photonic module, and a second die in communication with the second photonic module.
6. The photonic system of claim 5 , wherein the first die comprises a processor and the second die comprises a memory.
7. The photonic system of claim 5 , wherein the first die is stacked on top of the first photonic module and the second die is stacked on top or below the second photonic module.
8. The photonic system of claim 5 , further comprising a third die stacked on top of the first die.
9. A photonic system comprising:
a photonic substrate patterned with a plurality of photonic modules including at least first and second photonic modules, wherein the first and second photonic modules are copies of a common template photonic module;
a power grid integrated with the photonic substrate and configured to electrically power at least some of the plurality of photonic modules, the power grid being arranged in a plurality of power islands that can be electronically isolated from the power grid; and
a controller configured to:
determine whether a first power island of the plurality of power islands is defective; and
control a first power isolating switch to electronically isolate the first power island from the power grid if the first power island is determined to be defective.
10. The photonic system of claim 9 , wherein the power grid comprises a first metal trace level of the photonic substrate and a second metal trace level of the photonic substrate.
11. The photonic system of claim 9 , further comprising a plurality of power isolating switches configured to electronically isolate one or more power islands from the power grid.
12. The photonic system of claim 9 , further comprising a primary wiring electrically coupling the first photonic module to the second photonic module, and a redundant wiring electrically coupling the first photonic module to the second photonic module.
13. The photonic system of claim 9 , further comprising a primary optical lane optically coupling the first photonic module to the second photonic module, and a redundant optical lane optically coupling the first photonic module to the second photonic module.