Printed circuit board, battery module, battery pack, and electrical device
View Patent ↗This application discloses a printed circuit board, a battery module, a battery pack, and an electrical device. The printed circuit board may include: a substrate, a pad, a solder paste layer, a component body, and a support assembly. The pad may be disposed above the substrate. The solder paste layer may be disposed above the pad. The component body may be disposed above the solder paste layer. The support assembly may be disposed between the pad and the component body to form a degassing space between the component body and the solder paste layer.
1 . A printed circuit board, comprising:
a substrate;
a pad above the substrate;
a solder paste layer above the pad;
a component body above the solder paste layer; and
a support assembly between the pad and the component body to form a degassing space between the component body and the solder paste layer,
wherein one end of the support assembly is connected to the component body, and another end of the support assembly extends into the solder paste layer to directly connect to the pad,
the support assembly is soldering lug, which has a higher melting point than solder paste in the solder paste layer,
the printed circuit board further comprises a fixing assembly for preventing an offset in a case of connecting the component body to the pad between the component body and the pad,
the fixing assembly comprises a solder paste zone and a limiting post, the solder paste zone is disposed on the pad, one end of the limiting post is connected to the component body, and another end of the limiting post is connected to the solder paste zone,
the limiting post is disposed at a flank of the component body, and
a thickness of the solder paste zone is greater than a thickness of the solder paste layer.
2 . The printed circuit board according to claim 1 , wherein the support assembly comprises at least two pillars.
3 . The printed circuit board according to claim 2 , wherein the pillars are tin slugs.
4 . The printed circuit board according to claim 2 , wherein the solder paste layer comprises solder paste which is composed of a mixture of tin solder powders, a flux, a surfactant, and a thixotropic agent.
5 . The printed circuit board according to claim 2 , wherein a height of each of the at least two pillars is greater than a thickness of the solder paste layer.
6 . The printed circuit board according to claim 1 , wherein the support assembly is axially symmetrically arranged along a vertical centerline of the component body.
7 . The printed circuit board according to claim 1 , wherein the limiting post is a pin, and the pin is an inherent component pin of the component body.
8 . The printed circuit board according to claim 1 , wherein the fixing assembly comprises at least two pins as limiting posts.
9 . The printed circuit board according to claim 1 , wherein the limiting post is in an inverted L shape.
10 . A battery module, wherein the battery module comprises the printed circuit board according to claim 1 , and the printed circuit board is located in the battery module.
11 . A battery pack, wherein the battery pack comprises the battery module according to claim 10 .
12 . An electrical device, wherein the electrical device comprises the battery pack according to claim 11 , and the battery pack is configured to provide electrical energy.
13 . A battery module, wherein the battery module comprises the printed circuit board according to claim 1 , and the printed circuit board is located in the battery module.