Printed circuit board comprising ground wire
A printed circuit board includes: a first layer including a first ground including a first opening, wherein a first ground wire is within the first opening; a second layer disposed in a direction from the first layer and including a second ground including a second opening, wherein the second opening at least partially overlaps with the first opening and wherein a second ground wire is within the second opening; a third layer between the first layer and the second layer and including a third opening, wherein the third opening at least partially overlaps with the first opening and wherein a first via pad is within the third opening; and a fourth layer between the second layer and the third layer and including a fourth opening, wherein the fourth opening at least partially overlaps with the third opening and wherein a second via pad is within the fourth opening.
1 . A printed circuit board comprising:
a first layer comprising a first ground including a first opening and a first ground wire within the first opening;
a second layer disposed in a direction from the first layer and comprising a second ground including a second opening and a second ground wire within the second opening, wherein the second opening at least partially overlaps with the first opening;
a third layer between the first layer and the second layer and including a third opening, a first via pad within the third opening, and a first wire line extending from the first via pad, wherein the third opening at least partially overlaps with the first opening;
a fourth layer between the second layer and the third layer and including a fourth opening, a second via pad within the fourth opening, and a second wire line extending from the second via pad, wherein the fourth opening at least partially overlaps with the third opening; and
a via at least partially surrounded by the first via pad and the second via pad,
wherein at least a portion of the first via pad and a least a portion of the first wire line are in a same first horizontal plane and extend along the same first horizontal plane,
wherein at least a portion of the second via pad and at least a portion of the second wire line are in a same second horizontal plane and extend along the same second horizontal plane,
wherein the first ground wire at least partially overlaps with the first via pad and the first wire line, and extends along the first wire line, and
wherein the second ground wire at least partially overlaps with the second via pad and the second wire line, and extends along the second wire line.
2 . The printed circuit board of claim 1 , wherein the first layer, the third layer, the fourth layer, and the second layer are sequentially stacked in the direction, and
wherein the first ground wire extends along the first wire line, and the second ground wire extends along the second ground wire.
3 . The printed circuit board of claim 1 , wherein, when the printed circuit board is seen in the direction, the first ground wire at least partially overlaps with the second wire line, and a width of the first ground wire is smaller than a width of the second wire line.
4 . The printed circuit board of claim 3 , wherein the first ground wire comprises a (1-1)th ground wire and a (1-2)th ground wire crossing the (1-1)th ground wire, and
the second ground wire comprises a (2-1)th ground wire and a (2-2)th ground wire crossing the (2-1)th ground wire.
5 . The printed circuit board of claim 4 , wherein the first ground wire comprises a first central area in which the (1-1)th ground wire and the (1-2)th ground wire overlap, and
at least a part of the first central area overlaps with at least a part of the via in the direction.
6 . The printed circuit board of claim 1 , wherein a width of the first ground wire is smaller than a width of the first via pad, and
a width of the second ground wire is smaller than a width of the second via pad.
7 . The printed circuit board of claim 1 , further comprising:
a first connection member connected to an antenna module; and
a second connection member connected to a communication module,
wherein the via is configured to transmit a signal between the antenna module and the communication module.
8 . The printed circuit board of claim 1 , further comprising:
a first substrate that is flexible; and
a second substrate connected to the first substrate, wherein the first ground wire, the second ground wire, the first via pad, the second via pad, and the via are positioned at the second substrate.
9 . The printed circuit board of claim 1 , wherein the first ground wire at least partially overlaps with the second ground wire in the direction.
10 . The printed circuit board of claim 1 , wherein the first ground wire comprises a first ground shielding corresponding to the first via pad,
the second ground wire comprises a second ground shielding corresponding to the second via pad, and
the first ground shielding and the second ground shielding at least partially overlap in the direction.
11 . The printed circuit board of claim 1 , further comprising a ground via extending through the first layer, the second layer, the third layer, and the fourth layer,
wherein the first ground wire and the second ground wire are electrically connected through the ground via.
12 . An electronic device comprising:
the printed circuit board of claim 1 ;
a display; and
a battery configured to supply power to the display.
13 . The printed circuit board of claim 1 , wherein an extension direction of the first ground wire or the second ground wire is 90 degrees with respect to an extension direction of the first wire line or the second wire line.
14 . The printed circuit board of claim 1 , wherein an extension direction of the first ground wire or the second ground wire is 45 degrees with respect to an extension direction of the first wire line or the second wire line.
15 . The printed circuit board of claim 4 , wherein
an extension direction of the (1-1)th ground wire is 135 to 180 degrees with respect to an extension direction of (1-2)th ground wire,
the extension direction of the (1-1)th ground wire is the same as an extension direction of the first wire line, and the (1-1)th ground wire overlaps with the first wire line, and
the extension direction of the (1-2)th ground wire is the same as an extension direction of the second wire line, and the (1-2)th ground wire overlaps with the second wire line.
16 . The printed circuit board of claim 1 , further comprising:
a first insulating layer between the first layer and the third layer, wherein the first insulating layer has a thickness that is greater than a width of the first ground wire.
17 . The printed circuit board of claim 16 , further comprising:
a second insulating layer between the fourth layer and the second layer, wherein the second insulating layer has a thickness that is greater than the thickness of the first insulating layer.
18 . The printed circuit board of claim 1 , wherein the first layer, the fourth layer, the third layer, and the second layer are sequentially stacked in the direction,
wherein, when the printed circuit board is seen in the direction:
the first ground wire and the second ground wire at least partially overlap with the via,
the first opening, the second opening, the third opening, and the fourth opening at least partially overlap with each other,
the first ground wire at least partially overlaps with the first via pad and the first wire line, and extends along the first wire line, and
the second ground wire at least partially overlaps with the second via pad and the second wire line, and extends along the second ground wire.
19 . The printed circuit board of claim 8 , further comprising:
a first insulating layer between the first layer and the third layer, wherein the first ground wire and the first via pad are spaced apart from each other by a first thickness of the first insulating layer;
a second insulating layer between the third layer and the fourth layer, wherein the first via pad and the second via pad are spaced apart from each other by a second thickness of the second insulating layer; and
a third insulating layer between the fourth layer and the second layer, wherein the second ground wire and the second via pad are spaced apart from each other by a third thickness of the third insulating layer greater than the first thickness,
wherein a total number of conductive layers of the second substrate is greater than a total number of conductive layers of the first substrate.