Stabilizing component for polyamide resin composition
View Patent ↗Polyamide resin that comprise one or more polyamides and a stabilizer component containing an copper complex and a copper salt is disclosed for improving the heat age performance for an article. The combination of a copper complex and a copper salt retains the mechanical properties of the article.
1. A polyamide resin composition consisting of:
a resin component consisting of at least 75 wt. % of a polyamide formed from an aliphatic diamine having 6 or more carbon atoms and an aliphatic diacid having 6 or more carbon atoms, and no more than 25 wt. % of polyamide formed from caprolactam;
a copper complex; and
a copper salt and alkali metal halide, wherein the amount of copper provided by the copper complex and copper salt is in a weight ratio from 10:90 to 90:10; and
additives selected from the group consisting of lubricants, dyes, pigments, optical brightener, UV stabilizers, and mixtures thereof.
2. The composition of claim 1 , wherein the copper complex consists of copper bound by a ligand.
3. The composition of claim 2 , wherein the ligand is a phosphine, mercaptobenzimidazole, acetylacetonate, glycine, ethylenediamine, oxalate, diethylenediamine, triethylenetetraamine, ethylenediaminetetraacetic acid, pyridine, diphosphone, dipyridyl, or mixtures thereof.
4. The composition of claim 3 , wherein the phosphine is tributylphosphine, triphenylphosphine, or mixtures thereof.
5. The composition of claim 1 , wherein the copper complex has a total amount of copper that is from 10 to 1000 wppm based on the total weight of the copper complex.
6. The composition of claim 1 , wherein the copper salt is cuprous iodide, cuprous cyanide, cupric acetate, cupric stearate, or mixtures thereof.
7. The composition of claim 1 , wherein the alkali metal halide is lithium iodide, sodium iodide, or potassium iodide, or mixtures thereof.
8. The composition of claim 1 , wherein the total halogen loading is less than or equal to 5 wt. % based on the total weight of the polyamide resin composition.
9. The composition of claim 1 , wherein the copper complex has a copper ion bound to a halogenated organic group.
10. The composition of claim 9 , wherein the halogenated organic group is a bromine-based group.
11. The composition of claim 1 , wherein the resin component is in an amount from 70 to 99.5 wt. % based on the total weight of the polyamide resin composition.
12. The composition of claim 1 , wherein the copper complex is in an amount from 0.1 to 5 wt. % based on the total weight of the polyamide resin composition.
13. The composition of claim 1 , wherein the copper salt is in an amount from 0.1 to 5 wt. % based on the total weight of the polyamide resin composition.
14. The composition of claim 1 , wherein the polyamide resin composition maintains at least 80% of the initial tensile strength after 1500 hours at a temperature from 140° C. to 160° C.
15. The composition of claim 1 , wherein the polyamide resin composition maintains at least 5% of the initial elongation after 1500 hours at a temperature from 140° C. to 160° C.
16. The composition of claim 1 , wherein the polyamide resin composition maintains at least 25% of the initial impact strength after 3000 hours at a temperature from 140° C. to 160° C.
17. A cable tie made from the polyamide resin composition of claim 1 .
18. The cable tie of claim 17 , wherein the cable tie is formed using injection molding.