IP Library Granted Patent US 12,369,253
Granted Patent B2
US 12,369,253 · App. 17/952,895 · Granted Jul 22, 2025

Circuit and connector element alignment, circuit board assemblies

Inventors: Eung San Cho (Torrance, CA); Danny Clavette (Greene, RI)
Assignee: Infineon Technologies Austria AG
H05K1/18H02M3/003H05K1/117H05K1/141H05K1/145H05K3/0052H05K3/30H05K3/366H02M3/1584H05K2201/047H05K2201/09145H05K2201/10015H05K2201/1003H05K2201/1053
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Quick Facts
Patent No.
US 12,369,253
App. No.
17/952,895
Granted
Jul 22, 2025
Kind
B2
Abstract

This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

Claims (71)

1. A first assembly comprising:

a first circuit board including first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board, the first edge disposed opposite the second edge on the first circuit board;

first circuitry affixed to the first circuit board;

wherein the first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry; and

wherein the first circuitry affixed to the first circuit board is an inductor device, the inductor device comprising an electrically conductive path and magnetic permeable material, the electrically conductive path being electrically conductive material extending between the first axial end of the first circuitry and the second axial end of the first circuitry, the electrically conductive path of the inductor device enveloped by the magnetic permeable material.

2. The first assembly as in claim 1 , wherein the electrically conductive path is a cylindrical body fabricated from the electrically conductive material; and

wherein an axis disposed along a length of the cylindrical body between the first axial end and the second axial end is substantially parallel to a plane in which the first circuit board resides.

3. The first assembly as in claim 1 , wherein cross sectional areas of the electrically conductive path are enlarged at the first axial end and the second axial end with respect to a cross sectional area of the electrically conductive path at a location between the first axial end and the second axial end.

4. The first assembly as in claim 1 further comprising:

a layer of material disposed between the magnetic permeable material of the inductor device and a surface of the first circuit board, the layer of material affixing the inductor device to the first circuit board.

5. The first assembly as in claim 1 , wherein the first circuitry affixed to the first circuit board includes a series connection of the inductor device and power converter circuitry between the first axial end and the second axial end.

6. The first assembly as in claim 5 , wherein the first axial end of the first circuitry is electrically isolated from the first connector elements disposed on the first edge of the first circuit board; and

wherein the second axial end of the first circuitry is electrically isolated from the second connector elements disposed on the second edge of the first circuit board.

7. The first assembly as in claim 6 , wherein the inductor device is operative to convey first current from the first axial end of the first circuitry through the first electrically conductive path of the inductor device and the second axial end of the first circuitry to a load; and

wherein the first circuit board includes a second electrically conductive path connected between the second connector elements and the first connector elements, the second electrically conductive path operative to receive the first current from the load and convey the first current from the load through the second connector elements and the second electrically conductive path to the first connector elements.

8. The first assembly as in claim 1 further comprising:

supplemental circuitry coupled to a second surface of the first circuit board, the second surface disposed opposite the first surface.

9. The first assembly as in claim 1 further comprising:

a chip embedded in the first circuit board.

10. The first assembly as in claim 1 , wherein each of the first connector elements on the first edge of the first circuit board includes a respective cavity; and

wherein each of the second connector elements on the second edge of the connector elements includes a respective cavity.

11. A second assembly comprising:

the first assembly of claim 1 ;

a first substrate;

a second substrate; and

wherein the first connector elements on the first edge are connected to the first substrate;

wherein the first axial end of the first circuitry is connected to the first substrate;

wherein the second connector elements on the second edge are connected to the second substrate; and

wherein the second axial end of the first circuitry is connected to the second substrate.

12. The second assembly as in claim 11 , wherein the first substrate is disposed substantially parallel to the second substrate;

wherein the first circuit board is disposed substantially parallel to a second circuit board; and

wherein both the first circuit board and the second circuit board are disposed substantially orthogonal to the first substrate or the second substrate.

13. The first assembly as in claim 1 , wherein a combination of: i) the first edge of the first circuit board, and ii) the first axial end of the first circuitry reside in a first plane; and

wherein a combination of: i) the second edge of the first circuit board, and ii) the second axial end of the first circuitry reside in a second plane.

14. The first assembly as in claim 1 , wherein the first axial end of the first circuitry is electrically isolated from the first connector elements disposed on the first edge of the first circuit board; and

wherein the second axial end of the first circuitry is electrically isolated from the second connector elements disposed on the second edge of the first circuit board.

15. The first assembly as in claim 1 ,

wherein the first axial end of the first circuitry is physically spaced apart from the first connector elements disposed on the first edge of the first circuit board via a first portion of the magnetic permeable material; and

wherein the second axial end of the first circuitry is physically spaced apart from the second connector elements disposed on the second edge of the first circuit board via a second portion of the magnetic permeable material.

16. The first assembly as in claim 1 , wherein the magnetic permeable material includes a planar surface; and

wherein the planar surface of the magnetic permeable material is affixed to the first circuit board.

17. The first assembly as in claim 1 , wherein the first connector elements and the first axial end of the first circuitry are directly connected to a second circuit board; and

wherein the second connector elements and the second axial end of the first circuitry are directly connected to nodes of a third circuit board.

18. The first assembly as in claim 17 , wherein the first circuitry is operative to convey first current received from the second circuit board through the first circuitry to a load coupled to the third circuit board; and

wherein the first circuit board includes a second electrically conductive path connected between the second connector elements and the first connector elements, the second electrically conductive path operative to: i) receive the first current from the load through the second connector elements, and ii) convey the first current through the second electrically conductive path to the first connector elements.

19. A first assembly comprising:

a first circuit board including first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board, the first edge disposed opposite the second edge on the first circuit board;

first circuitry affixed to the first circuit board;

second circuitry affixed to the first circuit board;

wherein the first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry;

wherein a combination of the first edge of the first circuit board, the first axial end of the first circuitry, and a first axial end of the second circuitry reside in a first plane; and

wherein a combination of the second edge of the first circuit board, the second axial end of the first circuitry, and a second axial end of the second circuitry reside in a second plane.

20. The first assembly as in claim 19 , wherein the first plane is parallel to the second plane.

21. The first assembly as in claim 19 further comprising:

first circuit paths extending between a first portion of the first connector elements on the first edge and a first portion of the second connector elements on the second edge, the first circuit paths disposed in the first circuit board adjacent the first circuitry; and

second circuit paths extending between a second portion of the first connector elements on the first edge and a second portion of the second connector elements on the second edge, the second circuit paths disposed in the first circuit board adjacent the second circuitry.

22. A method of fabricating a first assembly, the method comprising:

receiving a first circuit board including a first sequence of first connector elements disposed on a first edge of the first circuit board and a second sequence of second connector elements disposed on a second edge of the first circuit board, the first edge disposed opposite the second edge on the first circuit board;

affixing first circuitry to the first circuit board, wherein a first axial end of the first circuitry is fixedly aligned with respect to the first connector elements on the first circuit board and a second axial end of the first circuitry is fixedly aligned with respect to the second connector elements on the first circuit board;

affixing second circuitry to the first circuit board;

wherein the first edge of the first circuit board aligns with a first axial end of the first circuitry and a second edge of the first circuit board aligns with a second axial end of the first circuitry;

wherein a combination of the first edge of the first circuit board, the first axial end of the first circuitry, and a first axial end of the second circuitry reside in a first plane; and

wherein a combination of the second edge of the first circuit board, the second axial end of the first circuitry, and a second axial end of the second circuitry reside in a second plane.

23. The method as in claim 22 further comprising:

fabricating the first circuit board to include the first sequence of first connector elements and the second sequence of second connector elements.

24. The method as in claim 22 further comprising:

cutting the first circuit board along an axis of the first connector elements to produce a first edge of the first circuit board; and

cutting the first circuit board along an axis of the second connector elements to produce a second edge of the first circuit board.

25. The method as in claim 24 , wherein the first circuit board is cut such that the first edge of the first circuit board is aligned with a first axial end of the first circuitry and the second edge of the first circuit board is aligned with a second axial end of the first circuitry, the first edge disposed opposite the second edge on the first circuit board.

26. The method as in claim 22 , wherein the first circuitry affixed to the first circuit board is an inductor device fabricated to include an electrically conductive path and magnetic permeable material, the electrically conductive path being electrically conductive material extending between the first axial end of the first circuitry and the second axial end of the first circuitry, the electrically conductive material of the inductor device enveloped by the magnetic permeable material.

27. The method as in claim 26 , wherein cross sectional areas of the electrically conductive paths are enlarged at the first axial end and the second axial end with respect to a cross sectional area of the electrically conductive path at a location disposed between the first axial end and the second axial end.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2023
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 063028/0605 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2022
From: CHO, EUNG SAN; CLAVETTE, DANNY
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 061215/0881 →
Continuity (1)
Related Publication 20240107674A1 · Mar 28, 2024
References Cited (7)
US 20060292898A1 · Meredith · 2006 [cited by examiner]
US 20080285242A1 · Charny · 2008 [cited by examiner]
US 20100151703A1 · Shibao · 2010 [cited by examiner]
US 20160268034A1 · Subat · 2016 [cited by examiner]
US 20170118839A1 · Brunschwiler · 2017 [cited by examiner]
US 20220263421A1 · Yu · 2022 [cited by examiner]
Extended Search Report, EP 23 19 0469, Feb. 13, 2024, pp. 1-7. [cited by applicant]