Bottom electrode via structures for micromachined ultrasonic transducer devices
An ultrasound transducer device includes an electrode, a membrane, and vias. The membrane is separated from the electrode by a cavity between the membrane and the electrode. The vias electrically connect the electrode to a substrate disposed on an opposite side of the electrode from a side facing the membrane. The vias are disposed in the ultrasound transducer device such that greater than 50% of the vias overlap with the cavity in a plan view.
1. An ultrasound transducer device, comprising:
an electrode;
a membrane separated from the electrode by a cavity between the membrane and the electrode;
a patterned membrane support layer disposed between the electrode and the membrane, wherein
a pattern of the patterned membrane support layer defines a size and shape of the cavity, and
the patterned membrane support layer comprises an insulating material, and
vias that electrically connect the electrode to a substrate disposed on an opposite side of the electrode from a side facing the membrane, wherein
the vias are disposed in the ultrasound transducer device such that greater than 50% of the vias overlap with the cavity in a plan view.
2. The ultrasound transducer device according to claim 1 , wherein the vias are disposed such that all of the vias overlap with the cavity in a plan view.
3. The ultrasound transducer device according to claim 1 , wherein an interface between the membrane and the patterned membrane support layer has a surface roughness of less than one nanometer over a distance of 100 micrometers.
4. The ultrasound transducer device according to claim 1 , further comprising:
a patterned metal layer disposed between the electrode and the vias.
5. An ultrasound device comprising an array of transducer devices, wherein each of the transducer devices is the ultrasound transducer device according to claim 1 .