Printing components to substrate posts with gaps
A printed structure includes a substrate comprising a substrate surface, a substrate circuit disposed in or on in a circuit area of the substrate surface, a substrate post protruding from the substrate surface exterior to the circuit area, and a component having a component top side and a component bottom side opposite the component top side. The component bottom side can be disposed on the substrate post and adhered to the substrate surface forming an air gap between the component bottom side and the substrate circuit. The substrate post can comprise a substrate post material that is a cured adhesive. Some embodiments comprise a substrate electrode and the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate in electrical contact with the substrate electrode.
1 . A printed structure, comprising:
a substrate comprising a substrate surface;
a substrate circuit disposed in or on the substrate surface;
a substrate post protruding from the substrate surface exterior to the substrate circuit, the substrate post comprising a cured adhesive; and
a component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post thereby adhering the component to the substrate surface with the substrate post such that a gap is defined between the component bottom side and the substrate circuit,
wherein the component comprises an integrated circuit electrically connected to the substrate circuit.
2 . The printed structure of claim 1 , comprising a substrate electrode disposed in or on the substrate surface and wherein the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate and in electrical contact with the substrate electrode.
3 . The printed structure of claim 2 , wherein the substrate post is exterior to the substrate electrode.
4 . The printed structure of claim 2 , wherein the substrate post is exterior to the connection post.
5 . The printed structure of claim 1 , comprising a cavity in the component bottom side that forms a portion of the gap.
6 . The printed structure of claim 1 , wherein the substrate post comprises soft-cured adhesive.
7 . The printed structure of claim 1 , wherein the substrate post comprises hard-cured adhesive.
8 . The printed structure of claim 2 , wherein the cured adhesive at least partially surrounds the connection post.
9 . The printed structure of claim 1 , wherein the cured adhesive at least partially surrounds the substrate circuit.
10 . The printed structure of claim 1 , wherein the component comprises a broken or separated component tether.
11 . The printed structure of claim 1 , wherein the component has (i) a length or width or both no greater than 200 microns, (ii) a thickness no greater than 50 microns, or (iii) both (i) and (ii).
12 . The printed structure of claim 2 , wherein the substrate electrode is electrically connected to the substrate circuit.
13 . The printed structure of claim 1 , wherein the cured adhesive comprises an organic material, a polymer, a resin, an epoxy, a positive photoresist, or a negative photoresist.
14 . The printed structure of claim 1 , wherein the component comprises a dummy post and the adhesive is in contact with the dummy post.
15 . The printed structure of claim 1 , wherein the gap is under vacuum.
16 . The printed structure of claim 1 , wherein the gap is filled with a gas.
17 . The printed structure of claim 1 , further comprising a second adhesive substrate post protruding from the substrate surface exterior to the substrate circuit, the substrate post comprising a cured adhesive.
18 . The printed structure of claim 17 , wherein the second adhesive substrate post is disposed on an opposing end of the component bottom side of the component from the adhesive substrate post.
19 . The printed structure of claim 1 , wherein the substrate circuit is an RF circuit.
20 . The printed structure of claim 1 , wherein the substrate post is disposed outside a perimeter of the substrate circuit.