Light or heat triggered frontally cured cure-on-demand adhesives kit
View Patent ↗A cure-on-demand adhesive kit capable of self-sustaining frontal polymerization after a heat or actinic radiation trigger for bonding two substrates is provided. The kit includes a first monomer/oligomer component and a UV or thermal cure catalyst component. In practical application, the first monomer/oligomer component and the UV or thermal cure catalyst component are mixed together to form a ready-to-use prepolymer mixture. The prepolymer mixture is applied onto the surface of a first substrate, and the first substrate is contacted with a second substrate by the mixture applied side. After giving a heat or actinic radiation trigger, a self-sustaining frontal polymerization of the mixture will be started for curing the mixture between two substrates as an adhesive to adhere the two substrates.
1. A cure-on-demand adhesive kit capable of self-sustaining frontal polymerization after a heat or actinic radiation trigger for bonding two substrates, comprising a first monomer/oligomer component having 100 parts by weight and a UV or thermal cure catalyst component having 2 to 50 parts per hundred of the first monomer/oligomer component parts;
wherein the first monomer/oligomer component and the UV or thermal cure catalyst component are mixed to obtain a ready-to-use prepolymer mixture and the ready-to-use prepolymer mixture is applied onto a first substrate;
wherein the first monomer/oligomer component is an epoxy resin selected from diglycidyl derivatives of bisphenol A, diglycidyl derivatives of bisphenol F, or a combination thereof;
wherein the UV or thermal cure catalyst component is a combination of benzopinacol derivatives and iodonium salts;
wherein the first substrate is contacted with a second substrate by the mixture applied side and waits for a heat or actinic radiation trigger of bonding the first substrate and the second substrate together;
wherein the heat or actinic radiation trigger starts a self-sustaining frontal polymerization of the mixture for curing the mixture as an adhesive to adhere the two substrates; and
wherein the heat or actinic radiation trigger is providing a total irradiation of 50,000 to 300,000 mJ/cm 2 or a heat source with a temperature of approximately 150 to 250° C.
2. The kit of claim 1 , wherein the first monomer/oligomer component is an acrylate and the UV or thermal cure catalyst component is a peroxide compound.
3. The kit of claim 2 , wherein the acrylate is selected from monoacrylates, diacrylates, triacrylates, tetraacrylates, pentaacrylates or any combination thereof.
4. The kit of claim 1 , wherein the iodonium salts are selected from one or more of phosphonium, sulfonium, diazonium and ferrocenium salts or from thiopyrylium, pyrylium, or selenonium salts.
5. The kit of claim 4 , wherein the iodonium salts are selected from diaryliodonium salts.
6. The kit of claim 1 , wherein the heat or actinic radiation is applied to start the self-sustaining frontal polymerization and is withdrawn after the self-sustaining frontal polymerization begins.
7. The kit of claim 1 , at least one of the substrates has a rigid surface.
8. The kit of claim 7 , the at least one of the substrates is selected from a rigid metal substrate, a rigid glass substrate, a rigid composite substrate, a flexible metal substrate, a flexible glass substrate, a flexible polymer substrate, or a flexible composite substrate.
9. The kit of claim 1 , the heat or actinic radiation trigger is applied at or below ambient temperature.