MICRO LIGHT-EMITTING DIODE PACKAGE STRUCTURE
Embodiments provide a micro light-emitting diode package structure and a method for forming the same. The micro light-emitting diode package structure includes a redistribution layer, a control device, micro light-emitting diodes, and a flexible material layer. The control device and the micro light-emitting diodes are disposed on and electrically connected to the redistribution layer. The flexible material layer covers the control device and the micro light-emitting diodes, wherein the micro light-emitting diodes are in contact with the flexible material layer.
1 . A micro light-emitting diode package structure, comprising:
a redistribution layer;
a control device disposed on and electrically connected to the redistribution layer;
a plurality of micro light-emitting diodes disposed on and electrically connected to the redistribution layer; and
a flexible material layer covering the control device and the micro light-emitting diodes, wherein the micro light-emitting diodes are in contact with the flexible material layer.
2 . The micro light-emitting diode package structure as claimed in claim 1 , wherein the control device comprises a micro driver integrated circuit device, a micro control integrated circuit device, a thin film transistor device or a combination thereof
3 . The micro light-emitting diode package structure as claimed in claim 1 , wherein the micro light-emitting diodes comprise electrodes, wherein the redistribution layer is in contact with the electrodes, and wherein the micro light-emitting diodes respectively have back surfaces located away from the electrodes, and the flexible material layer is in contact with the back surfaces of the micro light-emitting diodes.
4 . The micro light-emitting diode package structure as claimed in claim 3 , wherein a back surface of one of the micro light-emitting diodes is a rough surface.
5 . The micro light-emitting diode package structure as claimed in claim 1 , further comprising:
a light-shielding layer disposed between the redistribution layer and the flexible material layer, and surrounding the micro light-emitting diodes.
6 . The micro light-emitting diode package structure as claimed in claim 3 , further comprising:
a distributed Bragg reflector layer close to the electrodes of the micro light-emitting diodes and in contact with the redistribution layer.
7 . The micro light-emitting diode package structure as claimed in claim 6 , wherein an area of the distributed Bragg reflector layer is between 10% and 95% of a total area of a top surface of the micro light-emitting diode package structure in a plan view.
8 . The micro light-emitting diode package structure as claimed in claim 1 , wherein the redistribution layer has a first side wherein the control device and the micro light-emitting diodes are disposed on the first side.
9 . The micro light-emitting diode package structure as claimed in claim 3 , wherein the control device has a back surface and a contact pad, and the back surface is away from the contact pad, wherein the back surface of the control device is level with the back surfaces of the micro light-emitting diodes.
10 . The micro light-emitting diode package structure as claimed in claim 1 , further comprising:
a first insulating layer disposed between the redistribution layer and the flexible material layer, and surrounding the control device and the micro light-emitting diodes.
11 . The micro light-emitting diode package structure as claimed in claim 10 , wherein the control device has a back surface, wherein the back surface of the control device is exposed from the first insulating layer.
12 . The micro light-emitting diode package structure as claimed in claim 10 , wherein the redistribution layer has a second side, and wherein the micro light-emitting diode package structure further comprises:
a second insulating layer disposed on the second side; and
bonding pads passing through the second insulating layer and electrically connected to the redistribution layer.
13 . The micro light-emitting diode package structure as claimed in claim 1 , wherein the redistribution layer has a first side and a second side opposite the first side, and wherein the control device is disposed on the first side, and the micro light-emitting diodes are disposed on the second side.
14 . The micro light-emitting diode package structure as claimed in claim 13 , wherein the micro light-emitting diodes has sidewalls and electrodes, wherein the flexible material layer is in contact with the sidewalls and the electrodes of the micro light-emitting diodes.
15 . The micro light-emitting diode package structure as claimed in claim 13 , wherein the micro light-emitting diodes partially overlap the control device.
16 . The micro light-emitting diode package structure as claimed in claim 13 , further comprising:
a third insulating layer disposed on the first side of the redistribution layer and in contact with the control device.
17 . The micro light-emitting diode package structure as claimed in claim 16 , wherein the control device is located between the third insulating layer and the micro light-emitting diodes.
18 . The micro light-emitting diode package structure as claimed in claim 16 , further comprising:
a distributed Bragg reflector layer conformally covering the third insulating layer and in contact with the first side of the redistribution layer; and
bonding pads disposed between the third insulating layer and the distributed Bragg reflector layer, and electrically connected to the redistribution layer.
19 . The micro light-emitting diode package structure as claimed in claim 16 , further comprising:
a light shielding layer disposed on the second side of the redistribution layer and conformally covering the redistribution layer.
20 . The micro light-emitting diode package structure as claimed in claim 19 , wherein the flexible material layer is in contact with the light shielding layer.