IP Library › Granted Patent US 12,392,823
Granted Patent B2
US 12,392,823 · App. 17/970,853 · Granted Aug 19, 2025

Systems and methods for on-chip noise measurements

Inventors: Jed D. Whittaker (Vancouver, CA); Richard Harris (North Vancouver, CA); Rahul Deshpande (Vancouver, CA)
Assignee: D-WAVE SYSTEMS INC.
G01R31/31702G01R31/31709
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Quick Facts
Patent No.
US 12,392,823
App. No.
17/970,853
Granted
Aug 19, 2025
Kind
B2
Abstract

Systems and methods for measuring noise in discrete regions of multi-layer superconducting fabrication stacks are described. Methods for measuring noise in spatial regions of a superconducting fabrication stacks may include the use of resonators, each having a different geometry. As many resonators as spatial regions are fabricated. Data collected from the resonators may be used to calculate fill fractions and spin densities for different spatial regions of the superconducting fabrication stack. The data may be collected via on-chip electron-spin resonance. The superconducting fabrications may be part of a fabrication stack for a superconducting processor, for example a quantum processor, and the spatial region studied may be proximate to qubit wiring layers.

Claims (27)

1. A method of conducting spatial noise measurements in a superconducting fabrication stack, the superconducting fabrication stack comprising one or more material interfaces, the method comprising:

identifying one or more spatial regions of the superconducting fabrication stack;

generating a plurality of resonator geometries;

fabricating a plurality of resonators on the superconducting fabrication stack, each resonator of the plurality of resonators having a respective one of the plurality of resonator geometries;

measuring data from the plurality of resonators;

calculating fill fractions for the one or more spatial regions of the superconducting fabrication stack based on electromagnetic (EM) field modeling and respective dimensions of each resonator geometry; and

determining a spin density for each spatial region of the one or more spatial regions of the superconducting fabrication stack based on the data measured from the plurality of resonators and the calculated fill fractions.

2. The method of claim 1 , wherein measuring data from the plurality of resonators comprises measuring spectra of each resonator in the plurality of resonators using on-chip electron-spin resonance (cESR); and determining a spin density for each spatial region of the one or more spatial regions of the superconducting fabrication stack based on the data measured from the plurality of resonators and the calculated fill fractions comprises determining a spin density for each spatial region of the one or more spatial regions of the superconducting fabrication stack based on the cESR spectra measured from the plurality of resonators and the calculated fill fractions.

3. The method of claim 1 , wherein fabricating a plurality of resonators comprises fabricating a plurality of coplanar waveguide resonators.

4. The method of claim 1 , wherein fabricating a plurality of resonators on the superconducting fabrication stack, each resonator of the plurality of resonators having a respective one of the plurality of resonator geometries comprises fabricating a plurality of resonators on the superconducting fabrication stack, each resonator of the plurality of resonators having a respective resonance frequency.

5. The method of claim 1 , further comprising measuring the resonator geometries via scanning electron microscope (SEM) after fabricating the plurality of resonators.

6. The method of claim 1 , wherein generating a plurality of resonator geometries comprises generating as many resonator geometries as identified spatial regions.

7. The method of claim 1 , wherein identifying one or more spatial regions of the superconducting fabrication stack comprises identifying one or more spatial regions of the superconducting fabrication stack, the one or more spatial regions comprising at least one of: niobium, aluminum, tantalum, niobium nitride, titanium nitride, or niobium titanium nitride.

8. The method of claim 1 , wherein identifying one or more spatial regions of the superconducting fabrication stack comprises identifying one or more spatial regions of the superconducting fabrication stack, the one or more spatial regions comprising at least the one or more material interfaces.

9. The method of claim 1 , wherein fabricating a plurality of resonators on the superconducting fabrication stack comprises fabricating a plurality of resonators on a metal layer overlying a dielectric layer in the superconducting fabrication stack.

10. The method of claim 9 wherein fabricating a plurality of resonators on a metal layer overlying a dielectric layer in the superconducting fabrication stack comprises etching a plurality of resonators on a metal layer overlying a dielectric layer in the superconducting fabrication stack.

11. A method of conducting spatial noise measurements in a superconducting fabrication stack, the superconducting fabrication stack comprising a plurality of resonators, each resonator having a different resonator geometry, and the superconducting fabrication stack comprising a plurality of spatial regions, the method executed by a digital processor and comprising:

measuring data from the plurality of resonators;

calculating fill fractions for each spatial region in the plurality of spatial regions of the superconducting fabrication stack based on electromagnetic (EM) field modeling and respective dimensions of each resonator geometry; and

determining a spin density for each spatial region in the plurality of spatial regions of the superconducting fabrication stack based on the data measured from the plurality of resonators and the calculated fill fractions.

12. The method of claim 11 , wherein measuring data from the plurality of Resonators comprises measuring spectra of each resonator in the plurality of resonators using on-chip electron-spin resonance (cESR); and determining a spin density for each spatial region in the plurality of spatial regions of the superconducting fabrication stack based on the data measured from the plurality of resonators and the calculated fill fractions comprises determining a spin density for each spatial region in the plurality of spatial regions of the superconducting fabrication stack based on the cESR spectra measured from the plurality of resonators and the calculated fill fractions.

13. The method of claim 12 , wherein measuring spectra of each resonator in the plurality of resonators using on-chip electron-spin resonance (cESR) comprises measuring cESR spectra of each resonator in the plurality of resonators, wherein each resonator has a unique resonance frequency.

14. The method of claim 11 , wherein measuring data from the plurality of resonators comprises measuring data from a plurality of coplanar waveguide resonators.

15. The method of claim 11 wherein measuring data from the plurality of resonators comprises measuring data from the plurality of resonators, wherein there are as many resonators as spatial regions.

16. The method of claim 11 , wherein calculating fill fractions for each spatial region of the plurality of spatial regions of the superconducting fabrication stack comprises calculating fill fractions for each spatial region of the plurality of spatial regions of a superconducting fabrication stack, at least one spatial region of the plurality of spatial regions comprising at least one of: niobium, aluminum, tantalum, niobium nitride, titanium nitride, or niobium titanium nitride.

17. The method of claim 11 , wherein collecting data from the plurality of resonators comprises collecting data from the plurality of resonators fabricated on a metal layer overlaying a dielectric layer in the superconducting fabrication stack.

18. The method of claim 11 , wherein calculating fill fractions for each spatial region in the plurality of spatial regions comprises calculating fill fractions for each spatial region in the plurality of spatial regions, at least one spatial region of the plurality of spatial regions comprising a material interface.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2025
From: PSPIB UNITAS INVESTMENTS II INC.
To: D-WAVE SYSTEMS INC.; 1372934 B.C. LTD.
Reel/Frame 070470/0098 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2025
From: WHITTAKER, JED D.; HARRIS, RICHARD; DESHPANDE, RAHUL
To: D-WAVE SYSTEMS INC.
Reel/Frame 070411/0488 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT (PROJECT INTELLECTUAL PROPERTY) Recorded Jul 7, 2023
From: D-WAVE SYSTEMS INC
To: PSPIB UNITAS INVESTMENTS II INC., AS COLLATERAL AGENT
Reel/Frame 064235/0051 →
Continuity (2)
Provisional Application 63276113 · Nov 5, 2021
Related Publication 20230400510A1 · Dec 14, 2023
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