RF absorbing structures
RF absorbing structures include a dielectric layer, such as polycarbonate, and one or more layers of a carbon resistive material, such as carbon ink. The RF absorbing structures can further include one or more layers of a conductive material, such as silver ink.
1. An RF absorbing structure, comprising:
a first dielectric layer of a dielectric material;
a first upper film that includes a resistive carbon material disposed on an upper surface of the first dielectric layer; and
a first lower film of the resistive carbon material disposed on a lower surface of the first dielectric layer.
2. The structure of claim 1 , wherein the first upper film further includes a conductive material.
3. The structure of claim 1 , wherein the first upper film is arranged in a first pattern.
4. The structure of claim 3 , wherein the RF absorbing structure has a selected frequency range for RF absorption, and the first pattern is a periodic pattern having a feature size substantially less than a free-space wavelength corresponding to the selected frequency range.
5. The structure of claim 3 , wherein the RF absorbing structure has a selected frequency range for RF absorption, and the first pattern is a random or pseudorandom pattern having a feature size substantially less than a free-space wavelength corresponding to the selected frequency range.
6. The structure of claim 1 , wherein the first lower film is arranged in a second pattern.
7. The structure of claim 6 , wherein the RF absorbing structure has a selected frequency range for RF absorption, and the second pattern is a periodic pattern having a feature size substantially less than a free-space wavelength corresponding to the selected frequency range.
8. The structure of claim 6 , wherein the RF absorbing structure has a selected frequency range for RF absorption, and the second pattern is a random or pseudorandom pattern having a feature size substantially less than a free-space wavelength corresponding to the selected frequency range.
9. The structure of claim 1 , further comprising:
a first adhesive layer disposed on a lower surface of the first lower film.
10. The structure of claim 9 , wherein:
the first dielectric layer is one of a plurality of dielectric layers;
the first upper film is one of a plurality of upper films;
the first lower film is one of a plurality of lower films;
the first adhesive layer is one of a plurality of adhesive layers; and
the pluralities are arranged as a laminate structure with repeating layers of upper film, dielectric, lower film, and adhesive, in that order.
11. An RF absorbing structure, comprising:
a first dielectric layer of a dielectric material;
a first upper film that includes a resistive carbon material disposed on an upper surface of the first dielectric layer; and
a first adhesive layer disposed on a lower surface of the first dielectric layer.
12. The structure of claim 11 , wherein:
the first dielectric layer is one of a plurality of dielectric layers;
the first upper film is one of a plurality of upper films;
the first adhesive layer is one of a plurality of adhesive layers; and
the pluralities are arranged as a laminate structure with repeating layers of film, dielectric, and adhesive, in that order.
13. An apparatus, comprising:
a first RF antenna aperture;
a second RF antenna aperture; and
an RF absorbing structure disposed on a surface between the first RF antenna aperture and the second RF antenna aperture, wherein the RF absorbing structure comprises a first dielectric layer of a dielectric material and a first upper film that includes a resistive carbon material disposed on an upper surface of the first dielectric layer.
14. The apparatus of claim 13 , wherein the RF absorbing structure is arranged to at least partially improve sidelobe characteristics of the first RF antenna aperture or the second RF antenna aperture.
15. The apparatus of claim 13 , wherein the RF absorbing structure is arranged to at least partially improve RF isolation between the first RF antenna aperture and the second RF antenna aperture.
16. A method, comprising:
applying an upper film of a resistive carbon material to an upper surface of a dielectric layer of a dielectric material; and
cutting the dielectric layer with the applied upper film to provide a set of sheets or patches with a selected shape.
17. The method of claim 16 , wherein the first upper film includes a conductive material.
18. The method of claim 16 , further comprising:
applying a lower film of the resistive carbon material to a lower surface of the dielectric layer.
19. The method of claim 18 , further comprising:
applying an adhesive layer to a lower surface of the lower film.
20. The method of claim 16 , wherein the dielectric material is a plastic material.
21. The method of claim 20 , wherein the method is a roll-to-roll process.
22. The method of claim 21 , wherein the roll-to-roll process includes:
unrolling a roll of the dielectric material to present the dielectric layer for the applying of the upper film; and
rolling a second roll of the dielectric material with the applied upper film.
23. The method of claim 22 , wherein the applying of the upper film includes:
coating the upper surface of the dielectric layer with the resistive carbon material.
24. The method of claim 16 , further comprising:
applying an adhesive layer to a lower surface of the dielectric layer.
25. The method of claim 16 , further comprising:
stacking the set of sheets or patches to provide a laminar RF absorbing structure.