Fluid-tight electrical connection techniques for semiconductor processing
A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.
1. An assembly for electrical connection to a volume having a fluid, comprising:
a wall that forms a boundary of the volume to contain the fluid;
a conductive wire extending through the volume;
an extraction fitting providing a sealed electrical connection through the wall, wherein the extraction fitting includes an annular plastic body having a passage therethrough, the plastic body has a threaded outer surface that is screwed into a threaded aperture in the wall, the conductive wire is inserted into one end of the passage, and a conductive lug is inserted into an opposite end of the passage and contacts the conductive wire, and the conductive lug has a threaded outer surface that is screwed into a threaded portion at the opposite end of the passage.
2. The assembly of claim 1 , wherein the plastic body is tapered such that the one end of the passage is compressed to form a seal between the conductive wire and an inner surface of the passage.
3. The assembly of claim 1 , wherein the passage includes a lower portion extending from the one end and an upper portion extending from the opposite end, and the upper portion is narrower than the lower portion.
4. The assembly of claim 3 , wherein the conductive wire is compressed between a bottom of the lug and a bottom of the upper portion of the passage.
5. The assembly of claim 1 , further comprising a sealant between the threaded outer surface of the plastic body and the threaded aperture in the wall.
6. The assembly of claim 5 , wherein the sealant comprises polytetrafluoroethylene (PTFE) tape.
7. The assembly of claim 1 , further comprising a sealant between the threaded outer surface of the lug body and the threaded portion of the passage.
8. The assembly of claim 7 , wherein the sealant comprises polytetrafluoroethylene (PTFE) tape.
9. The assembly of claim 1 , wherein the plastic body is polytetrafluoroethylene (PTFE).
10. The assembly of claim 1 , wherein the wall comprises a plastic.
11. The assembly of claim 1 , wherein the fluid comprises steam.
12. The assembly of claim 1 , wherein the conductive wire is made from a noble metal.
13. The assembly of claim 1 , wherein the wall forms a conduit for flow of the fluid to a semiconductor processing system.
14. The assembly of claim 11 , wherein the wall forms a processing chamber of a semiconductor processing system.
15. The assembly of claim 14 , wherein the semiconductor processing system comprises a deposition system, etching system, or thermal processing system.
16. The assembly of claim 14 , wherein the conductive wire is coupled to an antenna or sensor inside the processing chamber.
17. The assembly of claim 1 , comprising a monitoring system or a controller, and a second conductive wire connecting the monitoring system or controller to the conductive lug.
18. The assembly of claim 1 , comprising a second conductive wire connecting the conductive lug to electrical ground.