Multilayer sheet and multilayer electronic device
A multilayer sheet including: a transparent film with a total light transmittance of 85% or more in accordance with ISO 13468; a coating layer disposed on a first surface of the transparent film; and an adhesive layer disposed on a second surface, opposite to the first surface, of the transparent film, wherein a thickness of the adhesive layer after being cured is two times or less of a thickness of the coating layer, is disclosed.
1. A multilayer sheet comprising:
a transparent film with a total light transmittance of 85% or more in accordance with ISO 13468-1:2019, published in 2019 and currently in effect;
a coating layer disposed on a first surface of the transparent film; and
an adhesive layer disposed on a second surface, opposite to the first surface, of the transparent film,
wherein a thickness of the adhesive layer after being cured is two times or less of a thickness of the coating layer, and
wherein the adhesive layer comprises a silicon adhesive-derived repeating unit and a silicon MQ resin-derived repeating unit.
2. The multilayer sheet of claim 1 ,
wherein the adhesive layer has an adhesive force of 80 gf/inch or more per unit thickness (1 μm).
3. The multilayer sheet of claim 1 ,
wherein when a storage modulus of a laminate consisting of the transparent film and the coating layer disposed on the first surface of the transparent film is referred to as SMm and a storage modulus of the adhesive layer is referred to as SMa, a difference between the SMa and the SMm at 0° C. is 2450 MPa or less.
4. The multilayer sheet of claim 1 ,
wherein a storage modulus of the adhesive layer is 0.1 MPa or more at 60° C.
5. The multilayer sheet of claim 1 ,
wherein when a storage modulus of a laminate consisting of the transparent film and the coating layer disposed on the first surface of the transparent film is referred to as SMm and a storage modulus of the adhesive layer is referred to as SMa, a difference between the SMa and the SMm at 60° C. is 2200 MPa or less.
6. The multilayer sheet of claim 1 ,
wherein the adhesive layer has an adhesive force of 200 gf/inch or more after being cured.
7. The multilayer sheet of claim 1 ,
wherein the adhesive layer has a thickness of 1 μm or more after being cured.
8. The multilayer sheet of claim 1 ,
wherein a sum of thicknesses of the coating layer and the adhesive layer is 30 μm or less.
9. The multilayer sheet of claim 1 ,
wherein the multilayer sheet further comprises a release film disposed on a surface of the adhesive layer, wherein the adhesive layer is disposed between the transparent film and the release film.
10. The multilayer sheet of claim 1 ,
wherein the adhesive layer comprises the silicon MQ resin-derived repeating unit in an amount of 5 parts by weight to 90 parts by weight based on the silicon adhesive-derived repeating unit of 100 parts by weight.
11. A multilayer electronic device comprising:
a multilayer sheet comprising:
a transparent film with a total light transmittance of 85% or more in accordance with ISO 13468-1:2019, published in 2019 and currently in effect;
a coating layer disposed on a first surface of the transparent film; and
an adhesive layer disposed on a second surface, opposite to the first surface, of the transparent film; and
a radiant functional layer disposed on a surface of the adhesive layer of the multilayer sheet,
wherein the adhesive layer is disposed between the transparent film and the radiant functional layer, and
wherein the adhesive layer comprises a silicon adhesive-derived repeating unit and a silicon MQ resin-derived repeating unit.
12. The multilayer electronic device of claim 11 ,
wherein a thickness of the adhesive layer after being cured is two times or less of a thickness of the coating layer.
13. The multilayer electronic device of claim 11 ,
wherein the adhesive layer has an adhesive force of 80 gf/inch or more per unit thickness (1 μm).
14. The multilayer electronic device of claim 11 ,
wherein when a storage modulus of a laminate consisting of the transparent film and the coating layer disposed on the first surface of the transparent film is referred to as SMm and a storage modulus of the adhesive layer is referred to as SMa, a difference between the SMa and the SMm at 0° C. is 2450 MPa or less.
15. The multilayer electronic device of claim 11 ,
wherein a storage modulus of the adhesive layer is 0.1 MPa or more at 60° C.
16. The multilayer electronic device of claim 11 ,
wherein the adhesive layer has an adhesive force of 200 gf/inch or more after being cured.
17. The multilayer electronic device of claim 11 ,
wherein a sum of thicknesses of the coating layer and the adhesive layer is 30 μm or less.
18. The multilayer electronic device of claim 11 ,
wherein the multilayer electronic device further comprises an elastic layer disposed between the adhesive layer and the radiant functional layer.
19. The multilayer sheet of claim 11 ,
wherein the adhesive layer comprises the silicon MQ resin-derived repeating unit in an amount of 5 parts by weight to 90 parts by weight based on the silicon adhesive-derived repeating unit of 100 parts by weight.