Granted Patent B2

US 12,546,851 · App. 17/978,701 · Granted Feb 10, 2026

Inventors: Sam El-Akkad (Poway, CA); Christopher Fischer (Lake Forest, CA); Travis Whitaker (Costa Mesa, CA); Bryden Pearson (Irvine, CA); Todd Berk (Lake Forest, CA); Thao Pham (San Diego, CA); Jon Hsu (Yorba Linda, CA); Cameron Dart (Fountain Valley, CA)

Assignee: Anduril Industries, Inc.

G01S7/027G01S13/46G01S13/75G01S2013/466

Abstract

Claims (49)

1 . A method of assembling an RF system, the method comprising:

providing a module enclosure;

providing one or more modules in the module enclosure, the one or more modules comprising at least one of: a power supply module, an RF module, or a processing module;

providing one or more heat sinks disposed along a central axis of the module enclosure defining a central core and thermally coupled to the one or more modules, wherein the one or more modules are positioned around the central core within the module enclosure;

coupling upper and lower enclosures to the module enclosure, wherein the upper and lower enclosures each comprise a respective fan that is aligned along the central axis and configured to drive airflow through the central core; and

providing communications links and power connections among the one or more modules.

2 . The method of claim 1 further comprising:

coupling one or more antennas to exterior portions of the module enclosure; and

providing communications links between the one or more antennas and one or more of the one or more modules.

3 . The method of claim 2 further comprising:

mounting the RF system so that the upper enclosure is oriented at a top of the RF system.

4 . The method of claim 2 , wherein coupling the one or more antennas to the exterior portions of the module enclosure further comprises sliding a first coupling feature of an antenna mount into a track on a side of the module enclosure.

5 . The method of claim 4 , wherein coupling the one or more antennas to the exterior portions of the module enclosure further comprises inserting pivot point of an antenna bracket into the first coupling feature.

6 . The method of claim 5 , wherein coupling the one or more antennas to the exterior portions of the module enclosure further comprises coupling a second coupling feature of the antenna mount to a fixed mount on a side of the module enclosure by insertion of a self-locking pin.

7 . The method of claim 5 , wherein coupling the one or more antennas to the exterior portions of the module enclosure further comprises coupling an antenna of the one or more antennas to the antenna bracket.

8 . The method of claim 1 wherein the one or more heat sinks is thermally coupled to the one or more modules via a thermal interface that allows for heat transfer between the one or more modules and the one or more heat sinks.

9 . The method of claim 1 , wherein the one or more modules are separated from the one or more heat sinks by a thermal interface.

10 . A method of assembling an RF system, the method comprising:

providing a first module enclosure;

providing a first one or more modules in the first module enclosure, the first one or more modules comprising at least one of: a power supply module, an RF module, or a processing module;

providing a first one or more heat sinks disposed along a first central axis of the first module enclosure and thermally coupled to the first one or more modules arranged around the first central axis, wherein the first module is positioned around the first central axis;

providing a second module enclosure;

providing a second one or more modules in the second module enclosure, the second one or more modules comprising at least one of: a power supply module, an RF module, or a processing module;

providing a second one or more heat sinks disposed along a second central axis of the second module enclosure and thermally coupled to the second one or more modules arranged around the second central axis, wherein the second module is positioned around the second central axis;

coupling the first module enclosure to the second module enclosure using a joining enclosure;

coupling an upper enclosure to the first module enclosure, wherein the upper enclosure comprises an upper fan that is aligned along the first central axis and configured to drive airflow through the first central axis;

coupling a lower enclosure to the second module enclosure, wherein the lower enclosure comprises a lower fan that is aligned along the second central axis and configured to drive airflow through the second central axis; and

providing communications links and power connections among the first and second one or more modules.

11 . The method of claim 10 further comprising:

coupling one or more antennas to exterior portions of at least one of the first module enclosure of the second module enclosure; and

providing communications links between the one or more antennas and one or more of the first one or more modules and the second one or more modules.

12 . The method of claim 11 further comprising:

mounting the RF system so that the upper enclosure is oriented at a top of the RF system.

13 . The method of claim 10 , wherein the first central axis and second central axis are the same.

14 . A module enclosure configured to:

receive one or more modules in the module enclosure, the one or more modules comprising at least one of: a power supply module, an RF module, or a processing module;

receive one or more heat sinks disposed along a central axis and in a central portion of the module enclosure and thermally coupled to the one or more modules, wherein the one or more modules are positioned around the central portion within the module enclosure;

allow for coupling of upper and lower enclosures to the module enclosure, wherein the upper and lower enclosures each comprise a respective fan that is aligned along the central axis and configured to drive airflow through the central axis; and

allow for coupling of communications links and power connections among the one or more modules.

15 . The module enclosure of claim 14 further configured to:

allow for coupling of one or more antennas to exterior portions of the module enclosure; and

allow for coupling of a communications links between the one or more antennas and one or more of the one or more modules.

16 . The module enclosure of claim 15 , further configured to receive a first coupling feature of an antenna mount into a track on a side of the module enclosure.

17 . The module enclosure of claim 16 , further configured to receive a pivot point of an antenna bracket into the first coupling feature.

18 . The module enclosure of claim 14 further configured to:

allow for mounting of an RF system so that the upper enclosure is oriented at a top of the RF system.

19 . The module enclosure of claim 14 wherein the one or more heat sinks is thermally coupled to the one or more modules via a thermal interface that allows for heat transfer between the one or more modules and the one or more heat sinks.

20 . The module enclosure of claim 14 , further comprising:

one or more manually operable coupling elements that are configured to detachably secure the upper and lower enclosures without tools.

Assignments (2)

Continuity (3)

References Cited (108)