Modular system for detecting, tracking, and transmitting to identified objects
A modular, radio frequency (“RF”) system includes one or more directional antennas and is configured with both hardware and software components to enable the RF system to monitor (e.g., detect or track signals or objects) and/or interact with (e.g., track signals or objects, or transmit signals) objects in particular directions. The RF system includes one or more machine learning models to determine, based on received signals, one or more signals to transmit.
1 . An RF transceiver system comprising:
a first module enclosure comprising:
a first inner portion comprising a first cavity, and
a first peripheral portion that surrounds the first cavity, the first peripheral portion being sealed from liquids, and surrounds or encloses a first one or more modules;
a first one or more heat sinks positioned in the first inner portion of the first module enclosure;
a first one or more thermal interfaces on at least one wall of the first inner portion of the first module enclosure and configured to provide thermal coupling between the first one or more heat sinks and the first one or more modules; and
a first fan configured to cause air to flow through the first cavity and the first one or more heat sinks, wherein the first cavity is open on a top and a bottom to enable airflow from the bottom to the top of the RF transceiver system, the airflow passing across the first one or more heat sinks to dissipate heat generated by the first one or more modules.
2 . The RF transceiver system of claim 1 , further comprising:
a lower enclosure coupled to the bottom of the first module enclosure and supporting the first fan, wherein the lower enclosure includes one or more intake vents, wherein the first fan is configured to draw air upward from the lower enclosure through the first cavity and across the first one or more heat sinks to an upper end of the RF transceiver system.
3 . The RF transceiver system of claim 1 , further comprising:
a second fan configured to cause air to flow through the first cavity and the first one or more heat sinks.
4 . The RF transceiver system of claim 3 , further comprising:
an upper enclosure supporting the second fan, wherein the upper enclosure includes one or more exhaust vents.
5 . The RF transceiver system of claim 4 , further comprising:
a second module enclosure comprising:
a second inner portion comprising a second cavity that is open on a top and a bottom, and
a second peripheral portion that surrounds or encloses a second one or more modules;
a second one or more heat sinks positioned in the second inner portion of the second module enclosure; and
a second one or more thermal interfaces on at least one wall of the second inner portion of the second module enclosure and configured to provide thermal coupling between the second one or more heat sinks and the second one or more modules.
6 . The RF transceiver system of claim 5 , wherein the first module enclosure is coupled to the second module enclosure to provide an alignment between the first cavity and the second cavity.
7 . The RF transceiver system of claim 6 , wherein the upper enclosure is coupled to the top of the second module enclosure.
8 . The RF transceiver system of claim 1 , wherein the first cavity is also sealed from fluids, hermetically sealed, and airtight.
9 . The RF transceiver system of claim 1 , wherein the first cavity is configured to provide for electromagnetic interference (EMI) shielding.
10 . The RF transceiver system of claim 1 , wherein the first one or more thermal interfaces comprise heat spreaders, conductive walls, or equivalent thermally conductive members.
11 . The RF transceiver system of claim 1 , wherein the first one or more modules comprise at least one RF module being operatively coupled to at least one directional antenna supported by the first module enclosure.
12 . The RF transceiver system of claim 5 , wherein the second module enclosure is coupled to the first module enclosure such that the second cavity is aligned with the first cavity, and the first fan is configured to cause air to flow through both the first cavity and the second cavity to cool the first and second module enclosures.