DIELECTRIC SPACER FOR ANTENNA ASSEMBLY

1 . A dielectric layer for use in an antenna assembly, the dielectric layer comprising:

a planar body formed using a dielectric material; and

a plurality of openings defined in the planar body and surrounding a plurality of portions of the dielectric material, each of the plurality of portions of the dielectric material being configured to be aligned with an antenna element of a plurality of antenna elements of the antenna assembly.

2 . The dielectric layer of claim 1 , wherein the dielectric layer is configured to be positioned between a printed circuit board (PCB) assembly and at least one antenna layer that at least partially forms the antenna assembly.

3 . The dielectric layer of claim 1 , wherein each of the plurality of openings has a circular shape.

4 . The dielectric layer of claim 1 , wherein the dielectric material has a dielectric constant of between 2.5 and 3.5.

5 . The dielectric layer of claim 4 , wherein the dielectric material has a coefficient of thermal expansion (CTE) of between 15 parts per million per degree Celsius (ppm/° C.) and 25 ppm/° C.

6 . The dielectric layer of claim 1 , wherein the plurality of portions of the dielectric material is surrounded by 6 openings of the plurality of openings.

7 . The dielectric layer of claim 1 , wherein the plurality of openings increases a scan angle of the antenna assembly by at least 1.5 percent.

8 . The dielectric layer of claim 1 , wherein the dielectric material has flame retardant properties.

9 . The dielectric layer of claim 1 , wherein the dielectric material includes at least about 5% decabromodiphenyl ethane (DBDPE).

10 . An antenna assembly comprising:

a printed circuit board (PCB) assembly;

at least one antenna layer at least partially forming a plurality of antenna elements; and

a dielectric layer located between the PCB assembly and the at least one antenna layer and having a dielectric constant of between 2.5 and 3.5 and a coefficient of thermal expansion (CTE) of between 15 parts per million per degree Celsius (ppm/° C.) and 25 ppm/° C.

11 . The antenna assembly of claim 10 , wherein the dielectric layer includes:

a planar body; and

a plurality of openings defined by the planar body and surrounding a plurality of portions of the dielectric material.

12 . The antenna assembly of claim 11 , wherein each of the plurality of portions of the dielectric material are aligned with an antenna element of the plurality of antenna elements.

13 . The antenna assembly of claim 11 , wherein the plurality of openings increases a scan angle of the antenna assembly by at least 1.5 percent.

14 . The antenna assembly of claim 11 , wherein each of the plurality of openings has a circular shape.

15 . A method of assembling an antenna assembly, the method comprising:

obtaining at least one antenna layer at least partially forming a plurality of antenna elements;

obtaining a printed circuit board (PCB) assembly;

obtaining a dielectric layer having a planar body formed using a dielectric material, and a plurality of openings defined by the planar body and surrounding a plurality of portions of the dielectric material; and

stacking the dielectric layer between the at least one antenna layer and the PCB assembly such that each of the plurality of portions of the dielectric material is aligned with an antenna element of the plurality of antenna elements.

16 . The method of claim 15 , further comprising coupling the at least one antenna layer, the PCB assembly, and the dielectric layer together.

17 . The method of claim 15 , wherein obtaining the dielectric layer includes obtaining the dielectric layer to have a dielectric constant of between 2.5 and 3.5 and a coefficient of thermal expansion (CTE) of between 15 parts per million per degree Celsius (ppm/° C.) and 25 ppm/° C.