IP Library Granted Patent US 11,942,279
Granted Patent B2
US 11,942,279 · App. 17/988,298 · Granted Mar 26, 2024

Tantalum capacitor

Inventors: Jin Ho Hong (Suwon-si, KR); Young Seuck Yoo (Suwon-si, KR); Hee Sung Choi (Suwon-si, KR); Young June Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G9/025H01G9/15H01G2009/05H01G9/052
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Quick Facts
Patent No.
US 11,942,279
App. No.
17/988,298
Granted
Mar 26, 2024
Kind
B2
Abstract

A tantalum capacitor includes a tantalum body comprising a tantalum sintered body containing tantalum powder, a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and a tantalum wire. The first filler includes a core including at least one metal oxide among BaTiO 3 , Al 2 O 3 , SiO 2 and ZrO 2 , and a coating film disposed on a surface of the core.

Claims (44)

1. A tantalum capacitor comprising:

a tantalum body comprising

a tantalum sintered body containing tantalum particle,

a conductive polymer layer disposed on the tantalum sintered body and including a first filler as a non-conductive particle, and

a tantalum wire,

wherein the first filler includes a core including at least one metal oxide among BaTiO 3 , Al 2 O 3 , SiO 2 and ZrO 2 , and a coating film disposed on a surface of the core.

2. The tantalum capacitor of claim 1 , wherein the coating film comprises poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS).

3. The tantalum capacitor of claim 2 , wherein the core of the first filler is SiO 2 .

4. The tantalum capacitor of claim 2 , wherein the coating film is coupled to the core by a coupling agent.

5. The tantalum capacitor of claim 4 , wherein the coupling agent is covalently bonded to the surface of the core and is bonded to the PSS in the coating film.

6. The tantalum capacitor of claim 5 , wherein the PEDOT in the coating film is ionically bonded to the PSS in the coating film.

7. The tantalum capacitor of claim 6 , wherein the conductive polymer layer comprises poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS).

8. The tantalum capacitor of claim 7 , wherein the conductive polymer layer further comprises a second filler as conductive particles.

9. The tantalum capacitor of claim 8 , wherein the second filler comprises at least one of graphene, carbon nanotubes, and carbon black.

10. The tantalum capacitor of claim 9 , wherein the second filler comprises a metal oxide coating film coated on a surface of the second filler.

11. The tantalum capacitor of claim 10 , wherein the tantalum body further comprises:

a carbon layer disposed on the conductive polymer layer; and

a silver (Ag) layer disposed on the carbon layer, and

the tantalum wire penetrates through at least a portion of each of the tantalum sintered body, the conductive polymer layer, the carbon layer, and the silver (Ag) layer.

12. The tantalum capacitor of claim 11 , wherein the tantalum capacitor includes,

a molded portion including a fifth surface and a sixth surface opposing in a first direction, a third surface and a fourth surface opposing in a second direction, and a first surface and a second surface opposing in a third direction, the molded portion surrounding the tantalum body,

an anode lead frame extending from the second surface of the molded portion and electrically connected to the tantalum wire; and

a cathode lead frame spaced apart from the anode lead frame and extending from the second surface of the molded portion.

13. A tantalum capacitor comprising:

a tantalum body comprising

a tantalum sintered body containing tantalum particle,

a conductive polymer layer disposed on the tantalum sintered body and including a first filler, and

a tantalum wire,

wherein the first filler includes a core and a coating film disposed on a surface of the core, and

the coating film includes poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS).

14. The tantalum capacitor of claim 13 , wherein the core of the first filler comprises an oxide including at least one of Ba, Ti, Al, Si and Zr.

15. The tantalum capacitor of claim 13 , wherein a cross-sectional area ratio of the first filler with respect to one cross-section of the conductive polymer layer is greater than 0.41 and less than 0.81.

16. A tantalum capacitor comprising:

a tantalum body comprising

a tantalum sintered body containing a tantalum particle, and

a conductive polymer layer disposed on the tantalum sintered body and including a first filler having a core-shell structure including a core including a metal oxide.

17. The tantalum capacitor of claim 16 , wherein the metal oxide includes at least one of Ba, Ti, Al, Si and Zr.

18. The tantalum capacitor of claim 16 , wherein the shell includes a first conductive polymer.

19. The tantalum capacitor of claim 18 , wherein the first conductive polymer includes poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS).

20. The tantalum capacitor of claim 18 , wherein the conductive polymer layer further includes a second conductive polymer.

21. The tantalum capacitor of claim 20 , wherein the first and second conductive polymers include the same material.

22. The tantalum capacitor of claim 16 , wherein a cross-sectional area ratio of the first filler with respect to one cross-section of the conductive polymer layer is greater than 0.41.

23. The tantalum capacitor of claim 16 , wherein a cross-sectional area ratio of the first filler with respect to one cross-section of the conductive polymer layer is greater than 0.41 and less than 0.81.

24. The tantalum capacitor of claim 16 , wherein the tantalum body further comprises a tantalum wire.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2022
From: HONG, JIN HO; YOO, YOUNG SEUCK; CHOI, HEE SUNG; LEE, YOUNG JUNE
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 061795/0841 →
Priority Claims (1)
KR 10-2021-0192931 · Dec 30, 2021 · national
Continuity (1)
Related Publication 20230215663A1 · Jul 6, 2023