IP Library Granted Patent US 12,033,674
Granted Patent B2
US 12,033,674 · App. 17/991,620 · Granted Jul 9, 2024

Reduction of high tape contact pressure points against head assembly

Inventors: Oscar J. Ruiz (San Jose, CA); Kenji Kuroki (Fujisawa, JP); Eduardo Torres Mireles (San Jose, CA)
Assignee: Western Digital Technologies, Inc.
G11B5/2655G11B5/255G11B5/40G11B15/60
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Quick Facts
Patent No.
US 12,033,674
App. No.
17/991,620
Granted
Jul 9, 2024
Kind
B2
Abstract

The present disclosure generally relates to a head assembly in a data storage device. The data storage device may include magnetic media embedded in the device or magnetic media from an insertable cassette or cartridge (e.g., in an LTO drive), where the head assembly reads from and writes to the magnetic media. During device operation, the magnetic media moves across the head assembly. The magnetic media experiences higher contact stress at certain points or portions of the head assembly. A sensor guard is coupled to the head assembly. The sensor guard comprises at least one chamfered surface or at least one stepped surface to decrease the contact stress between the magnetic media and the head assembly during device operation. The at least one chamfered or stepped surface may be disposed on a leading edge of the sensor guard.

Claims (22)

1. A magnetic recording head assembly, configured to read from and write to a magnetic media, comprising:

one or more rows of chiplets, each of the one or more rows of chiplets having a leading edge, a trailing edge, a first side edge, and a second side edge, the first and second side edges being disposed between the leading edge and the trailing edge; and

one or more sensor guards disposed adjacent to at least one of the first side edge and the second side edge of each of the one or more of rows of chiplets, wherein each of the one or more sensor guards comprises:

a first surface disposed at a first media facing surface (MFS);

a second surface disposed perpendicular to the first surface; and

a chamfered surface coupling the first surface to the second surface, wherein the chamfered surface of each of the one or more sensor guards has a first ratio of depth to width between about 0.01 and about 0.2 so as to enable contact of the magnetic media during read and write operations.

2. The magnetic recording head assembly of claim 1 , wherein the chamfered surface is a flat surface.

3. The magnetic recording head assembly of claim 1 , wherein the chamfered surface is a convex surface.

4. The magnetic recording head assembly of claim 1 , wherein a first sensor guard is disposed adjacent to the first side edge and a second sensor guard is disposed adjacent to the second side edge.

5. The magnetic recording head assembly of claim 1 , wherein the chamfered surface of each of the one or more sensor guards has a length substantially equal to a length of the first side edge or the second side edge.

6. The magnetic recording head assembly of claim 1 , wherein each row of chiplets has a second MFS, the first MFS of each of the one or more sensor guards and the second MFS of each row of chiplets forms one continuous MFS.

7. A magnetic recording device comprising the magnetic recording head assembly of claim 1 .

8. A magnetic recording head assembly, configured to read from and write to a magnetic media, comprising:

one or more rows of chiplets, each of the one or more rows of chiplets having a leading edge, a trailing edge, a first side edge, and a second side edge, the first and second side edges being disposed between the leading edge and the trailing edge;

a first sensor guard disposed adjacent to the first side edge of each of the one or more of rows of chiplets; and

a second sensor guard disposed adjacent to the second side edge of each of the one or more of rows of chiplets, wherein each of the first and second sensor guards comprises:

a first surface disposed at a first media facing surface (MFS);

a second surface disposed perpendicular to the first surface; and

a chamfered surface coupling the first surface to the second surface, wherein the chamfered surface of each of the first and second sensor guards has a first ratio of depth to width between about 0.01 and about 0.2 so as to enable contact of the magnetic media during read and write operations.

9. The magnetic recording head assembly of claim 8 , wherein the chamfered surface of each of the one or more sensor guards has a length substantially equal to a length of the first side edge or the second side edge.

10. The magnetic recording head assembly of claim 8 , wherein each row of chiplets has a second MFS, the first MFS of each of the first and second sensor guards and the second MFS of each row of chiplets forms one continuous MFS.

11. A magnetic recording device comprising the magnetic recording head assembly of claim 8 .

Assignments (3)
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2022
From: RUIZ, OSCAR J.; KUROKI, KENJI; TORRES MIRELES, EDUARDO
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 062032/0240 →
Continuity (3)
Continuation In Part 17184547 · Feb 24, 2021
Provisional Application 63068632 · Aug 21, 2020
Related Publication 20230087767A1 · Mar 23, 2023