EMITTER AND METHOD FOR PLASMA FUSING OF MATERIALS

1 . An emitter for plasma fusing of materials, comprising:

a discharge device defining an emitter or an emitter array configured to create a directed plasma to transfer energy to a target object; and

a plasma generating electrical system including a power source and two poles, wherein one of said two poles is connected to the target object and the other of said two poles is connected to the discharge device.

2 . The emitter of claim 1 , wherein a ratio of extents of the discharge device to a gap between the discharge device and the target object is greater than 1 to 1.

3 . The emitter of claim 1 , further comprising an applicator.

4 . The emitter of claim 3 , wherein the discharge device directly contacts the applicator allowing the plasma to be generated directly through the target object.

5 . The emitter of claim 1 , wherein a material of the target object is conductive and is connected to one pole of a plasma-generating electrical system.

6 . The emitter of claim 1 , wherein the discharge device is proximate to the target object on a device-under-build (DUB).

7 . The emitter of claim 1 , wherein the emitter defines a surface dielectric barrier discharge device (SDBD).

8 . The emitter of claim 7 , wherein the SDBD comprises a silicon wafer having an array of cathode pads and anode pads on a surface of the SDBD, the array of cathode pads and anode pads covered with a layer of material having a high dielectric constant defining the target object.

9 . An additive manufacturing system, comprising:

a support bed, including a build surface;

an applicator head; wherein the support bed is moveable relative to the applicator head; and

a discharge device, mounted over the support bed.

10 . The additive manufacturing system of claim 9 , wherein a target object is disposed on the support bed.

11 . The additive manufacturing system of claim 9 , wherein the applicator head is mounted on a first gantry and the discharge device is mount on a second gantry.

12 . A process for plasma fusing of a target object, comprising:

disposing a target object on a support bed with an applicator;

discharging plasma from a plasma discharge device defining an emitter or an emitter array; and

altering the target object with the discharged plasma.

13 . The process of claim 12 , wherein altering the target object comprises fusing the target object to a device under build.

14 . The process of claim 12 , wherein the target object comprises a polymer material and altering the target object further comprises de-binding the target object from an other material.

15 . The process of claim 12 , wherein the other material comprises metal.

16 . The process of claim 12 , wherein the target object comprises a vaporizable material and altering the target object further comprises vaporizing the target object.

17 . The process of claim 12 , wherein the applicator provides the target object in powder form and the target object is applied directly onto the discharge device.

18 . The process of claim 17 , further comprising:

moving the discharge device proximate to the applicator allowing the plasma to pass through the target object; and

fusing the target object.

19 . The process of claim 12 , wherein a material of the target object is conductive and is connected to one pole of a plasma-generating electrical system.

20 . The process of claim 12 , further comprising:

moving the discharge device proximate to the target object on a device-under-build (DUB); and

firing a power source, wherein a geometry of the target object is imaged into a desired geometry.

21 . The process of claim 12 , further comprising selectively energizing portions of the discharge device.

22 . The process of claim 12 , further comprising discharging the plasma in multiple successive shots of applied energy to the target object.