Substrate carrier and substrate assembly comprising the same
A substrate carrier and a substrate assembly comprising the same are provided. The substrate carrier comprises an accommodation space; a guide unit disposed adjacent to the accommodation space; and a supporting unit disposed under the accommodation space and the guide unit. The guide unit comprises a circular shape or an arc shape in the circumference when viewed from an upper position.
1 . A substrate carrier, comprising:
a quadrangular accommodation space configured to accommodate a quadrangular substrate;
a guide unit adjacent to the accommodation space and having a continuous annular structure extending around a periphery of the accommodation space; and
a supporting unit and a fixing unit,
wherein the supporting unit is disposed under both the accommodation space and the guide unit, and supports both the guide unit and a lower surface of the substrate,
wherein the fixing unit is disposed at an inner circumferential surface of the guide unit and comprises a UV curable adhesive material configured to bond the substrate to the guide unit, and
wherein the guide unit has a circular or arc-shaped periphery when viewed from above, comprises a material selected from a polymer or ceramic that is transparent to UV radiation, and has an outer diameter of four inches or greater.
2 . The substrate carrier of claim 1 ,
wherein the guide unit has a thickness in a range from 100 μm to 2000 μm, and the thickness is uniform along a radial direction of the guide unit.
3 . The substrate carrier of claim 1 ,
wherein the accommodation space has a depth less than a height of the guide unit, such that an upper surface of the substrate is recessed relative to an upper surface of the guide unit.
4 . The substrate carrier of claim 1 ,
wherein the supporting unit has a thickness in a range from 50 μm to 200 μm.
5 . The substrate carrier of claim 1 ,
wherein the supporting unit comprises an ultraviolet (UV) curable adhesive layer disposed below the substrate.
6 . A substrate assembly, comprising:
a substrate carrier according to claim 1 ,
wherein the quadrangular substrate is a target substrate disposed in the accommodation space, and
wherein the target substrate and the substrate carrier are bonded to form a single integral structure via the UV curable adhesive material.
7 . The substrate assembly of claim 6 ,
wherein the target substrate is selected from at least one of a silicon-based ceramic substrate, a glass-based ceramic substrate, a glass substrate, and combinations thereof.
8 . The substrate assembly of claim 6 ,
wherein an area of the target substrate is in a range from approximately 1.5×10 5 mm 2 to approximately 4×10 5 mm 2 .
9 . The substrate assembly of claim 6 ,
wherein the target substrate and the guide unit are configured to have an interval of 0.5 mm to 20 mm.
10 . The substrate assembly of claim 9 ,
wherein at least a portion of the interval is filled with a filling material.