IP Library Granted Patent US 12,334,754
Granted Patent B2
US 12,334,754 · App. 18/016,585 · Granted Jun 17, 2025

Wireless power transmission apparatus

Inventors: Kyunghwan Kim (Seoul, KR); Seonghun Lee (Seoul, KR); Taewook Kwon (Seoul, KR); Hyoungseok Kim (Seoul, KR); Hongkwon Kim (Seoul, KR)
Assignee: LG ELECTRONICS INC.
H02J50/70H01F27/36H02J50/12
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Quick Facts
Patent No.
US 12,334,754
App. No.
18/016,585
Granted
Jun 17, 2025
Kind
B2
Abstract

A wireless power transmission apparatus includes a shielding plate, a transmission coil on the shielding plate, and a shielding member disposed on the shielding plate and configured to surround the transmission coil. The shielding plate may shield a magnetic field formed to a lower side of the transmission coil. The shield member can offset the magnetic field formed on the side of the transmission coil. Thus, the embodiment can minimize EMI or EMF caused by the magnetic field formed on the lower side and the side of the transmission coil.

Claims (28)

1. A wireless power transmission apparatus, comprising:

a shielding plate;

a transmission coil on the shielding plate; and

a shielding member disposed on the shielding plate and configured to surround the transmission coil,

wherein the shielding member includes:

a base substrate including an opening;

a shielding layer disposed on the base substrate and configured to surround the transmission coil; and

a resonance capacitor mounted on the base substrate and connected to the shielding layer,

wherein the shielding layer includes two or more layers of pattern coils vertically overlapped,

wherein the base substrate includes vias, and

wherein the base substrate is disposed between three or more layers of pattern coils.

2. The wireless power transmission apparatus of claim 1 , wherein the shielding layer includes a pattern coil disposed on the base substrate.

3. The wireless power transmission apparatus of claim 1 ,

wherein the three or more layers of pattern coils are connected through the vias.

4. The wireless power transmission apparatus of claim 1 ,

wherein the shielding layer has a shape corresponding to a shape of the transmission coil.

5. The wireless power transmission apparatus of claim 1 ,

wherein the shielding layer includes metal.

6. The wireless power transmission apparatus of claim 1 ,

wherein the transmission coil is disposed in the opening.

7. The wireless power transmission apparatus of claim 6 , wherein the diameter of the opening is equal to or greater than the size of the transmission coil.

8. The wireless power transmission apparatus of claim 6 , wherein the opening is a closed loop opening corresponding to a shape of the transmission coil.

9. The wireless power transmission apparatus of claim 1 , wherein the transmission coil and the base substrate are disposed on the same surface.

10. The wireless power transmission apparatus of claim 1 , wherein the shielding layer is spaced apart from the outside of the transmission coil.

11. The wireless power transmission apparatus of claim 1 , further comprising a controller controlling a coupling coefficient between the transmission coil and the shielding layer is 0.35 or less.

12. The wireless power transmission apparatus of claim 1 , wherein the base substrate comprises a rigid base substrate or a flexible base substrate.

13. The wireless power transmission apparatus of claim 1 , wherein the shield member generates a second current obtained by inverting a phase of a first current flowing in the transmission coil.

14. The wireless power transmission apparatus of claim 1 , wherein the shield member generates a second magnetic field for offsetting a first magnetic field generated by the transmission coil.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2024
From: KIM, KYUNGHWAN; LEE, SEONGHUN; KWON, TAEWOOK; KIM, HYOUNGSEOK; KIM, HONGKWON
To: LG ELECTRONICS INC.
Reel/Frame 068449/0136 →
Continuity (1)
Related Publication 20230283119A1 · Sep 7, 2023
References Cited (26)
US 20020057171A1 · Patel · 2002 [cited by examiner]
US 20130088089A1 · Leem · 2013 [cited by examiner]
US 20130181535A1 · Muratov · 2013 [cited by examiner]
US 20140029233A1 · Yanagida · 2014 [cited by examiner]
US 20150115723A1 · Levo et al. · 2015 [cited by applicant]
US 20150179333A1 · Jeong · 2015 [cited by examiner]
US 20160072167A1 · Kawai et al. · 2016 [cited by applicant]
US 20160374154A1 · Viroli · 2016 [cited by examiner]
US 20170178800A1 · Muratov · 2017 [cited by applicant]
US 20170288460A1 · Yao · 2017 [cited by examiner]
US 20180166928A1 · Wu · 2018 [cited by examiner]
US 20190229556A1 · Choi et al. · 2019 [cited by applicant]
US 20200083756A1 · Ahn · 2020 [cited by examiner]
CN 103051068A · 2013 [cited by applicant]
CN 104578449A · 2015 [cited by applicant]
CN 105190992A · 2015 [cited by applicant]
CN 106899094A · 2017 [cited by applicant]
EP 3487036A1 · 2019 [cited by applicant]
KR 1020130028447A · 2013 [cited by applicant]
KR 1020130039273A · 2013 [cited by applicant]
KR 1020160090420A · 2016 [cited by applicant]
KR 1020170088184A · 2017 [cited by applicant]
KR 20170088184A · 2017 [cited by examiner]
KR 101853491B1 · 2018 [cited by applicant]
KR 102004445B1 · 2019 [cited by applicant]
WO WO2018138130A1 · 2018 [cited by applicant]