Sputter desposition system
The present invention relates to a sputter deposition system that comprises a rotatable substrate holder for holding one or more substrates and configured to allow rotation of the one or more substrates around their own axis and around the rotation axis of the rotatable substrate holder. The present invention provides for the coating of one or more substrates at the top end of the said one or more substrates and provides a homogeneous deposition of the substrate or substrates. Further, hereby disclosed is a method for depositing a coating on one or more substrates by means of the sputter deposition system described herein.
1. A sputter deposition system for depositing at least one film on one or more substrates, the sputter deposition system comprising:
a sputter chamber equipped with a rotatable substrate holder for holding the one or more substrates,
wherein:
the rotatable substrate holder is configured to hold the one or more substrates and to allow rotation of the one or more substrates around their own axis and around a rotation axis of the rotatable substrate holder;
the rotatable substrate holder comprises a bearing assembly comprising an outer ring and an inner ring; and
the bearing assembly is configured so that the one or more substrates are bearing or bearings of the bearing assembly.
2. The sputter deposition system of claim 1 , wherein the rotatable substrate holder further comprises a rubber layer present between the outer ring and the inner ring at a location configured to contact the one or more substrates, thereby providing friction during rotation of the one or more substrates.
3. The sputter deposition system of claim 1 , wherein the rotatable substrate holder is configured to receive the one or more substrates under an angle from 0.1° to 15°.
4. The sputter deposition system of claim 1 , wherein the rotatable substrate holder is configured to receive the one or more substrates under an angle from 0.5° to 5°.
5. The sputter deposition system of claim 1 , wherein the sputter chamber is a high vacuum chamber.
6. The sputter deposition system of claim 1 , wherein the one or more substrates are one or more optical fibers.
7. The sputter deposition system of claim 1 , wherein the one or more substrates are one or more optical sensors.
8. The sputter deposition system of claim 1 , wherein the one or more substrates are cylindrical substrates.
9. A method for homogeneously depositing at least one film on one or more substrates, using the sputter deposition system according to claim 1 , the method comprising:
positioning at least a part of the one or more substrates at a position between the inner ring and the outer ring of the bearing assembly;
providing rotation of either the inner ring, relative to the outer ring, or of the outer ring, relative to the inner ring, thereby allowing rotation of the one or more substrates around their own axis and around a rotation axis of the rotatable substrate holder; and
depositing a film of particles on the one or more substrates during rotation of the one or more substrates.
10. The method of claim 9 , wherein the one or more substrates are positioned in the rotatable substrate holder under an angle from 0.1° to 15°.
11. The method of claim 9 , wherein the one or more substrates are positioned in the rotatable substrate holder under an angle from 0.5° to 5°.
12. The method of claim 9 , wherein the one or more substrates are one or more optical fibers.
13. The method of claim 9 , wherein the one or more substrates are one or more optical sensors.
14. The method of claim 9 , wherein the one or more substrates are cylindrical substrates.