IP Library › Patent Application 18019427
Patent Application
App. No. 18/019,427

METHOD OF ATTACHING A CONNECTOR TO A GLAZING

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Quick Facts
Patent No.
US None
App. No.
18/019,427
Abstract

A method of attaching an electrical connector to a glass substrate, includes the steps of positioning a connector over a glass substrate in an area for attaching the connector, and extruding a soldering material over the connector. Where the glazing includes a busbar on the glass substrate, the busbar may be arranged in the area for attaching the connector.

Claims (41)

1 . A method of attaching a connector to a glass substrate, the method comprising:

positioning a connector over a glass substrate at a connecting surface for attaching the connector; and

extruding a soldering material over the connector.

2 . (canceled)

3 . (canceled)

4 . (canceled)

5 . The method according to claim 1 , wherein the soldering material comprises at least one of indium, tin, silver, and alloys thereof.

6 . (canceled)

7 . (canceled)

8 . The method according to claim 1 , wherein the connector is cut from a reel.

9 . The method according to claim 1 , wherein the connector includes a wire.

10 . The method according to claim 9 , wherein the wire includes a frayed wire end.

11 . The method according to claim 1 , wherein the connector includes a mesh.

12 . The method according to claim 1 , wherein the connector includes a foil.

13 . The method according to claim 1 , wherein extruding the soldering material includes extruding the soldering material in a pattern.

14 . The method according to claim 13 , wherein the pattern includes more than one layer.

15 . (canceled)

16 . The method according to claim 1 , wherein the soldering material is extruded from an extruder with a nozzle having a diameter of 0.5 mm or more.

17 . The method according to claim 1 wherein the glass substrate is heated while the soldering material is extruded.

18 . The method according to claim 1 , wherein the connector is adhered to the glass substrate in position at the connector surface prior to extruding the soldering material.

19 . (canceled)

20 . (canceled)

21 . A soldered connector structure, comprising:

a glass substrate;

a connecting surface formed on the glass substrate;

a soldering material formed by extrusion on the connecting surface; and

a connector electrically coupled to the connecting surface via the soldering material.

22 . The soldered connector structure according to claim 21 , wherein the soldering material comprises at least one of indium based solder and tin-silver based solder.

23 . (canceled)

24 . The soldered connector structure according to claim 21 , wherein the connector includes a wire.

25 . The soldered connector structure according to claim 24 , wherein the wire includes a frayed end.

26 . (canceled)

27 . The soldered connector structure according to claim 21 , wherein the soldering material is formed in a mound shape embedding an end of the wire and having a height of 0.5 mm or more.

28 . The soldered connector structure according to claim 21 , wherein the connector includes a mesh.

29 . (canceled)

30 . The soldered connector structure according to claim 28 , wherein the soldering material is formed in a mound shape embedding the mesh and having a height of 0.5 mm or more.

31 . The soldered connector structure according to claim 21 , wherein the connector includes a foil.

32 . (canceled)

33 . (canceled)

34 . (canceled)

35 . (canceled)