Pre-product, method and electronic device

1 . A pre-product for an electronic device configured to be loaded with a maximum current of at least 10 A comprising:

an electronic component,

power terminals for external electrical contacting the electronic device, wherein the power terminals are electrically connected to the electronic component and extend in a direction away from the electronic component,

a slide rail at an end of at least one assigned power terminal, the end being remote from the electronic component, wherein

the slide rail is integrated in a first leadframe together with at least one of the power terminals,

a weight of the pre-product is at least 0.1 kg,

a width of the slide rail is at least 1 cm in a direction perpendicular to a main extent of the at least one assigned power terminal,

an extent of the slide rail is at least 1 mm in the direction parallel to the main extent of the assigned power terminals, and

a width of the power terminals at the ends is in each case at least 1 mm in the direction perpendicular to the main extent of the power terminal; and

the first leadframe comprises nose pieces having a length that, between the end of the at least one assigned power terminal and the slide rail, is at most 25% of a breadth of the slide rail.

2 . The pre-product according to claim 1 , wherein the nose pieces are located in each case between one of the ends of the power terminal and the slide rail.

3 . The pre-product according to claim 1 , further comprising a substrate, wherein

the electronic component is mounted on the substrate, and

the power terminals are rigidly attached to the substrate and extend in a direction away from the substrate.

4 . The pre-product according to claim 3 , wherein the slide rail integrated in the first leadframe short-circuits all the power terminals of the first leadframe.

5 . The pre-product according to claim 1 , wherein the slide rail and the assigned power terminals have the same thickness and/or are of the same material.

6 . The pre-product according to claim 1 , wherein the first leadframe is of copper or of a copper alloy having a hardness of at most 110 HV.

7 . The pre-product according to claim 1 , further comprising a second leadframe, wherein

the second leadframe is thinner than the first leadframe and comprises auxiliary terminals, and

the second leadframe includes an edge rail.

8 . The pre-product according to claim 7 , wherein

the edge rail is located along a rim of the second leadframe remote from the substrate,

at least some of the auxiliary terminals are short-circuited by the edge rail,

the edge rail is located along a different side of the substrate than the slide rail, and

the second leadframe is of a copper alloy having a greater hardness than a material of the first leadframe.

9 . The pre-product according to claim 1 , further comprising a mold body, wherein

the electronic component is at least partially embedded in the mold body,

the power terminals are partially embedded in the mold body and project beyond the mold body, seen in top view, and

the slide rail is located outside the mold body.

10 . The pre-product according to claim 9 , further comprising a base plate, wherein the electronic component is thermally conductively connected to the base plate and the base plate protrudes the mold body.

11 . The pre-product according to claim 9 , wherein, seen along a direction of a main extent of the slide rail, the mold body protrudes the slide rail or terminates flush with the slide rail, and the slide rail is spaced apart from the mold body.