Photonic integrated circuit and characterization method
A method for characterizing a photonic integrated circuit comprising includes coupling an evanescent field into a scattering element adjacent to a guiding layer of the photonic integrated circuit. The evanescent field is of an optical mode of light propagating in the guiding layer, and has an in-medium wavelength in the guiding layer. A maximum spatial dimension of the scattering element is less than the in-medium wavelength. The method includes scattering, with the scattering element, the coupled evanescent field as a reference scattered-signal. The method also includes detecting one of the reference scattered-signal and a signal derived therefrom.
1 . A photonic integrated circuit, comprising:
a substrate having a substrate top-surface and a substrate refractive index;
a cladding layer on the substrate top-surface and having a cladding top-surface and a cladding refractive index;
a guiding layer located between the substrate top-surface and the cladding top-surface and having (i) a core refractive index exceeding both the substrate refractive index and the cladding refractive index, (ii) a guiding-layer thickness above the substrate top-surface, and (iii) a guiding-layer width, in a direction parallel to the substrate top-surface, the guiding layer supporting an optical mode that extends to a decay-range into the cladding layer in the direction, an in-medium wavelength of the optical mode exceeding both the guiding-layer thickness and the guiding-layer width; and
a scattering element (i) having a bottom surface, proximate the cladding top-surface, located between the substrate top-surface and the cladding top-surface and (ii) separated from the guiding layer by a gap-distance that is less than the decay-range, and (iii) having (a) a maximum spatial dimension that is less than the in-medium wavelength, and (b) a scattering refractive index that exceeds the cladding refractive index.
2 . The photonic integrated circuit of claim 1 , the gap-distance being a distance between the scattering element and a position on the guiding layer, and further comprising:
a plurality of additional scattering elements each separated from a respective additional position of a plurality of positions along the guiding layer by less than the decay-range, each of the plurality of positions corresponding to a respective propagation distance of the optical mode in the guiding layer from the position;
a distance between adjacent scattering elements of the plurality of additional scattering elements exceeding the guiding-layer width; and
each of the plurality of additional scattering elements having a same size and shape as the scattering element.
3 . The photonic integrated circuit of claim 2 , each of the plurality of additional scattering elements having a same orientation, with respect to the guiding layer, as the scattering element.
4 . The photonic integrated circuit of claim 1 , the maximum spatial dimension being at least one of (i) less than the guiding-layer width and (ii) greater than fifty nanometers.
5 . The photonic integrated circuit of claim 1 , the maximum spatial dimension being at least one of (i) less than the guiding-layer thickness and (ii) greater fifty nanometers.
6 . The photonic integrated circuit of claim 1 , the cladding layer completely surrounding the guiding layer in a plurality of transverse planes perpendicular to the substrate top-surface, such that the guiding layer and the cladding layer form a photonic wire.
7 . The photonic integrated circuit of claim 1 , the gap-distance being at least one of (i) greater than γ and (ii) less than 6γ, where γ is a distance from the guiding layer at which the intensity of the optical mode decays to 1/e of its maximum value.
8 . The photonic integrated circuit of claim 1 , the in-medium wavelength being a free-space wavelength between 1.1 micrometers and 1.8 micrometers divided by a refractive index of the guiding layer at the free-space wavelength.
9 . The photonic integrated circuit of claim 1 , the guiding-layer width being between 0.15 micrometers and 0.5 micrometers.
10 . The photonic integrated circuit of claim 1 , the scattering element and the guiding layer being formed of a same material.
11 . The photonic integrated circuit of claim 1 , the scattering element being formed of a one of a dielectric, a metal, a semiconductor, and a combination thereof.
12 . The photonic integrated circuit of claim 1 , the scattering element being beside the guiding layer in a direction parallel to the substrate top-surface, the gap-distance being along the direction.
13 . The photonic integrated circuit of claim 12 , the scattering element and the guiding layer having respective bottom surfaces, proximate the substrate top-surface, that are coplanar in a plane parallel to the substrate top-surface.
14 . The photonic integrated circuit of claim 1 , in a surface-normal direction perpendicular to the substrate top-surface, the guiding layer being between the scattering element and the substrate top-surface, and the gap-distance being along the surface-normal direction.
15 . A method for characterizing a photonic integrated circuit comprising:
coupling an evanescent field into a scattering element proximate to a guiding layer of the photonic integrated circuit, the evanescent field being of an optical mode of light propagating in the guiding layer and having an in-medium wavelength in the guiding layer, a maximum spatial dimension of the scattering element being less than the in-medium wavelength;
scattering, with the scattering element, the coupled evanescent field as a reference scattered-signal; and
detecting one of the reference scattered-signal and a signal derived therefrom.
16 . The method of claim 15 , the guiding layer including a defect that produces a defect scattered-signal, said step of detecting comprising:
forming an interference signal from interference between the reference scattered-signal and the defect scattered-signal; and
locating the defect from a spatial-frequency domain representation of the interference signal.
17 . The method of claim 15 , the scattering element being one of a plurality of scattering elements positioned adjacent to the guiding layer, and further comprising, for each of the plurality of scattering elements:
repeating the steps of coupling, scattering, and detecting to yield a respective reference scattered-signal of a plurality of reference scattered-signals and a respective scattered-light amplitude of a plurality of scattered-light amplitudes.
18 . The method of claim 17 , the plurality of reference scattered-signals including the reference scattered-signal and an additional reference scattered-signal scattered from an additional scattering element of the plurality of scattering elements, said step of detecting comprising:
forming an interference signal from interference between the reference scattered-signal and the additional reference scattered-signal;
determining a phase difference from the interference signal; and
determining an effective refractive index of the guiding layer from the phase difference.
19 . The method of claim 18 , the step of detecting comprising determining a polarization of the reference scattered-signal.
20 . The method of claim 15 , the evanescent field being of an optical mode propagating in the photonic integrated circuit.