RFID label, RFID recording medium, and method for manufacturing RFID label
An embodiment of the present invention is an RFID label having a label substrate, an RFID antenna, an IC chip, and an adhesive layer that are stacked in this order. The label substrate is a thermal paper having a thermosensitive color developing layer on one surface. The RFID antenna is provided on the other surface of the label substrate. The IC chip is connected to the RFID antenna with an ultraviolet curable anisotropic conductive adhesive.
1. An RFID label comprising:
a label substrate, an RFID antenna, an IC chip, and an adhesive layer that are stacked in this order, wherein:
the label substrate is a thermal paper having a first surface and a second surface opposite to the first surface,
a thermosensitive color developing layer is formed on the first surface,
the RFID antenna is provided on the second surface, and
the IC chip is connected to the RFID antenna with an ultraviolet curable anisotropic conductive adhesive.
2. The RFID label according to claim 1 , wherein the RFID antenna is made of a conductive material.
3. The RFID label according to claim 2 , wherein the conductive material is a metal foil.
4. The RFID label according to claim 1 , wherein the adhesive layer is a double-sided adhesive tape in which an adhesive layer, a sheet core material, and an adhesive layer are laminated in this order.
5. An RFID recording medium comprising:
a thermal paper, an RFID antenna, an IC chip, an adhesive layer, and a substrate that are stacked in this order, wherein:
thermal paper has a first surface and a second surface opposite to the first surface;
a thermosensitive color developing layer is formed on the first surface;
the RFID antenna is being provided on the second surface, and
the IC chip is connected to the RFID antenna with an ultraviolet curable anisotropic conductive adhesive.
6. A method for manufacturing an RFID label in which a thermal paper having a thermosensitive color developing layer on a first surface, an RFID antenna, an IC chip, and an adhesive layer are stacked in this order, the method comprising:
a step of forming the RFID antenna on a second surface opposite to the first surface of the thermal paper;
a step of placing an ultraviolet curable anisotropic conductive adhesive at a predetermined position of the RFID antenna that is formed on the thermal paper;
a step of placing the IC chip on the ultraviolet curable anisotropic conductive adhesive that is placed on the predetermined position of the RFID antenna;
a step of emitting ultraviolet light to cure the ultraviolet curable anisotropic conductive adhesive on which the IC chip is placed, thereby causing the RFID antenna and the IC chip to stick and electrically connect together; and
a step of forming the adhesive layer on the surface on which the RFID antenna of the thermal paper is formed.