IP Library Granted Patent US 12,141,638
Granted Patent B2
US 12,141,638 · App. 18/041,173 · Granted Nov 12, 2024

RFID label and method of using RFID label

Inventor: Haruhiko Nitta (Tokyo, JP)
Assignee: SATO HOLDINGS KABUSHIKI KAISHA
G06K19/07722G06K19/0776
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Quick Facts
Patent No.
US 12,141,638
App. No.
18/041,173
Granted
Nov 12, 2024
Kind
B2
Abstract

An RFID label includes: an RFID inlay having an inlay substrate, an RFID antenna formed on a part of the inlay substrate, and an IC chip connected to the RFID antenna; a label substrate laminated on one surface of the RFID inlay via a lamination adhesive layer; and an adherend adhesive layer formed on the other surface of the RFID inlay, in which a shielding layer containing a conductive material is formed on at least a part of a region other than the RFID antenna of the inlay substrate.

Claims (36)

1. An RFID label comprising:

an RFID inlay comprising an inlay substrate, an RFID antenna formed on a first part of the inlay substrate, and an IC chip connected to the RFID antenna;

a label substrate laminated on a first surface of the RFID inlay via a first adhesive layer;

a shielding layer, an entirety of which is formed on a second part of the inlay substrate different from the first part, the shielding layer containing a conductive material; and

a second adhesive layer formed on the shielding layer; wherein:

the RFID antenna and the shielding layer do not overlap in a vertical direction.

2. The RFID label according to claim 1 , wherein:

the shielding layer and the RFID antenna are formed on the same surface of the inlay substrate.

3. The RFID label according to claim 1 , wherein:

the RFID antenna and the shielding layer are made of the same material.

4. The RFID label according to claim 1 , wherein:

the RFID antenna and the shielding layer are made of aluminum or copper.

5. The RFID label according to claim 1 , wherein:

the RFID antenna and the shielding layer are formed of conductive ink.

6. The RFID label according to claim 1 , wherein:

a surface of the label substrate laminated on a surface of the inlay substrate opposite to the RFID antenna is an information recording surface.

7. The RFID label according to claim 1 , wherein:

the second adhesive layer is formed on a second surface of the RFID inlay opposite the first surface.

8. An RFID label comprising:

an RFID inlay comprising an inlay substrate, an RFID antenna formed on a first part of the inlay substrate, and an IC chip connected to the RFID antenna;

a shielding layer, an entirety of which is formed on a second part of the inlay substrate different from the first part, the shielding layer containing a conductive material; and

an adhesive layer formed on the shielding layer; wherein:

the RFID antenna and the shielding layer do not overlap in a vertical direction.

9. The RFID label according to claim 8 , wherein:

a surface of the inlay substrate opposite to a surface on which the RFID antenna is formed is an information recording surface.

10. The RFID label according to claim 8 , wherein:

the adhesive layer is formed on the RFID inlay.

11. A method of using an RFID label in which a second RFID label is attached to an adherend to which a first RFID label is attached, wherein:

the second RFID label comprises:

an RFID inlay having an inlay substrate, an RFID antenna formed on a first part of the inlay substrate, and an IC chip connected to the RFID antenna;

a shielding layer, an entirety of which is formed on a second part of the inlay substrate different from the first part, the shielding layer containing a conductive material;

an adhesive layer formed on the shield layer; wherein:

the RFID antenna and the shielding layer do not overlap in a vertical direction; and

the second RFID label is attached to the first RFID label in an overlapping manner so as to cover the RFID inlay of the first RFID label with the shielding layer.

12. The method of using the RFID label according to claim 11 , wherein:

the adhesive layer is formed on the RFID inlay.

Assignments (2)
CHANGE OF NAME Recorded Jul 1, 2025
From: SATO HOLDINGS KABUSHIKI KAISHA
To: SATO CORPORATION
Reel/Frame 072085/0034 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2023
From: NITTA, HARUHIKO
To: SATO HOLDINGS KABUSHIKI KAISHA
Reel/Frame 062645/0480 →
Priority Claims (1)
JP 2020-158778 · Sep 23, 2020 · national
Continuity (1)
Related Publication 20240028861A1 · Jan 25, 2024