Non-contact circuit testing systems and methods
Systems, apparatuses, semiconductor products and methods for circuit testing, specifically non-contact circuit testing are provided that allow for the wireless, non-contact testing of an electrical component. For example, non-contact circuit testing is performed using a non-contact testing apparatus that include a circuit cover with a conductive material and an oscilloscope. The circuit cover is places over an electrical component to form a parallel plate capacitor with electrical component. The parallel plate capacitor is formed with an air dielectric between the electrical component and the circuit cover. An electrical signal is initiated at the electrical component to cause a voltage through the parallel plate capacitor. An oscilloscope probe is used to measure the voltage of the parallel plate capacitor to determine a connectivity of the electrical component without contacting the electrical component.
1. A non-contact circuit testing apparatus comprising:
a circuit cover comprising a conductive material, wherein the circuit cover is configured to form a parallel plate capacitor with an electrical component of a circuit board; and
an oscilloscope probe configured to measure a voltage across a gap of the parallel plate capacitor by placing the oscilloscope probe above the circuit cover.
2. The non-contact circuit testing apparatus of claim 1 , further comprising:
a spectrum analyzer configured to receive, as an output of the oscilloscope probe, a testing signal indicative of a presence of an electrical signal at the electrical component.
3. The non-contact circuit testing apparatus of claim 2 , wherein the spectrum analyzer is configured to provide for display, based on the testing signal, an indication of the presence of the electrical signal at the electrical component.
4. The non-contact circuit testing apparatus of claim 2 , wherein the oscilloscope probe is configured to amplify a voltage wave indicative of the voltage of the parallel plate capacitor to generate the testing signal.
5. The non-contact circuit testing apparatus of claim 1 , wherein the circuit cover comprises a one-sided copper circuit board.
6. The non-contact circuit testing apparatus of claim 5 , wherein the one-sided copper circuit board comprises an insulating side and a conductive side, and wherein the insulating side faces the electrical component.
7. The non-contact circuit testing apparatus of claim 6 , wherein the conductive side forms a first plate of the parallel plate capacitor, and the electrical component forms a second plate of the parallel plate capacitor with an air dielectric between the first plate and the second plate.
8. The non-contact circuit testing apparatus of claim 1 , wherein the oscilloscope probe comprises a high impedance scope probe.
9. The non-contact circuit testing apparatus of claim 1 , wherein the circuit cover is removably placed over the electrical component of the circuit board.
10. The non-contact circuit testing apparatus of claim 9 , wherein the circuit cover is separated from the electrical component of the circuit board by a threshold distance.
11. The non-contact circuit testing apparatus of claim 9 , wherein the electrical component is a circuit trace of the circuit board for electrically coupling an integrated circuit to the circuit board.
12. The non-contact circuit testing apparatus of claim 11 , wherein the circuit board comprises a multi-layered circuit board with a plurality of board layers, and wherein the circuit trace is disposed within a board pocket of the circuit board that is recessed within at least two of the plurality of board layers.
13. The non-contact circuit testing apparatus of claim 12 , wherein the circuit cover is removably placed over the board pocket.
14. The non-contact circuit testing apparatus of claim 12 , wherein the board pocket comprises a plurality of circuit traces, each disposed at a respective layer of the multi-layered circuit board.
15. The non-contact circuit testing apparatus of claim 14 , wherein a connectivity of a respective circuit trace disposed at the respective layer of the multi-layered circuit board is tested by initiating an electrical signal through the respective circuit trace.
16. The non-contact circuit testing apparatus of claim 15 , wherein the connectivity of at least two respective circuit traces of the plurality of circuit traces are tested simultaneously by: (i) initiating a first electrical signal at a first frequency through a first circuit trace, and (ii) initiating a second electrical signal at a second frequency through a second circuit trace, wherein the first frequency and the second frequency are different frequencies.
17. A method for testing a connectivity of an electrical component on a circuit board, comprising:
receiving a voltage signal across a gap of a parallel plate capacitor formed by a circuit cover and the electrical component of the circuit board, wherein the circuit cover is separated from the electrical component by a dielectric;
measuring, by placing an oscilloscope probe above the circuit cover, the voltage signal; and
outputting, via the oscilloscope probe and based on the voltage signal, connectivity data indicative of the connectivity of the electrical component on the circuit board.
18. The method of claim 17 , wherein the dielectric comprises air.
19. The method of claim 18 , wherein the voltage signal is indicative of a voltage across the parallel plate capacitor.
20. The method of claim 17 , further comprising:
initiating an electrical signal through the electrical component; and
providing for display, via a spectrum analyzer, the connectivity data.