Hybrid circuit board
Systems, apparatuses, semiconductor products and methods for circuit testing, specifically non-contact circuit testing are provided that allow for the wireless, non-contact testing of an electrical component. For example, non-contact circuit testing is performed using a non-contact testing apparatus that include a circuit cover with a conductive material and an oscilloscope. The circuit cover is places over an electrical component to form a parallel plate capacitor with electrical component. The parallel plate capacitor is formed with an air dielectric between the electrical component and the circuit cover. An electrical signal is initiated at the electrical component to cause a voltage through the parallel plate capacitor. An oscilloscope probe is used to measure the voltage of the parallel plate capacitor to determine a connectivity of the electrical component without contacting the electrical component.
1. A hybrid circuit board comprising:
a plurality of board layers comprising a plurality of conductive layers respectively separated by a plurality of insulating layers, wherein the plurality of board layers comprises a surface layer and digital circuitry is at least partially disposed at the surface layer;
a plurality of board pockets recessed within the plurality of board layers, wherein a board pocket comprises a floor at a first intermediate board layer of the plurality of board layers; and
one or more electrical pocket devices disposed on the floor of the board pocket, wherein the one or more electrical pocket devices comprise radio frequency (RF) circuitry that is at least partially disposed within the board pocket and electrically coupled to an intermediate board layer between the first intermediate board layer and the surface layer.
2. The hybrid circuit board of claim 1 , further comprising:
a plurality of surface-mount devices disposed on one or more top board layers of the plurality of board layers, wherein the one or more top board layers are separated from the first intermediate board layer by one or more intermediate insulating layers of the plurality of insulating layers.
3. The hybrid circuit board of claim 2 , wherein the plurality of surface-mount devices comprises the digital circuitry that is insulated from the RF circuitry by the one or more intermediate insulating layers.
4. The hybrid circuit board of claim 1 , further comprising:
a pocket lid comprises an insulating material that is disposed over and at partially covers an opening of the board pocket at the surface layer of the plurality of board layers.
5. The hybrid circuit board of claim 1 , wherein the hybrid circuit board comprises one or more pocket shelves respectively disposed at an exterior edge of the board pocket, wherein a pocket shelf is disposed at the intermediate board layer positioned between the first intermediate board layer and the surface layer of the plurality of board layers.
6. The hybrid circuit board of claim 5 , wherein the pocket shelf comprises one or more I/O board connectors for electrically coupling at least a portion of the one or more electrical pocket devices to the intermediate board layer.
7. The hybrid circuit board of claim 6 , wherein the one or more electrical pocket devices comprise one or more input/output (I/O) carrier components that are electrically coupled to the one or more I/O board connectors.
8. The hybrid circuit board of claim 5 , wherein the pocket shelf comprises a plurality of pocket circuit traces for electrically coupling the one or more electrical pocket devices to the intermediate board layer.
9. The hybrid circuit board of claim 8 , wherein the one or more electrical pocket devices comprise a die carrier assembly comprising one or more input/output (I/O) carrier components.
10. The hybrid circuit board of claim 9 , wherein the one or more I/O carrier components comprise one or more capacitive pads associated with one or more control bits of a surface mounted field programmable gate array (FPGA).
11. The hybrid circuit board of claim 10 , wherein the one or more control bits of the FPGA comprise one or more control bits for phase shifting or attenuation of an antenna.
12. The hybrid circuit board of claim 10 , wherein the one or more capacitive pads cover one or more voltage lines, bias lines, or RF lines of the die carrier assembly.
13. The hybrid circuit board of claim 10 , wherein the one or more capacitive pads are wire bonded to the plurality of pocket circuit traces to electrically couple the die carrier assembly to the intermediate board layer.
14. The hybrid circuit board of claim 8 , wherein the plurality of pocket circuit traces comprise one or more voltage or control lines of the intermediate board layer.
15. An antenna controller apparatus that integrates digital control signals with radio frequency (RF) signals, comprising:
a hybrid circuit board comprising:
(i) a plurality of board layers comprising a plurality of conductive layers respectively separated by a plurality of insulating layers; and
(ii) a plurality of board pockets recessed within the plurality of board layers, wherein a board pocket comprises a floor at a first intermediate board layer of the plurality of board layers;
digital circuitry at least partially disposed at one or more surface layers of the hybrid circuit board; and
RF circuitry at least partially disposed within the plurality of board pockets and electrically coupled to one or more intermediate board layers between the first intermediate board layer and the one or more surface layers of the hybrid circuit board.
16. The antenna controller apparatus of claim 15 , wherein the hybrid circuit board is a receiver or a transmitter column associated with an antenna array system.
17. A method of manufacturing a hybrid circuit board, comprising:
forming a board pocket recessed within a plurality of board layers comprising a plurality of conductive layers respectively separated by a plurality of insulating layers;
affixing one or more electrical pocket devices that comprise a die carrier assembly with a capacitive pad to a floor of the board pocket; and
wire-bonding the capacitive pad to an intermediate board layer of the plurality of board layers.
18. The method of manufacturing the hybrid circuit board of claim 17 , further comprising:
forming one or more pocket shelves at an exterior edge of the board pocket and the intermediate board layer positioned between the floor of the board pocket and a surface layer of the plurality of board layers; and
wire-bonding the capacitive pad to one or more circuit traces of the intermediate board layer.