Flexible hybrid interconnect circuits
Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
1. A flexible hybrid interconnect circuit, having a thickness, the flexible hybrid interconnect circuit comprising: a first outer dielectric; a second outer dielectric; an inner dielectric; a first conductive element; and a second conductive element, stacked with the first conductive element along the thickness of the flexible hybrid interconnect circuit and between the first outer dielectric and the second outer dielectric, wherein the inner dielectric is at least partially disposed between the first conductive element and the second conductive element providing support to the first conductive element and the second conductive element relative to each other, and wherein both of the first conductive element and the second conductive element extend out of a plane and through the inner dielectric forming a direct electrical connection between the first conductive element and the second conductive element.
2. The flexible hybrid interconnect circuit of claim 1 , wherein only one of the first conductive element and the second conductive element extends out of the plane and through the inner dielectric forming the direct electrical connection between the first conductive element and the second conductive element.
3. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric fills gaps around the direct electrical connection between the first conductive element and the second conductive element.
4. The flexible hybrid interconnect circuit of claim 1 , wherein the direct electrical connection between the first conductive element and the second conductive element is formed by one or more of welding, soldering, mechanical crimping, and conductive adhesive bonding.
5. The flexible hybrid interconnect circuit of claim 1 , wherein each of the first outer dielectric and the second outer dielectric continuously extend over the direct electrical connection between the first conductive element and the second conductive element.
6. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric comprises a dielectric opening allowing the one or both of the first conductive element and the second conductive element extend through the inner dielectric forming the direct electrical connection between the first conductive element and the second conductive element.
7. The flexible hybrid interconnect circuit of claim 6 , wherein the dielectric opening and the direct electrical connection between the first conductive element and the second conductive element are sealed from environment by the first outer dielectric and the second outer dielectric.
8. The flexible hybrid interconnect circuit of claim 1 , further comprising an additional conductive element positioned between the first conductive element and the second conductive element and electrically insulated from the first conductive element and the second conductive element.
9. The flexible hybrid interconnect circuit of claim 1 , wherein the first conductive element is substantially wider than the second conductive element such that edges of the first conductive element extend past edges of the second conductive element.
10. The flexible hybrid interconnect circuit of claim 9 , wherein: the first conductive element is operable as a shield; the second conductive element is operable as a signal line configured to transmit an electromagnetic wave; and the first conductive element comprises a plurality of openings each having a size less than a wavelength of the electromagnetic wave transmitted by the second conductive element.
11. The flexible hybrid interconnect circuit of claim 1 , wherein: the first conductive element comprises a first conductive element portion, a second conductive element portion, and a transition portion, disposed between and monolithic with each of the first conductive element portion and the second conductive element portion; and a width of the transition portion is less than a width of either the first conductive element portion or the second conductive element portion.
12. The flexible hybrid interconnect circuit of claim 11 , wherein the width of the transition portion is 5% to 50% of the width of either the first conductive element portion or the second conductive element portion.
13. The flexible hybrid interconnect circuit of claim 11 , wherein: the first conductive element portion, the transition portion, and the second conductive element portion extend along an axis; and the first conductive element portion is offset relative to the second conductive element portion in a direction perpendicular to this axis.
14. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric comprises a crosslinked polyethylene (XLPE).
15. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric has a dielectric constant less than 2.
16. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric comprises a flame retardant.
17. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric comprises a coefficient of thermal expansion (CTE)-matching additive such that a CTE of the inner dielectric substantially matches a CTE of each of the first conductive element and the second conductive element.
18. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric has a uniform composition throughout an entire volume between the first outer dielectric and the second outer dielectric.
19. A flexible hybrid interconnect circuit, having a thickness, the flexible hybrid interconnect circuit comprising: a first outer dielectric; a second outer dielectric; an inner dielectric; a first conductive element; and a second conductive element, stacked with the first conductive element along the thickness of the flexible hybrid interconnect circuit and between the first outer dielectric and the second outer dielectric, wherein the inner dielectric is at least partially disposed between the first conductive element and the second conductive element providing support to the first conductive element and the second conductive element relative to each other, wherein one or both of the first conductive element and the second conductive element extend out of a plane and through the inner dielectric forming a direct electrical connection between the first conductive element and the second conductive element, and wherein the second conductive element wraps around edges of the inner dielectric and the first conductive element and directly interfaces and forms an electrical connection with the first conductive element.