Fiber to silicon photonics assembly method with fiber retaining apparatus
The present disclosure provides an optical fiber to silicon photonics circuit (PIC) assembly method utilizing a structured fiber retaining apparatus for fiber confinement in which polymer filling volume for adhesion and refractive index matching purpose is reduced. Reduction of polymer volume result in smaller optical alignment change due to polymer material volume changes upon moisture absorption and aging, hence improving assembly reliability. In an embodiment, the assembly method and apparatus, transparent polymer material interfaces between fiber and edged coupler volume reduce more than 50% compares to conventional assembly method.
1. A fiber retaining apparatus to package and retain an optic fiber in a fiber to silicon photonics assembly, comprising:
at least one patterned surface configured to retain at least one optic fiber assembly;
multiple structures etched on the at least one patterned surface, each structure of the multiple structures having a shape configured to retain at least one optic fiber of the at least one optic fiber assembly in a position alignment that aligns a center of the at least one optic fiber with a light output of silicon photonics when the fiber retaining apparatus undergoes changes in material properties of an adhesive polymer material, due to environmental conditions, and material extrinsic and intrinsic changes,
wherein the shape includes at least one of a square, a rectangle, a trapezoid, or a hexagon; and
the adhesive polymer material deposited within the multiple structures,
wherein a volume of the adhesive polymer material deposited within the multiple structures causes an optical coupling loss to be less than 1 decibel (dB) if the adhesive polymer material is moisture saturated.
2. The fiber retaining apparatus of claim 1 , wherein the fiber retaining apparatus is configured to retain the at least one optic fiber in the position alignment in a V-groove of a silicon photonics chip.
3. The fiber retaining apparatus of claim 1 , wherein the changes in the material properties of the adhesive polymer material include material expansion due to thermal expansion and moisture absorption.
4. The fiber retaining apparatus of claim 1 , wherein the environmental conditions include relative humidity, and the material extrinsic and intrinsic changes include changes in one or more of a Poisson ratio or a coefficient of Hygroscopic Expansion.
5. The fiber retaining apparatus of claim 1 , wherein the adhesive polymer material is deposited between optic fibers of the at least one optic fiber assembly.
6. The fiber retaining apparatus of claim 1 , wherein the adhesive polymer material includes one or more of acrylic or epoxy.
7. A fiber to silicon photonics assembly, comprising:
at least one silicon photonics integrated circuit (Si-PIC);
at least one optic fiber assembly;
at least one v-groove structure in the at least one Si-PIC for coupling with at least one optic fiber in the at least one optic fiber assembly; and
at least one fiber retaining apparatus configured to retain the at least one optic fiber assembly within the at least one v-groove structure, wherein the at least one fiber retaining apparatus comprises:
at least one patterned surface configured to retain the at least one optic fiber assembly within the at least one v-groove structure;
multiple structures etched on the at least one patterned surface, each structure of the multiple structures having a shape configured to retain the at least one optic fiber in the at least one v-groove structure and in a position alignment that aligns a center of the at least one optic fiber with a light output of silicon photonics when the at least one fiber retaining apparatus undergoes changes in material properties of an adhesive polymer material, due to environmental conditions, and material extrinsic and intrinsic changes; and
the adhesive polymer material deposited within the multiple structures,
wherein a volume of the adhesive polymer material deposited within the multiple structures causes an optical coupling loss to be less than 1 decibel (dB) if the adhesive polymer material is 50% moisture saturated.
8. The fiber to silicon photonics assembly of claim 7 , wherein the volume of the adhesive polymer material deposited within the multiple structures causes relative occurrence of the optical coupling loss greater than 1 dB to be less than 0.5% if the adhesive polymer material is moisture saturated.
9. The fiber to silicon photonics assembly of claim 7 , wherein the changes in the material properties of the adhesive polymer material include material expansion due to thermal expansion and moisture absorption.
10. The fiber to silicon photonics assembly of claim 7 , wherein the environmental conditions include relative humidity, and the material extrinsic and intrinsic changes include changes in one or more of a Poisson ratio or a coefficient of Hygroscopic Expansion.
11. The fiber to silicon photonics assembly of claim 7 , wherein the shape includes at least one of a square shape, a rectangle shape, a V-shape, a U-shape, a trapezoidal shape, or a hexagonal shape.
12. The fiber to silicon photonics assembly of claim 7 , wherein the adhesive polymer material includes one or more of acrylic or epoxy.
13. A fiber to silicon photonics assembly, comprising:
at least one silicon photonics integrated circuit (Si-PIC);
at least one optic fiber assembly;
at least one groove in the at least one Si-PIC for coupling with at least one optic fiber in the at least one optic fiber assembly; and
at least one fiber retaining apparatus configured to retain the at least one optic fiber assembly within the at least one groove, wherein the at least one fiber retaining apparatus comprises:
at least one patterned surface to retain the at least one optic fiber assembly within the at least one groove;
multiple structures etched on the at least one patterned surface, each structure of the multiple structures having a shape configured to retain the at least one optic fiber in the at least one groove and in a position alignment that aligns a center of the at least one optic fiber with a light output of silicon photonics when the at least one fiber retaining apparatus undergoes changes in material properties of an adhesive polymer material, due to environmental conditions, and material extrinsic and intrinsic changes; and
the adhesive polymer material deposited within the multiple structures,
wherein a volume of the adhesive polymer material deposited within the multiple structures causes relative occurrence of optical coupling loss greater than 1 decibel (dB) to be less than 0.5% if the adhesive polymer material is moisture saturated.
14. The fiber to silicon photonics assembly of claim 13 , wherein the adhesive polymer material includes one or more of acrylic or epoxy.
15. The fiber to silicon photonics assembly of claim 13 , wherein the fiber retaining apparatus is configured to retain the at least one optic fiber in the position alignment in a V-groove of the at least one Si-PIC.
16. The fiber to silicon photonics assembly of claim 13 , wherein the changes in the material properties of the adhesive polymer material include material expansion due to thermal expansion and moisture absorption.
17. The fiber to silicon photonics assembly of claim 13 , wherein the environmental conditions include relative humidity, and the material extrinsic and intrinsic changes include changes in one or more of a Poisson ratio or a coefficient of Hygroscopic Expansion.
18. The fiber to silicon photonics assembly of claim 13 , wherein the shape includes at least one of a square shape, a rectangle shape, a V-shape, a U-shape, a trapezoidal shape, or a hexagonal shape.
19. An assembly method for optical fiber to silicon photonic circuit (PIC), comprising:
providing a PIC with at least one optical fiber positioning cavity, fabricated on a surface of the PIC, that allows a fiber center to align with an etched coupler;
depositing at least one optical fiber in the at least one optical fiber positioning cavity;
positioning a fiber retaining apparatus, including at least a structured surface, to be in contact with the at least one optical fiber; and
filling intra spaces, that are formed between the at least one optical fiber positioning cavity on the PIC, the at least one optical fiber, and the fiber retaining apparatus, with a transparent polymer transparent to operation of light of the PIC,
wherein a volume of the transparent polymer filled in the intra spaces causes relative occurrence of an optical coupling loss greater than 1 decibel (dB) to be less than 0.1% if the transparent polymer is 50% moisture saturated.
20. The assembly method of claim 19 , wherein the transparent polymer is a light or heat curable fluid polymer, and wherein the assembly method further comprises curing the transparent polymer in the intra spaces with light or heat, individually or in combination.
21. The assembly method of claim 19 , wherein the volume of the transparent polymer filled in the intra spaces causes the relative occurrence of the optical coupling loss greater than 1 dB to be less than 0.5% if the transparent polymer is moisture saturated.
22. The assembly method of claim 19 , wherein the structured surface includes one or more structures etched on a surface of the fiber retaining apparatus, each structure of the one or more structures having a shape for retaining the at least one optic fiber.
23. The assembly method of claim 22 , wherein the shape includes at least one of a square shape, a rectangle shape, a V-shape, a U-shape, a trapezoidal shape, or a hexagonal shape.
24. The assembly method of claim 19 , further comprising applying a press force to the fiber retaining apparatus when the fiber retaining apparatus is in contact with the at least one optical fiber.