SUSTAINABLE REACTIVE HOT MELT ADHESIVE COMPOSITIONS
The invention features a reactive hot melt adhesive composition comprising the reaction product of from 5% by weight to 40% by weight of a first polyester polyol comprising the reaction product of a dicarboxylic acid monomer, a tetra alkyl cyclobutane diol and optionally one or more additional monomers, from 10% by weight to 80% by weight of a sustainable polyol, and a diisocyanate.
1 . A reactive hot melt adhesive composition comprising the reaction product of:
a. from 5% by weight to 40% by weight of a first polyester polyol comprising the reaction product of:
i. a dicarboxylic acid monomer,
ii. a tetra alkyl cyclobutane diol, and
iii. optionally one or more additional monomers,
b. from 10% by weight to 80% by weight of a sustainable polyol, and
c. a diisocyanate.
2 . The reactive hot melt adhesive composition of claim 1 wherein the first polyester polyol has a Glass Transition Temperature of from 20° C. to 65° C.
3 . The reactive hot melt adhesive composition of claim 1 having no greater than 10% by weight of an acrylic polymer.
4 . The reactive hot melt adhesive composition of claim 1 having no greater than 10 % by weight of a polypropylene glycol.
5 . The reactive hot melt adhesive composition of claim 1 wherein the tetra alkyl cyclobutane diol is 2,2,4,4-tetramethylcyclobutane-1,3 diol.
6 . The reactive hot melt adhesive composition of claim 1 having a sustainable content of from 40% by weight to 100% by weight.
7 . The reactive hot melt adhesive composition of claim 1 having a bio-based carbon content based on the total carbon content, according to ASTM 6866-20 of from 40% by weight to 100% by weight.
8 . The reactive hot melt adhesive composition of claim 1 wherein the sustainable polyol is bio-based.
9 . The reactive hot melt adhesive composition of claim 1 wherein the sustainable polyol comprises a bio-based polyether polyol and a bio-based polyester polyol.
10 . The reactive hot melt adhesive composition of claim 1 wherein the sustainable polyol comprises a bio-based polyether polyol, a bio-based crystalline polyester polyol, and a bio-based amorphous polyester polyol.
11 . The reactive hot melt adhesive composition of claim 1 wherein the diisocyanate is selected from the group consisting of bio-based and bio-mass balanced.
12 . The reactive hot melt adhesive composition of claim 1 further comprising a thermoplastic polymer selected from the group consisting of polyesters and polyurethanes.
13 . The reactive hot melt adhesive composition of claim 12 wherein the thermoplastic polymer is sustainable.
14 . The reactive hot melt adhesive composition of claim 1 having a Brookfield Viscosity at 120° C. of no greater than 10,000 cP.
15 . The reactive hot melt adhesive composition of claim 1 having a Brookfield Viscosity at 110° C. of from 100 cP to 5,000 cP.
16 . The reactive hot melt adhesive composition of claim 1 having one additional property selected from the group consisting of:
a Brookfield Viscosity of no greater than 10,000 cP at 110° C., and
a monomeric diisocyanate content of no greater than 0.5% by weight.
17 . A reactive hot melt adhesive composition comprising the reaction product of:
a. from 5% by weight to 40% by weight of a first polyester polyol comprising the reaction product of:
i. dicarboxylic acid monomer,
ii. a tetra alkyl cyclobutane diol, and
iii. optionally one or more additional monomers,
b. from 20% by weight to 80% by weight of a sustainable polyol, and
c. a diisocyanate,
wherein the reactive hot melt adhesive composition has a sustainable content of from 40% by weight to 100% by weight.
18 . The reactive hot melt adhesives composition of claim 17 having a Brookfield Viscosity of no greater than 10,000 cP at 110° C.
19 . An article comprising two substrates bonded with the reactive hot melt adhesive of claim 1 wherein the two substrates are selected from the group consisting of wood, engineered wood, glass, metal, polyolefin, polyether sulfones, polycarbonate, polyamide, polyester, acrylic, acrylonitrile butadiene styrene, poly (methyl methacrylate), poly vinyl chloride, fiber reinforced versions thereof, surface treated versions thereof, and combinations thereof.
20 . An electronic component comprising the composition of claim 1 .