IP Library › Patent Application 18060669
Patent Application Utility
App. No. 18/060,669 · Confirmation No. 8781

MICRO-LAYER CMP POLISHING SUBPAD

Expressly Abandoned -- During Examination
⬇ PDF
 Code Description Pages PDF
2024-03-14 ABN Abandonment 2 View
2024-03-08 EABN Letter Express Abandonment of the application 2 View
2024-03-08 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-06-13 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2023-06-13 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-03-24 APP.FILE.REC Filing Receipt 4 View
2023-03-24 WFEE Fee Worksheet (SB06) 1 View
2023-01-09 OATH Oath or Declaration filed 10 View
2023-01-09 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-01-09 N417.PYMT Electronic Fee Payment 2 View
2022-12-01 APP.TEXT Application body structured text document — View
2022-12-01 PA.. Power of Attorney 3 View
2022-12-01 ADS Application Data Sheet 10 View
2022-12-01 SPEC Specification 24 View
2022-12-01 CLM Claims 3 View
2022-12-01 ABST Abstract 1 View
2022-12-01 N417 Electronic Filing System Acknowledgment Receipt 2 View
2022-12-01 N417.PYMT Electronic Fee Payment 2 View
2022-12-01 DRW Drawings-only black and white line drawings 7 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
18/060,669
Filed
2022-12-01
Art Unit
OPAP