IP Library Patent Application 18060677
Patent Application Utility
App. No. 18/060,677 · Confirmation No. 8507

DUAL-LAYER CMP POLISHING SUBPAD

Expressly Abandoned -- During Examination
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Code Description Pages PDF
2024-03-14 ABN Abandonment 2 View
2024-03-08 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-03-08 EABN Letter Express Abandonment of the application 2 View
2024-03-08 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-03-08 EABN Letter Express Abandonment of the application 2 View
2023-06-13 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2023-06-13 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-01-06 OATH Oath or Declaration filed 5 View
2023-01-06 N417 Electronic Filing System Acknowledgment Receipt 2 View
2022-12-16 APP.FILE.REC Filing Receipt 3 View
2022-12-16 WFEE Fee Worksheet (SB06) 1 View
2022-12-16 M327 Miscellaneous Communication to Applicant - No Action Count 1 View
2022-12-01 APP.TEXT Application body structured text document View
2022-12-01 PA.. Power of Attorney 3 View
2022-12-01 DRW Drawings-only black and white line drawings 7 View
2022-12-01 N417.PYMT Electronic Fee Payment 2 View
2022-12-01 SPEC Specification 24 View
2022-12-01 CLM Claims 3 View
2022-12-01 ABST Abstract 1 View
2022-12-01 ADS Application Data Sheet 9 View
2022-12-01 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
18/060,677
Filed
2022-12-01
Art Unit
OPAP