IP Library Granted Patent US 12,483,640
Granted Patent B2
US 12,483,640 · App. 18/063,670 · Granted Nov 25, 2025

Modular 5G UE layer-2 data stack solutions for high throughput and low latency data transfer

Inventors: Su-Lin Low (San Diego, CA); Tianan Tim Ma (San Diego, CA); Hong Kui Yang (San Diego, CA); Hausting Hong (San Diego, CA); Chun-I Lee (San Diego, CA); Jianzhou Li (San Diego, CA)
Assignee: GREATER SHINE LIMITED
H04L69/324H04L69/18H04W80/02
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Quick Facts
Patent No.
US 12,483,640
App. No.
18/063,670
Granted
Nov 25, 2025
Kind
B2
Abstract

Methods for providing a layer-2 data stack solution in a data plane and associated devices are provided. In some embodiments, the method includes (i) determining, among a plurality of data stack solutions that are selectable, which layer-2 data stack solution is selected and (ii) causing, according to the selected layer-2 data stack solution, the layer-2 micro controller to intervene with a data plane hardware module that is configured to implement a specific layer-2 data stack function. Each of the plurality of data stack solutions represents a distinctive intervening configuration of a layer-2 micro controller. The layer-2 micro controller is coupled to a number of data plane hardware modules that are configured to implement different layer-2 data stack functions. The intervening configuration of the layer-2 micro controller is indicative of a level of control of the layer-2 micro controller over the data plane hardware modules.

Claims (49)

1 . A method for implementing layer-2 network communication in a data plane, the method comprising:

determining, among a plurality of data stack solutions that are selectable, which layer-2 data stack solution is selected, wherein each of the plurality of data stack solutions comprises a layer-2 micro controller, a local memory and at least one data plane hardware module, wherein each of the plurality of data stack solutions represents a distinctive intervening configuration of the layer-2 micro controller; and

causing, according to the selected layer-2 data stack solution, the layer-2 micro controller to intervene with the at least one data plane hardware module that is configured to implement a specific layer-2 data stack function,

wherein the layer-2 micro controller is coupled to the at least one data plane hardware module, wherein different data plane hardware modules are configured to implement different layer-2 data stack functions, and

wherein the intervening configuration of the layer-2 micro controller is indicative of a level of control of the layer-2 micro controller over the at least one data plane hardware module, and wherein the at least one data plane hardware comprises at least one of:

a service data adaptation protocol (SDAP) hardware module;

a packet data convergence protocol (PDCP) hardware module;

a radio link control (RLC) hardware module; or

a media access control (MAC) hardware module.

2 . The method of claim 1 , wherein the layer-2 micro controller is configurable to intervene one or more of the layer-2 data stack functions performed by the at least one data plane hardware module based on instructions stored in the local memory to the layer-2 data stack solution.

3 . The method of claim 1 , wherein the layer-2 micro controller is configurable to intervene one or more of the layer-2 data stack functions performed based on instructions received from a main processor of a control plane via a data-path-control (DPC) layer of the control plane and a DPC application programing interface (API) of the layer-2 data stack solution.

4 . The method of claim 1 , wherein the plurality of data stack solutions include multiple downlink (DL) solutions.

5 . The method of claim 4 , wherein the multiple DL solutions include a solution that the layer-2 micro controller is configured to monitor the layer-2 data stack functions automatically implemented by the at least one data plane hardware module.

6 . The method of claim 4 , wherein the multiple DL solutions include a solution that the layer-2 micro controller is configured to intervene an RLC function of the layer-2 data stack functions performed by the RLC hardware module.

7 . The method of claim 4 , wherein the multiple DL solutions include a solution that the layer-2 micro controller is configured to intervene an RLC function of the layer-2 data stack functions performed by the RLC hardware module, in response to instructions received from a main processor of a control plane via a data-path-control (DPC) layer of the control plane and a DPC application programming interface (API) of the layer-2 data stack solution.

8 . The method of claim 1 , wherein the plurality of data stack solutions include multiple uplink (UL) solutions.

9 . The method of claim 8 , wherein the multiple UL solutions include a solution that the layer-2 micro controller is configured to monitor the layer-2 data stack functions automatically implemented by the at least one data plane hardware module.

10 . The method of claim 8 , wherein the multiple UL solutions include a solution that the micro controller is configured to intervene an RLC function of the layer-2 data stack functions performed by the RLC hardware module.

11 . The method of claim 8 , wherein the multiple UL solutions include a solution that the layer-2 micro controller is configured to intervene an RLC function of the layer-2 data stack functions performed by the RLC hardware module, in response to instructions received from a main processor of a control plane via a data-path-control (DPC) layer of the control plane and a DPC application programming interface (API) of the layer-2 data stack solution.

12 . The method of claim 1 , wherein the layer-2 micro controller is configurable to:

coordinate communicating with a layer-3/layer-4 data stack via a layer-3/layer-4 application programming interface (API); and

coordinate communicating with the physical layer (PHY) subsystem via the PHY API.

13 . The method of claim 1 , further comprising:

storing information associated with the layer-2 data stack solution in an external memory.

14 . The method of claim 13 , further comprising:

accessing the information associated with the layer-2 data stack stored in the external memory via an application layer.

15 . The method of claim 13 , further comprising:

accessing the information associated with the layer-2 data stack stored in the external memory by the data plane hardware.

16 . The method of claim 1 , further comprising:

storing information associated with the layer-2 data stack solution in the local memory coupled to the layer-2 micro controller.

17 . The method of claim 16 , further comprising:

accessing the information associated with the layer-2 data stack stored in the local memory via by a main processor of a control plane via a data-path-control (DPC) layer of the control plane and a DPC application programming interface (API) of the layer-2 data stack solution.

18 . An apparatus, comprising:

a memory; and

a processor coupled to the memory and configured to:

determine, among a plurality of data stack solutions that are selectable, which layer-2 data stack solution is selected, wherein each of the plurality of data stack solutions comprises a layer-2 micro controller, a local memory and at least one data plane hardware module, wherein each of the plurality of data stack solutions represents a distinctive intervening configuration of the layer-2 micro controller; and

cause, according to the selected layer-2 data stack solution, the layer-2 micro controller to intervene with the at least one data plane hardware module that is configured to implement a specific layer-2 data stack function,

wherein the layer-2 micro controller is coupled to the at least one data plane hardware module, wherein different data plane hardware modules are configured to implement different layer-2 data stack functions, and

wherein the intervening configuration of the layer-2 micro controller is indicative of a level of control of the layer-2 micro controller over the at least one data plane hardware module, and

wherein the at least one data plane hardware module comprises at least one of: a service data adaptation protocol (SDAP) hardware module, a packet data convergence protocol (PDCP) hardware module, a radio link control (RLC) hardware module, or a media access control (MAC) hardware module.

19 . A non-transitory, computer-readable medium having instructions stored thereon that, when executed by one or more processors, cause the one or more processors to implement the instructions so as to perform a method, the method comprising:

determining, among a plurality of data stack solutions that are selectable, which layer-2 data stack solution is selected, wherein each of the plurality of data stack solutions comprises a layer-2 micro controller, a local memory and at least one data plane hardware module, wherein each of the plurality of data stack solutions represents a distinctive intervening configuration of the layer-2 micro controller; and

causing, according to the selected layer-2 data stack solution, the layer-2 micro controller to intervene with the at least one data plane hardware module that is configured to implement a specific layer-2 data stack function,

wherein the layer-2 micro controller is coupled to the at least one data plane hardware module, wherein different data plane hardware modules are configured to implement different layer-2 data stack functions, and

wherein the intervening configuration of the layer-2 micro controller is indicative of a level of control of the layer-2 micro controller over the at least one data plane hardware module, and wherein the at least one data plane hardware comprises at least one of:

a service data adaptation protocol (SDAP) hardware module;

a packet data convergence protocol (PDCP) hardware module;

a radio link control (RLC) hardware module; or

a media access control (MAC) hardware module.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: ZEKU TECHNOLOGY (SHANGHAI) CORP., LTD.
To: GREATER SHINE LIMITED
Reel/Frame 068846/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2023
From: ZEKU, INC.
To: ZEKU TECHNOLOGY (SHANGHAI) CORP., LTD.
Reel/Frame 064338/0281 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2022
From: LOW, SU-LIN; MA, TIANAN TIM; YANG, HONG KUI; HONG, HAUSTING; LEE, CHUN-I; LI, JIANZHOU
To: ZEKU, INC.
Reel/Frame 062034/0011 →
Continuity (3)
Continuation PCTUS2021014934 · Jan 25, 2021
Provisional Application 63036736 · Jun 9, 2020
Related Publication 20230105582A1 · Apr 6, 2023
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