Power conversion apparatus, and method of manufacturing power conversion apparatus
A power conversion apparatus includes a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space, a resin material having a thermal conductivity, the resin material being provided in the predetermined space, a coil disposed in the predetermined space, a coil case having a shape that fits with the housing part, the coil case being configured to house the coil, and a power semiconductor device disposed along a side wall of the coil case. The power semiconductor device is pressed and fixed between a side wall of the housing part and the side wall of the coil case in a state where a heat dissipation surface is in contact with the side wall of the housing part.
1. A power conversion apparatus comprising:
a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space;
a resin material having a thermal conductivity, the resin material being provided in the predetermined space;
a coil disposed in the predetermined space;
a coil case having a shape that fits with the housing part, the coil case being configured to house the coil; and
a power semiconductor device having a first surface and a second surface opposite to the first surface,
wherein the power semiconductor device is disposed between a side wall of the housing part and a side wall of the coil case, and
the first surface contacts the side wall of the housing part, and the second surface contacts the side wall of the coil case.
2. The power conversion apparatus according to claim 1 , wherein the case is a heat sink including a baseplate and the housing part formed to surround the predetermined space on the baseplate.
3. The power conversion apparatus according to claim 2 ,
wherein the side wall of the housing part has a shape tilted with respect to a normal to a top surface of the baseplate; and
wherein the side wall of the coil case has a shape tilted in a direction that is identical to an inclination direction of the side wall of the housing part.
4. The power conversion apparatus according to claim 2 , wherein the baseplate of the heat sink is a wall part of the case.
5. The power conversion apparatus according to claim 1 , further comprising a circuit board disposed above the housing part,
wherein the coil is mounted on a bottom surface side of the circuit board; and
wherein the power semiconductor device is mounted on the bottom surface side of the circuit board.
6. The power conversion apparatus according to claim 1 , wherein the power semiconductor device is disposed in a recess formed in the side wall of the coil case, the recess being configured to fit with the power semiconductor device.
7. The power conversion apparatus according to claim 1 , wherein the power semiconductor device is pressed and fixed between the side wall of the housing part and the side wall of the coil case in the predetermined space in a state where the first surface of the power semiconductor device is in contact with the side wall of the housing part.
8. The power conversion apparatus according to claim 1 , wherein the power semiconductor device is pressed and fixed between the side wall of the housing part and the side wall of the coil case in a location outside the predetermined space in a state where the first surface of the power semiconductor device is in contact with the side wall of the housing part.
9. The power conversion apparatus according to claim 8 ,
wherein the case includes a second housing part formed to surround a second predetermined space adjacent to the predetermined space, the second housing part being provided at a position adjacent to the housing part; and
wherein the power semiconductor device is disposed inside the second predetermined space filled with the resin material or another resin material having a thermal conductivity.
10. A method of manufacturing the power conversion apparatus according to claim 2 , the method comprising:
mounting the coil and the power semiconductor device to a circuit board; and
relatively moving the circuit board toward the housing part of the heat sink to house the coil inside the housing part and to press and fix the power semiconductor device between the side wall of the housing part and the side wall of the coil case.