SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE
A semiconductor device includes a protection film having an opening and covering a semiconductor layer, which is formed on a side of a surface of a substrate, on an opposite side of the substrate. An insulating film containing silicon is used for the protection film. A gate electrode is formed in the opening and on a side of a side surface of the semiconductor layer which faces a direction. An insulating film containing metal element is formed between the side surface of the semiconductor layer and the gate electrode. The exposure of the side surface of the semiconductor layer to a gas for dry etching for forming of the opening is suppressed by the insulating film. Furthermore, contact and a short circuit between the gate electrode and the side surface of the semiconductor layer are suppressed. As a result, deterioration in the performance of the semiconductor device is suppressed.
1 . A semiconductor device comprising:
a substrate;
a semiconductor layer formed on a side of a first surface of the substrate;
a first insulating film formed so as to cover the semiconductor layer on an opposite side of the substrate, having an opening portion, and containing silicon (Si);
an electrode formed in the opening portion of the first insulating film and on a side of a second surface of the semiconductor layer which faces a first direction parallel to the first surface of the substrate; and
a second insulating film formed between the second surface of the semiconductor layer and the electrode formed on the side of the second surface and containing a metal element.
2 . The semiconductor device according to claim 1 , wherein the first insulating film extends to the side of the second surface of the semiconductor layer and is formed between the second insulating film and the electrode formed on the side of the second surface.
3 . The semiconductor device according to claim 1 , wherein: the semiconductor layer includes:
a first layer including a channel layer and a carrier supply layer formed over the channel layer; and
a second layer formed over the first layer on the opposite side of the substrate, and
the second insulating film covers the first layer, of the first layer and the second layer on the second surface of the semiconductor layer.
4 . The semiconductor device according to claim 3 , wherein: the opening portion of the first insulating film communicates with the semiconductor layer on the opposite side of the substrate from the semiconductor layer; and the electrode formed in the opening portion is in contact with the semiconductor layer.
5 . The semiconductor device according to claim 1 , wherein: the semiconductor layer includes:
a first layer including a channel layer and a carrier supply layer formed over the channel layer; and
a second layer formed over the first layer on the opposite side of the substrate, and
the second insulating film covers the first layer and the second layer on the second surface of the semiconductor layer and extends on the semiconductor layer to the opposite side of the substrate.
6 . The semiconductor device according to claim 5 , wherein: the opening portion of the first insulating film communicates with the second insulating film on the opposite side of the substrate from the semiconductor layer; and the electrode formed in the opening portion is in contact with the second insulating film.
7 . The semiconductor device according to claim 5 , wherein: the second insulating film includes:
a first portion which covers the first layer on the second surface of the semiconductor layer and which has a first thickness from the first layer in the first direction parallel to the first surface of the substrate; and
a second portion which covers the second layer on the second surface of the semiconductor layer, which extends on the semiconductor layer to the opposite side of the substrate, and which has a second thickness less than the first thickness from the second layer in the first direction parallel to the first surface of the substrate.
8 . The semiconductor device according to claim 5 , wherein the second layer has a shape by which the second layer extrudes from the first layer in the first direction parallel to the first surface of the substrate.
9 . The semiconductor device according to claim 5 , wherein:
the second layer has a shape by which the second layer extrudes from the carrier supply layer of the first layer in the first direction parallel to the first surface of the substrate; and
the carrier supply layer of the first layer has a shape by which the carrier supply layer extrudes from the channel layer of the first layer in the first direction parallel to the first surface of the substrate.
10 . The semiconductor device according to claim 5 , wherein a thickness of the second layer in a second direction perpendicular to the first surface of the substrate is half or less of a thickness of the channel layer of the first layer.
11 . The semiconductor device according to claim 5 , wherein: indium gallium arsenide (InGaAs) is used for forming the channel layer of the first layer;
indium aluminum arsenide (InAlAs) is used for forming the carrier supply layer of the first layer; and indium phosphide (InP) or indium gallium phosphide (InGaP) is used for forming the second layer.
12 . The semiconductor device according to claim 1 , wherein the metal element contained in the second insulating film has an electronegativity of 1.8 or less.
13 . The semiconductor device according to claim 1 , wherein the second insulating film contains as the metal element one or more of aluminum (Al), hafnium (Hf), zirconium (Zr), titanium (Ti), tantalum (Ta), magnesium (Mg), scandium (Sc), yttrium (Y), lanthanum (La), and strontium (Sr).
14 . The semiconductor device according to claim 1 , wherein the second insulating film includes one or more of an oxide film, a nitride film, and an oxynitride film.
15 . A semiconductor device manufacturing method comprising: a process for forming a semiconductor layer on a side of a first surface of a substrate;
a process for forming a first insulating film so as to cover the semiconductor layer on an opposite side of the substrate, the first insulating film having an opening portion and containing silicon (Si);
a process for forming an electrode in the opening portion of the first insulating film and on a side of a second surface of the semiconductor layer which faces a first direction parallel to the first surface of the substrate; and
a process for forming a second insulating film between the second surface of the semiconductor layer and the electrode formed on the side of the second surface, the second insulating film containing a metal element, the process for forming the second insulating film being performed before the process for forming the first insulating film.
16 . The semiconductor device manufacturing method according to claim 15 , wherein:
the process for forming the first insulating film includes a process for forming the first insulating film extending to the side of the second surface of the semiconductor layer; and
the first insulating film extending to the side of the second surface of the semiconductor layer is formed between the second insulating film and the electrode formed on the side of the second surface.
17 . The semiconductor device manufacturing method according to claim 15 , wherein the process for forming the first insulating film includes a process for forming the opening portion by an etching using a gas.
18 . An electronic device comprising a semiconductor device including:
a substrate;
a semiconductor layer formed on a side of a first surface of the substrate;
a first insulating film formed so as to cover the semiconductor layer on an opposite side of the substrate, having an opening portion, and containing silicon (Si);
an electrode formed in the opening portion of the first insulating film and on a side of a second surface of the semiconductor layer which faces a first direction parallel to the first surface of the substrate; and
a second insulating film formed between the second surface of the semiconductor layer and the electrode formed on the side of the second surface and containing a metal element.