Polyamide compositions with high heat performance

1 . A polyamide composition comprising:

from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide, the non-aromatic polyamide being a cycloaliphatic copolymer derived from 50 wt % to 90 wt % PA66 and from 10 wt % to 50 wt % cyclohexane diacid;

from 10-50 wt % of a second polyamide comprising a polyamide copolymer;

from 0.01-10 wt % of a first stabilizer comprising a lanthanum-based compound;

from 0.01-10 wt % of a second stabilizer comprising a copper-based compound;

and from 0-65 wt % filler,

wherein, when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an impact resistance of 28 KJ/m 2 or greater, as measured at 23° C.; or when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an increased impact resistance of 25% or more, as measured at 23° C., when compared to a similar polyamide composition that does not contain a lanthanum-based compound.

2 . The composition of claim 1 , wherein the cycloaliphatic copolymer contains from 60 wt % to 80 wt % PA66 and from 20 wt % to 40 wt % cyclohexane diacid.

3 . The composition of claim 1 , wherein the first polyamide is present in an amount ranging from 30 wt % to 45 wt %.

4 . The composition of claim 1 , wherein the polyamide of the second polyamide is an aliphatic copolymer.

5 . The composition of claim 1 , wherein the second polyamide comprises PA66/6.

6 . The composition of claim 5 , wherein the second polyamide is present in an amount ranging from 10 wt % to 20 wt %.

7 . The composition of claim 1 , wherein the lanthanum-based compound is a lanthanum-based heat stabilizer.

8 . The composition of claim 1 , wherein the lanthanum-based compound comprises a lanthanum ligand selected from the group consisting of acetates, hydrates, oxyhydrates, phosphates, bromides, chlorides, oxides, nitrides, borides, carbides, carbonates, ammonium nitrates, fluorides, nitrates, polyols, amines, phenolics, hydroxides, oxalates, oxyhalides, chromoates, sulfates, or aluminates, perchlorates, the monochalcogenides of sulphur, selenium and tellurium, carbonates, hydroxides, oxides, trifluoromethanesulphonates, acetylacetonates, alcoholates, 2-ethylhexanoates, or combinations thereof.

9 . The composition of claim 8 , wherein the lanthanum-based compound is lanthanum hydroxide.

10 . The composition of claim 1 , wherein the composition comprises at least one additional polyamide, and wherein the additional polyamide is PA66 and/or PA6.

11 . The composition of claim 10 , wherein the PA6 is present in an amount ranging from 1 wt % to 10 wt %.

12 . The composition of claim 1 , wherein the non-aromatic structure of the first polyamide crystallizes or co-crystallizes with the acids of the other polyamide(s).

13 . The polyamide composition of claim 1 , wherein the filler comprises a glass fiber, and wherein the glass fiber is present in an amount ranging from 25 wt % to 50 wt %.

14 . The polyamide composition of claim 1 , wherein the first stabilizer is present in an amount ranging from 0.1 wt % to 1 wt %.

15 . The polyamide composition of claim 1 , wherein the second stabilizer is present in an amount ranging from 1 wt % to 5 wt %.

16 . The polyamide composition of claim 1 , wherein the first stabilizer is present in an amount ranging from 0.1 wt % to 1 wt %, the second stabilizer is present in an amount ranging from 1 wt % to 5 wt %.

17 . The polyamide composition of claim 1 , wherein the polyamide composition, when heat aged for 3000 hours at a temperature of 210° C., demonstrates an impact resistance of 30 kJ/m 2 or greater, as measured at 23° C.

18 . The polyamide composition of claim 1 , wherein the polyamide composition, when heat aged for 3000 hours at a temperature of 210° C., demonstrates an increased impact resistance of 30% or more, as measured at 23° C., when compared to a similar polyamide composition that does not contain a lanthanum-based compound.

19 . The polyamide composition of claim 18 , wherein the polyamide composition, when heat aged for 3000 hours at a temperature of 210° C., demonstrates an increased impact resistance of 35% or more, as measured at 23° C., when compared to a similar polyamide composition that does not contain a lanthanum-based compound.

20 . An article for use in high temperature applications, wherein the article is formed from the polyamide composition of claim 1 , wherein the article is used for fasteners, circuit breakers, terminal blocks, connectors, automotive parts, furniture parts, appliance parts, cable ties, sports equipment, gun stocks, window thermal breaks, aerosol valves, food film packaging, automotive/vehicle parts, textiles, industrial fibers, carpeting, or electrical/electronic parts.

21 . A polyamide composition comprising:

from 25 wt % to 90 wt % of a first polyamide comprising PA66/6C;

from 10-50 wt % of a second polyamide comprising a polyamide copolymer;

from 0.01-10 wt % of a first stabilizer comprising a lanthanum-based compound;

from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and

from 0-65 wt % filler,

wherein, when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an impact resistance of 28 kJ/m 2 or greater, as measured at 23° C.; or when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an increased impact resistance of 25% or more, as measured at 23° C., when compared to a similar polyamide composition that does not contain a lanthanum-based compound.

22 . A polyamide composition comprising:

from 25 wt % to 90 wt % of a first polyamide, the first polyamide being a cycloaliphatic copolymer formed from PA66 and cyclohexane diacid;

from 10-50 wt % of a second polyamide, the second polyamide being a polyamide copolymer;

from 0.01-10 wt % of a first stabilizer comprising a lanthanum-based compound;

from 0.01-10 wt % of a second stabilizer comprising a copper-based compound;

and from 0-65 wt % filler.