IP Library Granted Patent US 11,837,682
Granted Patent B2
US 11,837,682 · App. 18/075,987 · Granted Dec 5, 2023

Semiconductor device

Inventor: Meng-Yang Chen (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/06H01L33/10H01L33/30H01L33/36H01L33/46H01L33/50
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Quick Facts
Patent No.
US 11,837,682
App. No.
18/075,987
Granted
Dec 5, 2023
Kind
B2
Abstract

A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure and a light-emitting structure. The light-emitting structure is located between the first semiconductor structure and the second semiconductor structure. The light-emitting structure includes a first multiple quantum well structure containing aluminum and a plurality of semiconductor stacks. Each of the semiconductor stacks is stacked by a well layer and a barrier layer. The light-emitting structure emits an incoherent light. The well layer and the barrier layer in each of the semiconductor stacks include the same quaternary semiconductor material which includes indium (In). The well layer has a first In content percentage larger than 0.53, and the barrier layer has a second In content percentage less than 0.53.

Claims (32)

1. A semiconductor device, comprising:

a first semiconductor structure;

a second semiconductor structure; and

a light-emitting structure located between the first semiconductor structure and the second semiconductor structure, and including a first multiple quantum well structure containing aluminum and a plurality of semiconductor stacks wherein each of the semiconductor stacks is stacked by a well layer and a barrier layer;

wherein the light-emitting structure emits an incoherent light, the well layer and the barrier layer in each of the semiconductor stacks comprise the same quaternary semiconductor material, the same quaternary semiconductor material comprises indium (In);

wherein the well layer has a first In content percentage larger than 0.53, and the barrier layer has a second In content percentage less than 0.53; and

wherein the first semiconductor structure has a first portion with a first width and a second portion with a second width, the second portion is closer to the light emitting structure than the first portion, and the first width is larger than the second width.

2. The semiconductor device of claim 1 , wherein the same quaternary semiconductor material further comprises aluminum.

3. The semiconductor device of claim 1 , wherein the well layer has a first Al content percentage, the barrier layer has a second Al content percentage, and a ratio of the second Al content percentage to the first Al content percentage is greater than 1.5.

4. The semiconductor device of claim 1 , wherein the first semiconductor structure comprises a first confinement layer, the second semiconductor structure comprises a second confinement layer, the first confinement layer and the second confinement layer are adjacent to the light emitting structure, and the first confinement layer and the second confinement layer have thicknesses larger than a thickness of the well layer or a thickness of the barrier layer.

5. The semiconductor device of claim 4 , wherein the thicknesses of the first confinement layer and the second confinement layer are respectively in the range of 10 nm to 50 nm.

6. The semiconductor device of claim 4 , wherein the first semiconductor structure further comprises a first cladding layer, and the first cladding layer has a thickness larger than the thickness of the first confinement layer.

7. The semiconductor device of claim 1 , further comprising a reflective structure under the first semiconductor structure.

8. The semiconductor device of claim 1 , wherein the light-emitting structure emits a radiation which is an infrared light having a peak wavelength in a range of 700 nm to 3000 nm, a red light having a peak wavelength in a range of 610 nm to 700 nm, or a yellow light having a peak wavelength in a range of 530 nm to 570 nm during an operation.

9. The semiconductor device of claim 1 , wherein the light-emitting structure further comprises a second multiple quantum well structure and an intermediate structure, and the intermediate structure is located between the first multiple quantum well structure and the second multiple quantum well structure.

10. The semiconductor device of claim 1 , wherein the first In content percentage is in a range of 0.55 to 0.95.

11. A semiconductor device, comprising:

a first semiconductor structure comprising a first cladding layer;

a second semiconductor structure; and

a light-emitting structure located between the first semiconductor structure and the second semiconductor structure, and including a first multiple quantum well structure containing a plurality of semiconductor stacks, wherein each of the semiconductor stacks is stacked by a well layer and a barrier layer;

wherein the well layer and the barrier layer in each of the semiconductor stacks comprise the same quaternary semiconductor material, the same quaternary semiconductor material comprises indium (In);

wherein the well layer has a first In content percentage larger than 0.53, and the barrier layer has a second In content percentage less than 0.53, and the first cladding layer comprises phosphorus (P); and

wherein the first semiconductor structure has a first portion with a first width and a second portion with a second width, the second portion is closer to the light emitting structure than the first portion, and the first width is larger than the second width.

12. The semiconductor device of claim 11 , wherein the same quaternary semiconductor material further comprises aluminum.

13. The semiconductor device of claim 11 , wherein the well layer has a first Al content percentage, the barrier layer has a second Al content percentage, and a ratio of the second Al content percentage to the first Al content percentage is greater than 1.5.

14. The semiconductor device of claim 11 , wherein the first semiconductor structure comprises a first confinement layer, the second semiconductor structure comprises a second confinement layer, the first confinement layer and the second confinement layer are adjacent to the light emitting structure, and the first confinement layer and the second confinement layer have thicknesses larger than a thickness of the well layer or a thickness of the barrier layer.

15. The semiconductor device of claim 14 , wherein the thicknesses of the first confinement layer and the second confinement layer are respectively in the range of 10 nm to 50 nm.

16. The semiconductor device of claim 14 , wherein the second semiconductor structure further comprises a second cladding layer adjacent to the second confinement layer, and the second cladding layer has a thickness larger than the thickness of the second confinement layer.

17. The semiconductor device of claim 11 , further comprising a reflective structure under the first semiconductor structure.

18. The semiconductor device of claim 11 , wherein the light-emitting structure emits a radiation which is an infrared light having a peak wavelength in a range of 700 nm to 3000 nm, a red light having a peak wavelength in a range of 610 nm to 700 nm, or a yellow light having a peak wavelength in a range of 530 nm to 570 nm during an operation.

19. The semiconductor device of claim 11 , wherein the light-emitting structure further comprises a second multiple quantum well structure and an intermediate structure, and the intermediate structure is located between the first multiple quantum well structure and the second multiple quantum well structure.

20. The semiconductor device of claim 11 , wherein the first In content percentage is in a range of 0.55 to 0.95.

Assignments (2)
CHANGE OF NAME Recorded Feb 26, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075152/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2022
From: CHEN, MENG-YANG
To: EPISTAR CORPORATION
Reel/Frame 062129/0919 →
Priority Claims (1)
TW 108130803 · Aug 28, 2019 · national
Continuity (3)
Continuation 16680183 · Nov 11, 2019
Provisional Application 62759973 · Nov 12, 2018
Related Publication 20230101241A1 · Mar 30, 2023