Methods and systems for coherent imaging and feedback control for modification of materials using dynamic optical path switch in the reference arms
Methods and systems are provided for using optical interferometry in the context of material modification processes such as surgical laser or welding applications. An imaging optical source that produces imaging light. A feedback controller controls at least one processing parameter of the material modification process based on an interferometry output generated using the imaging light. A method of processing interferograms is provided based on homodyne filtering. A method of generating a record of a material modification process using an interferometry output is provided.
1. An apparatus, comprising:
an optical imaging source that produces imaging light;
a laser head configured to focus a processing laser beam onto a sample in a material modification process, and direct the imaging light to the sample such that the imaging light illuminates multiple reflective features of the sample that are different axial heights, wherein the imaging light directed to the sample is delivered as an imaging beam with a diameter larger than the multiple reflective surfaces such that the imaging beam covers the multiple reflective surfaces;
an optical interferometer that produces an interferometry output based at least in part on imaging light that is reflected from the multiple reflective features, wherein the different axial heights correspond to multiple depths in the sample and the optical interferometer is configured to produce the interferometry output based on a single optical acquisition, wherein the optical interferometer includes a sample arm and a single reference arm and the interferometry output based on the single optical acquisition is produced by comparing a sample path length to a reference path length, and wherein at least a portion of the optical interferometer includes optical fiber; and
an interferogram processor that processes the interferometry output to determine a depth of at least one reflective feature of the multiple reflective features.
2. The apparatus of claim 1 , wherein the material modification process is a welding process and the processing laser beam is configured to generate a phase change region (PCR), and the at least one reflective feature comprises at least one of a keyhole depth, a keyhole sidewall, and a location of an interface between a liquid and solid region.
3. The apparatus of claim 1 , wherein the diameter of the imaging light directed to the sample is larger than a diameter of the processing laser beam.
4. The apparatus of claim 1 , wherein the imaging beam is delivered coaxially with the processing laser beam.
5. The apparatus of claim 1 , wherein the interferogram processor is configured to determine the depth of multiple reflective features.
6. The apparatus of claim 5 , wherein the multiple reflective features have different depths.
7. The apparatus of claim 1 , wherein the multiple reflective features include reflective features below a surface of the sample.
8. The apparatus of claim 1 , wherein the multiple reflective features are produced by the processing laser beam.
9. The apparatus of claim 1 , wherein at least one reflective feature of the multiple reflective features is a subsurface interface between materials having different indices of refraction, and the apparatus further comprises a feedback controller configured to control at least one of the processing laser beam and a processing laser source that generates the processing laser beam based on the subsurface interface.